Meta-optics Integrated on VCSELs

1 . A light emitting element comprising a meta-surface, wherein the meta-surface comprises a semiconductor alloy of a first semiconductor and a second semiconductor, wherein a composition defines relative amounts of the first semiconductor and the second semiconductor in the alloy, and wherein the semiconductor alloy has a first composition.

2 . A light emitting element according to claim 1 , wherein the first semiconductor is one of Germanium (Ge), Silicon (Si), Tin (Sn), Germanium Silicon (GeSi), Germanium Tin (GeSn), Silicon Tin (SiSn), Selenium (Se), Lead (Pb), Tellurium (Te), Lead Telluride (PbTe), Lead Selenide (Pb Se), Tellurium Selenide (TeSe), or Gallium Arsenide (GaAs), and wherein the second semiconductor is another of Germanium (Ge), Silicon (Si), Tin (Sn), Germanium Silicon (GeSi), Germanium Tin (GeSn), Silicon Tin (SiSn), Selenium (Se), Lead (Pb), Tellurium (Te), Lead Telluride (PbTe), Lead Selenide (Pb Se), Tellurium Selenide (TeSe), or Gallium Arsenide (GaAs), the second semiconductor being different from the first semiconductor.

3 . A light emitting element according to claim 1 , wherein the semiconductor alloy comprises a third semiconductor and the first composition defines the relative amounts of the first semiconductor, second semiconductor and third semi-conductor in the alloy.

4 . A light emitting element according to claim 3 , wherein the third semiconductor is one of Germanium (Ge), Silicon (Si), Tin (Sn), Germanium Silicon (GeSi), Germanium Tin (GeSn), Silicon Tin (SiSn), Selenium (Se), Lead (Pb), Tellurium (Te), Lead Telluride (PbTe), Lead Selenide (Pb Se), Tellurium Selenide (TeSe), or Gallium Arsenide (GaAs), and wherein the third semiconductor is different from the first semiconductor and the second semiconductor.

5 . A light emitting element according to claim 1 , comprising a vertical cavity surface emitting laser.

6 . A light emitting element according to claim 1 , wherein the metasurface is disposed on a light emitting surface of the light emitting element.

7 . A light emitting array comprising a plurality of light emitting elements according to claim 1 .

8 . A light emitting array according to claim 7 ,

comprising a first light emitting element and at least one second light emitting element having a second composition different from the first composition.

9 . A light emitting array according to claim 8 , comprising a plurality of regions, wherein each region comprises light emitting elements with metasurfaces with a single composition, wherein the composition in each region is difference to compositions in other regions.

10 . A light emitting array according to claim 9 , wherein the regions are configured to provide structured illumination onto a pre-defined scene.

11 . A method of manufacturing a light emitting element with a meta-surface, the method comprising the steps of:

using chemical vapour deposition to apply a layer of semiconductor alloy, wherein the semiconductor alloy comprises a first semiconductor and a second semiconductor, and wherein a composition defines relative amounts of the first semiconductor and the second semiconductor in the alloy, and wherein the semiconductor alloy has a first composition; and

fabricating a meta-surface in the alloy.

12 . A method according to claim 11 , wherein the metasurface is fabricated on a light emitting surface of the light emitting element.

13 . A method according to claim 11 , further comprising manufacturing a light emitting array comprising a plurality of light emitting elements, each light emitting element comprising a meta-surface, the method further comprising:

prior to the step of using chemical vapour deposition to apply a layer of semiconductor alloy, masking one or more light emitting element in the array;

after using chemical vapour deposition to apply the layer of semiconductor alloy, unmasking the masked one or more light emitting elements;

masking one or more of previous unmasked light emitting element in the array; and

applying a second semiconductor alloy with a second composition different from the first composition;

unmasking the masked light emitting elements; and

fabricating a meta-surface in the alloy.

14 . A method according to claim 13 , further comprising dividing the light emitting array into a plurality of regions, selecting for each region a semiconductor alloy with a composition, wherein each region is assigned a semiconductor alloy comprising a composition different from every other region; and

for each region:

masking light emitting elements which are not in the region;

using chemical vapour deposition to apply the layer of semiconductor alloy to light emitting elements in the region;

unmasking the elements not in the region; and

fabricating meta-surfaces in the alloy.

15 . A method according to claim 11 , wherein the first semiconductor is one of Germanium (Ge), Silicon (Si), Tin (Sn), Germanium Silicon (GeSi), Germanium Tin (GeSn), Silicon Tin (SiSn), Selenium (Se), Lead (Pb), Tellurium (Te), Lead Telluride (PbTe), Lead Selenide (PbSe), Tellurium Selenide (TeSe), or Gallium Arsenide (GaAs), and wherein the second semiconductor is another of Germanium (Ge), Silicon (Si), Tin (Sn), Germanium Silicon (GeSi), Germanium Tin (GeSn), Silicon Tin (SiSn), Selenium (Se), Lead (Pb), Tellurium (Te), Lead Telluride (PbTe), Lead Selenide (Pb Se), Tellurium Selenide (TeSe), or Gallium Arsenide (GaAs), the second semiconductor being different from the first semiconductor.

16 . A method according to claim 11 , wherein the semiconductor alloy comprises a third semiconductor, wherein the third semiconductor is one of Germanium (Ge), Silicon (Si), Tin (Sn), Germanium Silicon (GeSi), Germanium Tin (GeSn), Silicon Tin (SiSn), Selenium (Se), Lead (Pb), Tellurium (Te), Lead Telluride (PbTe), Lead Selenide (Pb Se), Tellurium Selenide (TeSe), or Gallium Arsenide (GaAs), and wherein the third semiconductor is different from the first semiconductor and the second semiconductor.

17 . A method according to claim 11 , wherein chemical vapour deposition is performed using one of Metal Organic Chemical Vapour Deposition (MOCVD) or Plasma Enhanced Chemical Vapour Deposition (PECVD).