IP Library Patent Application 18624628
Patent Application
App. No. 18/624,628

ISOTOPIC POLYMER, COMPOSITION AND CHIP DEVICE CONTAINING THE SAME

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Quick Facts
Patent No.
US None
App. No.
18/624,628
Abstract

An isotopic polymer includes a silicone resin, an aromatic polymer, a modified silicone resin, a halogenated polysilane, an epoxy resin, or a combination thereof, wherein at least part of 12 C, 1 H and/or 16 O in the isotopic polymer is replaced with 14 C, 3 H and/or 15 O. The decaying age of the isotopic polymer is less than 50,000 years.

Claims (87)

1 . An isotopic polymer comprising a silicone resin, an aromatic polymer, a modified silicone resin, a halogenated polysilane, an epoxy resin, or a combination thereof, wherein at least part of 12 C, 1 H and/or 16 O in the isotopic polymer is replaced with 14 C, 3 H and/or 15 O, and a decaying age of the isotopic polymer is less than 50,000 years.

2 . The isotopic polymer as claimed in claim 1 , wherein the isotopic polymer is formed by polymerizing at least one isotopic monomer having a main structure represented by one of the following Formulae 1 to 7:

wherein R 1 is a C 1 -C 30 alkyl group, a C 2 -C 30 alkenyl group, or a C 2 -C 30 alkynyl group;

R 2 is OH, a C 1 -C 30 alkyl group, an amine group, a C 1 -C 30 alkyl group substituted with an amine group, or a C 2 -C 30 alkenyl group;

a is an integer selected from 1 to 4;

R 4 is a phenyl group, a phenyl group substituted with a C 1 -C 30 alkyl group, or a C 1 -C 30 alkyl group;

R 5 is —COOCH 2 — or a C 1 -C 30 alkylene group;

R 6 is a C 1 -C 30 alkyl group;

R 7 is a C 1 -C 20 alkylene group;

R 8 is a nitrogen-containing linking group or a C 1 -C 20 alkylene group;

R 9 is a sulfur-containing linking group or a C 1 -C 20 alkylene group;

R 10 is a C 1 -C 20 alkylene group;

R 11 is an oxy group, a sulfur-containing linking group, or a C 1 -C 20 alkylene group,

wherein at least one R 2 is selected from a C 2 -C 20 alkenyl group, and R 2 is the same as or different from each other when a is greater than or equal to 2, and

at least part of 12 C, 1 H and/or 16 O in the main structure of the isotopic polymer is replaced with 14 C, 3 H and/or 15 O.

3 . The isotopic polymer as claimed in claim 2 , comprising at least one isotopic repeating unit, wherein the at least one isotopic repeating unit has a repeating unit main structure represented by one of the following Formulae 8 to 12:

wherein R 3 is a C 1 -C 29 alkyl group, R 1 , R 4 , R 8 , R 9 , R 10 , and R 11 are defined in claim 2 , and at least part of 12 C, 1 H and/or 16 O in the repeating unit main structure of the isotopic repeating unit is replaced with 14° C., 3 H and/or 15 O.

4 . The isotopic polymer as claimed in claim 2 , wherein the isotopic polymer is formed by polymerizing the isotopic monomer having a main structure represented by Formula 2 and the isotopic monomer having a main structure represented by Formula 6, and has a main structure represented by the following Formula I:

wherein n is an integer selected from 1 to 1,000,000;

m is an integer selected from 1 to 1,000,000;

R 4 , R 8 , and R 9 are defined in claim 2 , and at least part of 12 C, 1 H and/or 16 O in the main structure is replaced with 14 C, 3 H and/or 15 O.

5 . The isotopic polymer as claimed in claim 4 , wherein at least part of 12 C in R 4 is replaced with 14 C.

6 . The isotopic polymer as claimed in claim 2 , wherein the isotopic polymer is formed by polymerizing the isotopic monomer having a main structure represented by Formula 1 and the isotopic monomer having a main structure represented by Formula 6, and has a main structure represented by the following Formula II:

wherein n is an integer selected from 1 to 1,000,000;

m is an integer selected from 1 to 1,000,000;

R 1 , R 8 and R 9 are defined in claim 2 , and at least part of 12 C, 1 H and/or 16 O in the main structure is replaced with 14 C, 3 H and/or 15 O.

7 . The isotopic polymer as claimed in claim 1 , wherein a sum of a proportion of the presence of 14 C, a proportion of the presence of 3 H, and a proportion of the presence of 15 O is in a range from 0.1% to 100%.

8 . The isotopic polymer as claimed in claim 7 , wherein the sum of a proportion of the presence of 14 C, a proportion of the presence of 3 H, and a proportion of the presence of 15 O is in a range from 0.5% to 75%.

9 . The isotopic polymer as claimed in claim 1 , wherein a proportion of the presence of 14 C is greater than a proportion of the presence of 3 H and/or a proportion of the presence of 15 O.

10 . A composition comprising an isotopic polymer, wherein the isotopic polymer comprises a silicone resin, an aromatic polymer, a modified silicone resin, a halogenated polysilane, an epoxy resin, or a combination thereof, and at least part of 12 C, H and/or 16 O in the isotopic polymer is replaced with 14 C, 3 H and/or 15 O, and the decaying age of the isotopic polymer is less than 50,000 years.

11 . The composition as claimed in claim 10 , wherein the isotopic polymer is formed by polymerizing at least one isotopic monomer having a main structure represented by one of the following Formulae 1 to 7:

wherein R 1 is a C 1 -C 30 alkyl group, a C 2 -C 30 alkenyl group, or a C 2 -C 30 alkynyl group;

R 2 is OH, a C 1 -C 30 alkyl group, an amine group, a C 1 -C 30 alkyl group substituted with an amine group, or a C 2 -C 30 alkenyl group;

a is an integer selected from 1 to 4;

R 4 is a phenyl group, a phenyl group substituted with a C 1 -C 30 alkyl group, or a C 1 -C 30 alkyl group;

R 5 is —COOCH 2 — or a C 1 -C 30 alkylene group;

R 6 is a C 1 -C 30 alkyl group;

R 7 is a C 1 -C 20 alkylene group;

R 8 is a nitrogen-containing linking group or a C 1 -C 20 alkylene group;

R 9 is a sulfur-containing linking group or a C 1 -C 20 alkylene group;

R 10 is a C 1 -C 20 alkylene group;

R 11 is an oxy group, a sulfur-containing linking group, or a C 1 -C 20 alkylene group,

wherein at least one R 2 is selected from a C 2 -C 20 alkenyl group, and R 2 is the same as or different from each other when a is greater than or equal to 2, and

at least part of 12 C, 1 H and/or 16 O in the main structure of the isotopic polymer is replaced with 14 C, 3 H and/or 15 O.

12 . The composition as claimed in claim 10 , wherein the isotopic polymer comprises at least one isotopic repeating unit, wherein the at least one isotopic repeating unit has a repeating unit main structure represented by one of the following Formulae 8 to 12:

wherein R 3 is a C 1 -C 29 alkyl group, R 1 , R 4 , R 8 , R 9 , R 10 , and R 11 are defined in claim 2 , and at least part of 12 C, 1 H and/or 16 O in the repeating unit main structure of the isotopic repeating unit is replaced with 14 C, 3 H and/or 15 O.

13 . The composition as claimed in claim 10 , wherein the composition further comprises a non-isotopic polymer, a wavelength converting material, a filler, or a combination thereof.

14 . A chip device, comprising:

a substrate;

a chip disposed on the substrate; and

a package structure encapsulating the chip, wherein materials of the package structure and/or materials of the substrate comprises one or more isotopic polymers, wherein the isotopic polymer comprises a silicone resin, an aromatic polymer, a modified silicone resin, a halogenated polysilane, an epoxy resin, or a combination thereof, and at least part of 12 C, 1 H and/or 16 O in the isotopic polymer is replaced with 14 C, 3 H and/or 15 O, and the decaying age of the isotopic polymer is less than 50,000 years.

15 . The chip device as claimed in claim 14 , wherein the isotopic polymer is formed by polymerizing at least one isotopic monomer having a main structure represented by one of the following Formulae 1 to 7:

wherein R 1 is a C 1 -C 30 alkyl group, a C 2 -C 30 alkenyl group, or a C 2 -C 30 alkynyl group;

R 2 is OH, a C 1 -C 30 alkyl group, an amine group, a C 1 -C 30 alkyl group substituted with an amine group, or a C 2 -C 30 alkenyl group;

a is an integer selected from 1 to 4;

R 4 is a phenyl group, a phenyl group substituted with a C 1 -C 30 alkyl group, or a C 1 -C 30 alkyl group;

R 5 is —COOCH 2 — or a C 1 -C 30 alkylene group;

R 6 is a C 1 -C 30 alkyl group;

R 7 is a C 1 -C 20 alkylene group;

R 8 is a nitrogen-containing linking group or a C 1 -C 20 alkylene group;

R 9 is a sulfur-containing linking group or a C 1 -C 20 alkylene group;

R 10 is a C 1 -C 20 alkylene group;

R 11 is an oxy group, a sulfur-containing linking group, or a C 1 -C 20 alkylene group,

wherein at least one R 2 is selected from a C 2 -C 20 alkenyl group, and R 2 is the same as or different from each other when a is greater than or equal to 2, and

at least part of 12 C, 1 H and/or 16 O in the main structure of the isotopic polymer is replaced with 14 C, 3 H and/or 15 O.

16 . The chip device as claimed in claim 14 , wherein the isotopic polymer comprises at least one isotopic repeating unit, wherein the at least one isotopic repeating unit has a repeating unit main structure represented by one of the following Formulae 8 to 12:

wherein R 3 is a C 1 -C 29 alkyl group, R 1 , R 4 , R 8 , R 9 , R 10 , and R 11 are defined in claim 2 , and at least part of 12 C, 1 H and/or 16 O in the repeating unit main structure of the isotopic repeating unit is replaced with 14° C., 3 H and/or 15 O.

17 . The chip device as claimed in claim 14 , wherein the package structure comprises an encapsulant covering the chip.

18 . The chip device as claimed in claim 17 , wherein the package structure comprises a sidewall structure disposed on the substrate and surrounding the chip, the sidewall structure and the substrate together form an accommodating area, and the encapsulant and the chip are disposed within the accommodating area.

19 . A chip device, comprising:

a substrate;

a chip disposed on the substrate; and

a shading layer disposed on the substrate, wherein materials of the shading layer and/or materials of the substrate comprise an isotopic polymer, wherein the isotopic polymer comprises a silicone resin, an aromatic polymer, a modified silicone resin, a halogenated polysilane, an epoxy resin, or a combination thereof, and at least part of 12 C, 1 H and/or 16 O in the isotopic polymer is replaced with 14 C, 3 H and/or 15 O, and the decaying age of the isotopic polymer is less than 50,000 years.

20 . The chip device as claimed in claim 19 , wherein the isotopic polymer is formed by polymerizing at least one isotopic monomer having a main structure represented by one of the following Formulae 1 to 7:

wherein R 1 is a C 1 -C 30 alkyl group, a C 2 -C 30 alkenyl group, or a C 2 -C 30 alkynyl group;

R 2 is OH, a C 1 -C 30 alkyl group, an amine group, a C 1 -C 30 alkyl group substituted with an amine group, or a C 2 -C 30 alkenyl group;

a is an integer selected from 1 to 4;

R 4 is a phenyl group, a phenyl group substituted with a C 1 -C 30 alkyl group, or a C 1 -C 30 alkyl group;

R 5 is —COOCH 2 — or a C 1 -C 30 alkylene group;

R 6 is a C 1 -C 30 alkyl group;

R 7 is a C 1 -C 20 alkylene group;

R 8 is a nitrogen-containing linking group or a C 1 -C 20 alkylene group;

R 9 is a sulfur-containing linking group or a C 1 -C 20 alkylene group;

R 10 is a C 1 -C 20 alkylene group;

R 11 is an oxy group, a sulfur-containing linking group, or a C 1 -C 20 alkylene group,

wherein at least one R 2 is selected from a C 2 -C 20 alkenyl group, and R 2 is the same as or different from each other when a is greater than or equal to 2, and

at least part of 12 C, 1 H and/or 16 O in the main structure of the isotopic polymer is replaced with 14 C, 3 H and/or 15 O.

Assignments (2)
MERGER Recorded Apr 24, 2026
From: LEXTAR ELECTRONICS CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075474/0626 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 2, 2024
From: CHUANG, YUNG CHUAN; TAI, WEN WAN; LEE, YU-CHUN
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 066981/0433 →