PRINTED CIRCUIT BOARD GROUNDING
Various configurations of a grounding element or conductive element for a printed circuit board (PCB), as well as a process for manufacturing, are disclosed. For example, a PCB can include a solder grounding element connecting a copper track to a metal substrate, where the solder grounding element is applied via ultrasonic soldering during a manufacturing process. In another example, a PCB can include a spring pin grounding element connecting a copper track to a metal substrate. In yet another example, a PCB can include an auto splice grounding element connecting a copper track to a metal substrate. In yet another example, a PCB can include a press fit pin grounding element connecting a copper track to a metal substrate. In yet another example, a PCB can include a clip pin grounding element connecting a copper track to a metal substrate.
1 . A printed circuit board comprising:
a first layer including a first circuit trace;
a second layer adjacent to the first layer, the second layer including a dielectric material;
a third layer adjacent to the second layer opposite the first layer, the third layer including a metal substrate; and
a grounding element connecting the first circuit trace and the metal substrate, the grounding element including solder applied via ultrasonic soldering.
2 . The printed circuit board of claim 1 further comprising:
a fourth layer including a second circuit trace;
a fifth layer including a dielectric material; and
the grounding element connecting the second circuit trace and the metal substrate.
3 . The printed circuit board of claim 1 further comprising the metal substrate is aluminum.
4 . The printed circuit board of claim 1 further comprising the metal substrate is copper.
5 . The printed circuit board of claim 1 further comprising an electrical surface mounted component connected to the first circuit trace.
6 . The printed circuit board of claim 1 further comprising the first circuit trace is copper.
7 . The printed circuit board of claim 1 further comprising the solder is applied on an outer edge of the printed circuit board.
8 . The printed circuit board of claim 1 further comprising the solder is applied within a through hole of the printed circuit board.
9 . A circuit comprising:
a printed circuit board including:
a first layer including a first track;
a second layer including a dielectric material;
a third layer including a metal substrate;
the second layer located between the first layer and the third layer; and
a conductive element connecting the first track and the metal substrate, the conductive element including solder applied via ultrasonic soldering.
10 . The circuit of claim 9 further comprising:
a fourth layer including a second track;
a fifth layer including a dielectric material; and
the conductive element connecting the second track and the metal substrate.
11 . The circuit of claim 9 further comprising the metal substrate is copper.
12 . The circuit of claim 9 further comprising the metal substrate is aluminum.
13 . The circuit of claim 12 further comprising an electrical surface mounted component connected to the conductive track.
14 . The circuit of claim 12 further comprising the conductive track is copper.
15 . The circuit of claim 14 further comprising the solder is applied on an outer edge of the printed circuit board.
16 . The circuit of claim 14 further comprising the solder is applied within a through hole of the printed circuit board.
17 . A method comprising:
receiving a printed circuit board (PCB) having a first layer including a conductive track, a second layer including a dielectric material, a third layer including a metal substrate, the second layer located between the first layer and the third layer; and
applying solder via ultrasonic soldering to the PCB to create a grounding element.
18 . The method of claim 17 further comprising the solder is applied without use of a flux material.
19 . The method of claim 17 further comprising the conductive track includes copper and the metal substrate includes aluminum.
20 . The method of claim 19 further comprising applying the solder on an outer edge of the PCB.