MULTILAYER CERAMIC CAPACITORS (MLCC) ARRAY AND INTEGRATION WITH ACTIVE DEVICES
Packages and methods for fabricating a module with reduced area, including forming a resin-based substrate by forming a resin on a plurality of multilayer ceramic capacitors (MLCCs). Packages and methods for fabricating a module with reduced area include forming a MLCC-based substrate by forming a resin on a plurality of MLCCs, wherein each MLCC of the plurality of MLCCs directly contacts another MLCC.
1 . A method comprising:
forming a MLCC-based substrate by forming a resin on a plurality of multilayer ceramic capacitors (MLCCs), wherein each MLCC of the plurality of MLCCs directly contacts another MLCC;
forming a redistribution layer (RDL) in an insulating layer on the MLCC-based substrate;
coupling an integrated circuit (IC) to the MLCC-based substrate.
2 . The method of claim 1 , wherein the resin comprises an epoxy.
3 . The method of claim 1 , wherein the insulating layer comprises a polyimide or an oxide.
4 . The method of claim 1 , wherein at least two MLCCs of the plurality of MLCCs are electrically coupled to each other.
5 . The method of claim 1 , wherein the plurality of MLCCs have a same voltage rating.
6 . The method of claim 1 , further comprising forming at least one pad on the RDL.
7 . The method of claim 6 , wherein the IC is coupled to the MLCC-based substrate by at least one solder bump or copper pillar on the at least one pad.
8 . The method of claim 6 , wherein the RDL comprises a first passivation layer and the at least one pad is on the first passivation layer.
9 . The method of claim 8 , wherein the RDL comprises a second passivation layer and the at least one pad is between the first passivation layer and the second passivation layer.
10 . The method of claim 1 , wherein the IC is electrically coupled to at least one MLCC of the plurality of MLCCs.
11 . The method of claim 1 , wherein coupling the IC to the MLCC-based substrate comprises thermo-compression bonding.
12 . The method of claim 1 , wherein coupling the IC to the MLCC-based substrate comprises hybrid bonding.
13 . The method of claim 12 , wherein the hybrid bonding is between at least one plug of the IC and at least one plug embedded in the insulating layer.
14 . The method of claim 1 , wherein coupling the IC to the MLCC-based substrate comprises connecting the IC to the MLCC-based substrate with a wire.
15 . The method of claim 1 , further comprising grinding the IC to 50 μm.
16 . The method of claim 1 , further comprising forming a bump on a side of the MLCC-based substrate that is opposite to a side of the RDL.
17 . The method of claim 16 , further comprising coupling the MLCC-based substrate to a printed circuit board (PCB) by the bump.
18 . The method of claim 1 , further comprising coupling the MLCC-based substrate to a printed circuit board (PCB) by a wire.
19 . The method of claim 1 , comprising forming an underfill between the IC and the MLCC-based substrate.
20 . The method of claim 1 , wherein the IC is configured to transfer heat directly to a heat sink.
21 . The method of claim 1 , further comprising cutting the MLCC-based substrate.
22 . A package comprising:
a MLCC-based substrate comprising a plurality of multilayer ceramic capacitors (MLCCs) embedded in a resin, wherein each MLCC of the plurality of MLCCs directly contacts another MLCC;
forming a redistribution layer (RDL) in an insulating layer on the MLCC-based substrate;
an integrated circuit (IC) coupled to the MLCC-based substrate.