SUBSTRATE AND PACKAGE SUBSTRATE COMPRISING THE SAME

1 . A substrate, comprising:

a glass substrate comprising a first surface, a second surface, and an edge area configured to connect the first surface and the second surface; and

a protecting device,

wherein the protecting device is disposed on at least a portion of the edge area, and

wherein the protecting device has a minimum thickness of 5 μm or more.

2 . The substrate of claim 1 , further comprising:

a groove part that penetrates the first surface and the second surface toward an inner portion of the glass substrate, and

wherein the protecting device is disposed at the groove part.

3 . The substrate of claim 1 , wherein at least one of the first surface and the second surface of the glass substrate is configured to have a shape of quadrangle to octagon,

wherein the glass substrate comprises a through via that penetrates from the first surface to the second surface, and

wherein the glass substrate comprises at least one of an electrically conductive wire and an electrically conductive layer in at least a portion of the glass substrate.

4 . The substrate of claim 1 , wherein:

the protecting device comprises a first protecting device and a second protecting device which are distinct from each other,

the first protecting device is disposed in an edge area in contact with a first side of the first surface,

the second protecting device is disposed in an edge area in contact with a second side of the first surface, and

the first side and the second side are disposed to face each other.

5 . The substrate of claim 2 , wherein the groove part comprises a first groove part and a second groove part which are distinct from each other, and

wherein the first groove part and the second groove part are disposed to face each other with the first surface therebetween.

6 . The substrate of claim 1 , wherein the protecting device comprises a polymer layer whose total transmittance is equal to or greater than 87%.

7 . The substrate of claim 6 , wherein the polymer layer is an elastic layer, and wherein the protecting device and the glass substrate are configured to have an adhesive strength of 5 B according to ASTM D3359.

8 . The substrate of claim 2 , wherein damage of the glass substate of the substrate is not substantial when impact with a pressure of approximately 1.1 bar is added three times to the protecting device to be directly contacted with a pin having a section that corresponds with a section of the groove part.

9 . The substrate of claim 2 , wherein damage of the glass substrate of the substrate is not substantial when impact with a pressure of approximately 1.1 bar is added fifty times to the protecting device to be directly contacted with a pin having a section that corresponds with a section of the groove part.

10 . The substrate of claim 2 , wherein the groove part has a shape that corresponds to any one of a circle, and an oval, and

wherein a distance from a first point of the groove part to the edge area is 1 mm to 15 mm.

11 . The substrate of claim 2 , wherein the protecting device is configured to have a pencil hardness of HB or greater according to ASTM D3363.

12 . The substrate of claim 6 , wherein the polymer layer comprises an ultraviolet (UV) cured resin.

13 . The substrate of claim 1 , wherein the glass substrate comprises a cavity unit disposed in a portion of the glass substrate, and

wherein a thickness between a first surface of the cavity unit and a second surface of the cavity unit is thinner than a thickness between the first surface of the glass substrate and the second surface of the glass substrate.

14 . The substrate of claim 1 , wherein the glass substrate comprises an upper redistribution layer on the first surface, and

a lower redistribution layer under the second surface.

15 . A semiconductor substrate, comprising:

the substrate according to claim 1 , and

a semiconductor element mounted on the substrate.