MICRO LED PIXEL AND MICRO LED PANEL
A micro LED pixel and a micro LED panel are provided. The micro LED pixel includes a first light emitting mesa; a second light emitting mesa provided above the first light emitting mesa and covering a part of the first light emitting mesa; and a third light emitting mesa provided above the second light emitting mesa and covering a part of the second light emitting mesa; wherein a shape of a top surface of the first light emitting mesa is a triangle.
1 . A micro LED pixel, comprising:
a first light emitting mesa;
a second light emitting mesa provided above the first light emitting mesa and covering a part of the first light emitting mesa; and
a third light emitting mesa provided above the second light emitting mesa and covering a part of the second light emitting mesa; wherein a shape of a top surface of the first light emitting mesa is a triangle.
2 . The micro LED pixel according to claim 1 , wherein a shape of a top surface of the second light emitting mesa is an elongated strip, and the second light emitting mesa is provided along a side of the triangle of the first light emitting mesa.
3 . The micro LED pixel according to claim 2 , wherein a shape of a top surface of the third light emitting mesa is a circle, and the third light emitting mesa is provided above an end of the second light emitting mesa.
4 . The micro LED pixel according to claim 1 , further comprising a plurality of bottom conductive structures configured to connect each of the first light emitting mesa, the second light emitting mesa, and the third light emitting mesa to an integrated circuit (IC) backplane, respectively.
5 . The micro LED pixel according to claim 4 , wherein a first one of the bottom conductive structures is a bonding layer provided between the first light emitting mesa and the IC backplane.
6 . The micro LED pixel according to claim 5 , wherein a second one of the bottom conductive structures is provided at a bottom of the second light emitting mesa, and the second bottom conductive structure is connected to the IC backplane by a first bottom connecting structure.
7 . The micro LED pixel according to claim 6 , wherein the first bottom connecting structure is a through via.
8 . The micro LED pixel according to claim 6 , wherein the second bottom conductive structure is a conductive layer.
9 . The micro LED pixel according to claim 6 , wherein a third one of the bottom conductive structures is provided at a bottom of the third light emitting mesa, and the third bottom conductive structure is connected to the IC backplane by a second bottom connecting structure.
10 . The micro LED pixel according to claim 1 , further comprising:
a top conductive layer provided on a top of the micro LED pixel;
a first top conductive structure configured to connect the first light emitting mesa to the top conductive layer; and
a second top conductive structure configured to connect the second light emitting mesa to the top conductive layer.
11 . The micro LED pixel according to claim 10 , wherein the first top conductive structure is a transparent conductive layer, and covers the top surface of the first light emitting mesa.
12 . The micro LED pixel according to claim 10 , wherein the first top conductive structure is a dot conductive structure.
13 . The micro LED pixel according to claim 12 , wherein the dot conductive structure is formed on a portion of the top surface of the first light emitting mesa where the surface is not covered by the second light emitting mesa.
14 . The micro LED pixel according to claim 10 , wherein the first top conductive structure is connected to the top conductive layer by a top connecting structure.
15 . The micro LED pixel according to claim 10 , wherein the second top conductive structure is a transparent conductive layer, and covers the top surface of the second light emitting mesa.
16 . The micro LED pixel according to claim 15 , wherein the second top conductive structure is a dot conductive structure.
17 . The micro LED pixel according to claim 16 , wherein the second top conductive structure is formed on a portion of a surface of the second light emitting mesa where the surface is not covered by the third light emitting mesa.
18 . The micro LED pixel according to claim 10 , wherein the second top conductive structure is connected to the top conductive layer by a top connecting structure.
19 . The micro LED pixel according to claim 10 , wherein the top conductive layer is directly connected to the third light emitting mesa.
20 . The micro LED pixel according to claim 10 , further comprising a top pad provided on a top surface of the top conductive layer.
21 . The micro LED pixel according to claim 20 , wherein the top pad is provided at an edge of the top conducive layer and around the micro LED pixel.
22 . The micro LED pixel according to claim 10 , further comprising a dielectric material filled between the top conductive layer and an integrated circuit (IC) backplane.
23 . The micro LED pixel according to claim 1 , further comprising an optical isolation structure provided at a corner of the micro LED pixel.
24 . The micro LED pixel according to claim 1 , wherein the first light emitting mesa is a red light emitting mesa.
25 . The micro LED pixel according to claim 24 , wherein the third light emitting mesa is a green light emitting mesa.
26 . A micro LED panel comprising two or more micro LED pixels, wherein the at least one of the micro LED pixels comprises:
a first light emitting mesa;
a second light emitting mesa provided above the first light emitting mesa and covering a part of the first light emitting mesa; and
a third light emitting mesa provided above the second light emitting mesa and covering a part of the second light emitting mesa; wherein a shape of a top surface of the first light emitting mesa is a triangle.