MICROFLUIDIC APPARATUS HAVING AN OPTIMIZED ELECTROWETTING SURFACE AND RELATED SYSTEMS AND METHODS
Microfluidic devices having an electrowetting configuration and an optimized droplet actuation surface are provided. The devices include a conductive substrate having a dielectric layer, a hydrophobic layer covalently bonded to the dielectric layer, and a first electrode electrically coupled to the dielectric layer and configured to be connected to a voltage source. The microfluidic devices also include a second electrode, optionally included in a cover, configured to be connected to the voltage source. The hydrophobic layer features self-associating molecules covalently bonded to a surface of the dielectric layer in a manner that produces a densely-packed monolayer that resists intercalation and or penetration by polar molecules or species. Also provided are microfluidic devices having an electrowetting configuration that further include a section or module having a dielectrophoresis configuration; systems that include any of the microfluidic devices in combination with an aqueous droplet and a fluidic medium immiscible with the medium of the aqueous droplet; related kits; and methods of manipulating droplets, optionally containing micro-objects such as biological cells, within the microfluidic devices.
1 . (canceled)
2 . A microfluidic apparatus comprising:
a conductive silicon substrate having a dielectric stack and at least one electrode configured to be connected to a voltage source;
a cover having at least one electrode configured to be connected to a voltage source; and
at least one spacing element,
wherein the conductive silicon substrate and the cover are substantially parallel to one another and joined together by the spacing element so as to define an enclosure configured to hold a liquid,
wherein the conductive silicon substrate has an inward-facing surface that defines, in part, the enclosure, the inward-facing surface comprising the outermost surface of the dielectric stack, and
wherein, when the at least one electrode of the substrate and the at least one electrode of the cover are connected to opposing terminals of an AC voltage source, the substrate is capable of applying an electrowetting force to aqueous droplets in contact with the inward-facing surface of the substrate.
3 . The microfluidic apparatus of claim 2 , wherein the conductive silicon substrate comprises amorphous silicon.
4 . The microfluidic apparatus of claim 2 wherein the conductive silicon substrate comprises a phototransistor array.
5 . The microfluidic apparatus of claim 2 wherein the conductive silicon substrate comprises an array of electrodes.
6 . The microfluidic apparatus of claim 2 , wherein the inward-facing surface of the conductive silicon substrate further comprises an outer hydrophobic layer, the outer hydrophobic layer comprising self-associating molecules covalently bonded to the inner dielectric stack.
7 . The microfluidic apparatus of claim 2 , wherein the inner dielectric stack comprises a first layer of dielectric material and a second layer of dielectric material.
8 . The microfluidic apparatus of claim 7 , wherein the first layer of dielectric material has a first surface and an opposing surface, wherein the first surface of the first layer adjoins the second layer, and wherein the opposing surface of the first layer forms the outermost surface of the dielectric stack.
9 . The microfluidic apparatus of claim 7 , wherein the first layer of dielectric material comprises a metal oxide.
10 . The microfluidic apparatus of claim 9 , wherein the first layer of dielectric material comprises aluminum oxide or hafnium oxide.
11 . The microfluidic apparatus of claim 7 , wherein the second layer of dielectric material comprises an oxide or a nitride.
12 . The microfluidic apparatus of claim 11 , wherein the second layer of dielectric material comprises silicon oxide or silicon nitride.
13 . The microfluidic apparatus of claim 7 , wherein the second layer is deposited by a Plasma Enhanced Chemical Vapor Deposition (PECVD) technique.
14 . The microfluidic apparatus of claim 7 , wherein the first layer is deposited by an Atomic Layer Deposition (ALD) technique.
15 . The microfluidic apparatus of claim 7 , wherein the inner dielectric stack comprises a third layer having a first surface and an opposing surface, wherein the first surface of the third layer adjoins the opposing surface of the first layer, and wherein the opposing surface of the third layer forms the outermost surface of the dielectric stack.
16 . The microfluidic apparatus of claim 15 , wherein the third layer comprises silicon oxide.
17 . The microfluidic apparatus of claim 15 , wherein the third layer is deposited by an Atomic Layer Deposition (ALD) technique.
18 . The microfluidic apparatus claim 2 , wherein the apparatus comprises:
a dielectrophoresis module to perform a first microfluidic operation in response to a first applied voltage at a first frequency; and
an electrowetting module to receive an output from the dielectrophoresis module, and to perform a second microfluidic operation in response to a second applied voltage at a second frequency,
wherein the electrowetting module comprises the dielectric stack of the conductive silicon substrate.
19 . The microfluidic apparatus of claim 18 , further comprising a bridge between the first module and the second module.
20 . The microfluidic apparatus of claim 19 , wherein the bridge does not perform the first or second microfluidic operation.
21 . The microfluidic apparatus of claim 19 , wherein the bridge is an electrically neutral zone.