SUBSTRATE TREATMENT APPARATUS
A substrate treatment apparatus, comprising: a coating device configured to coat a substrate, which is conveyed at a first speed in a feeding direction, with a material; a drying device configured to receive the substrate, which is coated by means of the coating device, at the first speed and dry the material; an exposure device configured to receive the substrate, which is dried by means of the drying device, at the first speed and continuously convey a mask at the first speed in the feeding direction, the mask being used for regional shading during exposure of the material by means of the exposure device; and an etching device configured to receive the substrate, which is exposed by means of the exposure device, at the first speed and etch the material and a portion of the substrate in an unexposed region of the substrate.
1 . A substrate treatment apparatus, characterized by comprising:
a coating device configured to coat a substrate, which is conveyed at a first speed in a feeding direction, with a material;
a drying device configured to receive the substrate, which is coated by means of the coating device, at the first speed and dry the material;
an exposure device configured to receive the substrate, which is dried by means of the drying device, at the first speed and continuously convey a mask at the first speed in the feeding direction, the mask being used for regional shading during exposure of the material by means of the exposure device, so that the material is subjected to continuous and regional exposure at the first speed by means of the exposure device; and
an etching device configured to receive the substrate, which is exposed by means of the exposure device, at the first speed and etch the material and a portion of the substrate in an unexposed region of the substrate.
2 . The apparatus according to claim 1 , characterized by further comprising:
a feeding device configured to convey the substrate at the first speed in the feeding direction.
3 . The apparatus according to claim 1 , characterized by further comprising:
a cleaning device configured to receive the substrate, which is etched by means of the etching device, at the first speed and clean the substrate.
4 . The apparatus according to claim 1 , characterized in that the coating device comprises:
a first feeding module configured to allow the feeding direction in the coating device to be a vertical direction.
5 . The apparatus according to claim 4 , characterized in that the coating device performs coating by means of a gravure coating process.
6 . The apparatus according to claim 4 , characterized in that the substrate has a first surface and a second surface opposite to the first surface, and the coating device is configured to coat the first surface and the second surface with the material.
7 . The apparatus according to claim 1 , characterized in that the drying device comprises: a plurality of heating tubes and a plurality of air knives arranged at intervals on two sides of the substrate in the feeding direction.
8 . The apparatus according to claim 1 , characterized in that the exposure device comprises:
a mask conveying module configured to continuously convey the mask at the first speed in the feeding direction.
9 . The apparatus according to claim 8 , characterized in that the mask is an endless mask, and the mask conveying module is configured to rotate the endless mask at the first speed.
10 . The apparatus according to claim 9 , characterized in that the mask conveying module comprises:
a first drive roller and a driven roller, the first drive roller rotating at the first speed as a linear velocity, and the first drive roller and the driven roller being disposed on the inside of the endless mask to rotate the endless mask.
11 . The apparatus according to claim 1 , characterized in that the etching device comprises:
a conductive roller, a first electrode and an etching tank, the conductive roller and the first electrode being disposed in the etching tank, and the etching tank holding an electrolyte solution, wherein the conductive roller and the first electrode have opposite polarities, and the conductive roller comes into contact with the exposed substrate and conveys the substrate to the etching tank at the first speed.
12 . The apparatus according to claim 3 , characterized in that the cleaning device comprises:
a spray rod and a cleaning tank, the spray rod being configured to spray a cleaning liquid to the etched substrate, and the cleaning tank being configured to collect and discharge a waste liquid after cleaning the substrate.