COMPOSITE FILMS FOR MOBILE ELECTRONIC DEVICE COMPONENTS
The present disclosure relates to a composite film made of at least one fluoropolymer and a fiber fabric, presenting a thickness of less than 0.10 mm, as well as articles comprising such composite films, exhibiting low dielectric constant and dissipation factors and being suitable for mobile electronic device components, for example flexible printed circuit board (FPC).
1 . A composite film with a thickness of less than 0.10 mm, comprising:
at least one fluoropolymer comprising recurring units derived from tetrafluoroethylene, Polymer (FP), and
at least one fiber fabric, fiber fabric (F).
2 . The composite film of claim 1 , wherein Polymer (FP) further comprises recurring units derived from at least one fluorinated monomer different from tetrafluoroethylene selected from the group consisting of:
perfluoroalkylvinylethers of formula CF 2 ═CFOR f wherein R f is a C1-C6 perfluoroalkyl group;
perfluoro-oxyalkylvinylethers of formula CF 2 ═CFOX 0 wherein X 0 is a C1-C12 perfluorooxyalkyl group comprising one or more ether groups;
C3-C8 perfluoroolefins; and
perfluorodioxoles of formula (I):
wherein R 1 , R 2 , R 3 and R 4 , equal to or different from each other, are independently selected from the group consisting of—F, a C1-C6 fluoroalkyl group, optionally comprising one or more oxygen atoms, and a C1-C6 fluoroalkoxy group, optionally comprising one or more oxygen atoms recurring units derived from tetrafluoroethylene and less than 10 mol. % of recurring units derived from at least one fluorinated monomer different from tetrafluoroethylene, based on the total number of moles in Polymer (FP).
3 . The composite film of claim 1 , wherein Polymer (FP) is a tetrafluoroethylene/perfluoroalkylvinylether copolymer comprising:
3.0 to 6.0 mol. % of recurring units derived from a perfluoroalkylvinylether selected from the group consisting of perfluoromethylvinylether, perfluoroethylvinylether and perfluoroproylvinylether, and
from 94.0 to 97.0 mol. % of recurring units derived from tetrafluoroethylene, based on the total number of moles in Polymer (FP).
4 . The composite film of claim 1 , wherein Polymer (FP) is a per(halo)fluoropolymer having at least 98 mol. % of recurring units derived from tetrafluoroethylene, based on the total number of moles in Polymer (FP).
5 . The composite film of claim 1 , wherein fiber fabric (F) comprises glass fibers.
6 . The composite film of claim 5 wherein the glass fibers are selected from fibers comprising:
i) silicon oxide, 35.0 parts by mass to 48.0 parts by mass; alumina, 1.0 parts by mass to 5.0 parts by mass; titanium oxide 5.5 parts by mass to 10.0 parts by mass; zirconium oxide, 0.5 parts by mass to 4.0 parts by mass; holmium oxide, less than or equal to 3.0 parts by mass; alkaline earth metal oxides, 32.0 parts by mass to 47.5 parts by mass, with respect to the total mass of the fiber; or
ii) silicon oxide, 33.0 parts by mass to 46.0 parts by mass; alumina, 1.5 parts by mass to 5.0 parts by mass; titanium oxide, 5.0 parts by mass to 10.0 parts by mass; zirconium oxide, 0.5 parts by mass to 4.0 parts by mass; neodymium oxide, less than or equal to 2.5 parts by mass; iron oxide, less than or equal to 1.2 parts by mass; alkaline earth metal oxide, 31.0 parts by mass to 53.0 parts by mass, with respect to the total mass of the fiber.
7 . The composite film of claim 5 , wherein the glass fiber fabric (F) comprising glass fibers is characterized by dielectric constant D k at 1 GHZ, measured using a transmission line method and a vector network analyzer, of less than 5.5 and a dissipation factor D f at 1 GHz, measured using a transmission line method and a vector network analyzer, of less than 0.0030.
8 . The composite film of claim 1 , wherein the fiber fabric (F) comprises a woven fabric.
9 . The composite film of claim 1 , wherein the fiber fabric (F) has an average area weight comprised between 10 and 100 g/m 2 .
10 . The composite film of claim 1 , wherein the film has:
a dielectric constant Dk at 5 GHz equal to or less than 3.5, as measured by Split Post Dielectric Resonator (SPDR), IEC 61189-2-721:2015 after drying 1 h at 100° C., and/or
a dissipation factor Df at 5 GHz of less than 0.0050, as measured by Split Post Dielectric Resonator (SPDR), IEC 61189-2-721:2015 after drying 1 h at 100° C.
11 . The composite film of claim 1 , wherein the film has:
a dielectric constant Dk at 20 GHz of less than 3.0, as measured by Split Cylinder Resonator, IPC TM-650 2.5.5.13 after drying 1 h at 100° C., and/or
a dissipation factor Df at 20 GHz of less than 0.0100, as measured by Split Cylinder Resonator, IPC TM-650 2.5.5.13 after drying 1 h at 100° C.
12 . The composite film of claim 1 , wherein the film has:
a dielectric constant Dk at 20 GHz of less than 3.0, as measured by Split Cylinder Resonator, IPC TM-650 2.5.5.13 after immersion in water for 24 hours, and/or
a dissipation factor Df at 20 GHz of less than 0.0300, as measured by Split Cylinder Resonator, IPC TM-650 2.5.5.13 after immersion in water for 24 hours.
13 . The composite film of claim 1 , wherein the film has:
a Dk 50 GHz of less than 3.0; and/or
a Df 50 GHz of less than 0.0030,
wherein the Dk is measured by Split Cylinder Resonator, IPC TM-650 2.5.5.13 after drying 1 h at 100° C. and the Df is measured by Split Post Dielectric Resonator (SPDR), IEC 61189-2-721:2015 after drying 1 h at 100° C.
14 . The composite film of claim 1 , wherein the film has:
a Dk 75 GHz of less than 3.0; and/or
a Df 75 GHz of less than 0.0030,
wherein the Dk is measured by Split Cylinder Resonator, IPC TM-650 2.5.5.13 after drying 1 h at 100° C. and the Df is measured by Split Post Dielectric Resonator (SPDR), IEC 61189-2-721:2015 after drying 1 h at 100° C.
15 . (canceled)
16 . A method for preparing the composite film of claim 1 , the method comprising the step of applying a polymer powder comprising at least one Polymer (FP) to at least one surface of a fiber fabric (F).
17 . The method of claim 16 , comprising the steps of:
a) applying a polymer powder comprising at least one Polymer (FP) to at least one surface of a fiber fabric, wherein the powder comprising at least one Polymer (FP) is such that it has a d 50 comprised between 0.1 and 100 μm, and
b) bonding the powder of the at least one Polymer (FP) to the fiber fabric by applying a pressure P of at least 0.3 MPa and/or a temperature T such that T≥Tm, wherein Tm is the melting temperature of the polymer powder (° C.).
18 . (canceled)
19 . (canceled)
20 . The method of claim 16 , wherein the fiber fabric (F) is characterized by dielectric constant D k at 1 GHz, measured using a transmission line method and a vector network analyzer, of less than 5.5 and a dissipation factor D f at 1 GHz, measured using a transmission line method and a vector network analyzer, of less than 0.0030.
21 . An article or component of an article, comprising at least one composite film according to claim 1 , and optionally a metal layer, adhered onto at least one surface of the composite film.
22 . A method comprising preparing a mobile electronic device article or component thereof using at least one composite film according to claim 1 .
23 . A method comprising preparing a composite film from a powder comprising at least one Polymer (FP the composite film having a thickness of less than 0.10 mm, said Polymer (FP) comprising recurring units derived from tetrafluoroethylene (TFE) and said composite film further comprising at least one fiber fabric (F).