Housing construction for snap-in retention
View Patent ↗Introduced here is an attachable unit that connects to a base unit through a snap-fitting mechanism. The attachable unit can include a top housing structure and a bottom housing structure that are ultrasonically welded together. The top housing structure can include the toe portion that is integral with remaining portions of the top housing structure, where the toe portion is configured to provide the snap-fit with the base unit.
1. A wearable glucose monitoring device comprising:
a base unit having a shaped top surface and a fitting tab and configured to attach to a body of a user; and
an attachable unit configured to fit with the shaped top surface, wherein the attachable unit includes:
a bottom housing structure adapted to fit over the top surface,
a top housing structure attached to the bottom housing structure, wherein the top housing structure (1) includes an integral toe portion configured to directly contact the fitting tab when the attachable unit is fitted over the top surface and (2) is adapted to fit over the bottom housing structure when the attachable unit is fitted over the top surface, and
circuitry configured to track glucose levels of the user.
2. The electronic device of claim 1 , wherein the circuitry includes a processor, a memory, a transmitter, or a combination thereof for communicating the tracked glucose levels with an external device.
3. The electronic device of claim 1 , wherein the top housing structure is ultrasonically welded to the bottom housing structure.
4. The electronic device of claim 3 , wherein the top housing structure includes:
a bottom surface having a center portion; and
an energy director integral with the bottom surface and located between the integral toe portion and the center portion, wherein the energy director corresponds to an ultrasonic welding process that attaches the top housing structure and the bottom housing structure.
5. The electronic device of claim 4 , wherein:
the energy director comprises a support director; and
the top housing structure includes a primary director configured to melt before the support director during the ultrasonic welding process, wherein the support director is located between the primary director and the integral toe portion, located below the primary director, or a combination thereof.
6. The electronic device of claim 4 , wherein the energy director is configured to provide a mechanical fit and/or an alignment between the bottom housing structure and the top housing structure before and/or during the ultrasonic welding process.
7. The electronic device of claim 1 , wherein:
the base unit is configured to direct forces applied from the body of the user to the fitting tab; and
the attachable unit includes one or more locations attaching the bottom housing structure and the top housing structure, the attachment locations configured to be compressed as a result of forces received at the integral toe portion through the fitting tab when the attachable unit is fitted over the depression.
8. The electronic device of claim 7 , wherein:
the one or more weld spots are located within a threshold distance from the integral toe portion, wherein the threshold distance is less than half of a corresponding lateral dimension of the attachable unit; and
the integral toe portion is configured to receive a downward force from the fitting tab and direct the downward force to compress the one or more weld spots.
9. The electronic device of claim 1 , wherein:
the fitting tab includes a locking portion integral with and extending away from the top surface;
the integral toe portion is located below and directly contacts the fitting tab when the attachable unit is fitted over the top surface, wherein the integral toe portion and the locking portion are structurally configured to interlock with each other when the attachable unit is fitted over the depression;
the base unit further includes an anchoring point configured to interlock with the attachable unit at a location laterally opposite the fitting tab to provide a cantilever type snap-fit with the attachable unit.
10. A wearable device comprising:
a bottom housing structure structurally adapted to fit over a base unit that interfaces with a user's body;
a top housing structure attached to the bottom housing structure, wherein the top housing structure includes an integral toe portion configured to directly contact the base unit when the attached combination of the top and bottom housing structures is placed over the base unit; and
circuitry configured to generate data regarding the user's body.
11. The electronic device of claim 10 , further comprising:
the base unit including (1) a top surface forming having a shape and (2) a fitting tab integral with and at least partially extending across the top surface, wherein
the attached combination of the top and bottom housing structures comprises an attachable unit configured to fit with the shape and connect to the base unit; and
the fitting tab is configured to interlock with the integral toe portion of the top housing structure when the attachable unit is placed over the base unit.
12. The electronic device of claim 10 , wherein the circuitry includes a processor, a memory, a transmitter, or a combination thereof for communicating the data with an external device, wherein the data includes tracked glucose levels of the user.
13. The electronic device of claim 10 , wherein the integral toe portion is structurally configured to directly contact and interlock with a corresponding portion in the base unit when the device is over the base unit.
14. The electronic device of claim 10 , wherein the top housing structure is ultrasonically welded to the bottom housing structure.
15. The electronic device of claim 14 , wherein the top housing structure includes:
a bottom surface having a center portion; and
an energy director integral with the bottom surface and located between the integral toe portion and the center portion, wherein the energy director corresponds to an ultrasonic welding process that attaches the top housing structure and the bottom housing structure.
16. The electronic device of claim 15 , wherein:
the energy director comprises a support director; and
the top housing structure includes a primary director configured to melt before the support director during the ultrasonic welding process, wherein the support director is located between the primary director and the integral toe portion, located below the primary director, or a combination thereof.
17. The electronic device of claim 15 , wherein the energy director is configured to provide a mechanical fit and/or an alignment between the bottom housing structure and the top housing structure before and/or during the ultrasonic welding process.
18. The electronic device of claim 10 , wherein the top and bottom housing structures are attached to each other at one or more attachment spots that are configured to be compressed as a result of forces applied by the integral toe portion when the attachable unit is placed over the base unit.
19. The electronic device of claim 18 , wherein:
the one or more attachment spots are located within a threshold distance from the integral toe portion, wherein the threshold distance is less than half of a corresponding lateral dimension of the attachable unit; and
the integral toe portion is configured to receive a downward force from the base unit and direct the downward force to compress the one or more attachment spots.
20. A wearable device comprising:
a base unit including a top surface, and an integral fitting tab, wherein the base unit is configured to attach to a body of a user; and
an attachable unit structurally configured to (1) fit over the top surface and (2) connect to the base unit, the attachable unit including:
a bottom housing structure structurally adapted to fit over the top surface of the base unit, and
a top housing structure attached to the bottom housing structure, wherein the top housing structure includes an integral toe portion configured to directly contact and interlock with the fitting tab when the base unit is placed over the top surface.