IP Library Granted Patent US 12,406,161
Granted Patent B2
US 12,406,161 · App. 18/644,788 · Granted Sep 2, 2025

Transponders and sensors for implantable medical devices and methods of use thereof

Inventors: Randolph Keith Geissler (Minneapolis, MN); Rudy A. Mazzocchi (Coral Springs, FL); Juan José Chacón Quirós (Alajuela, CR); Steven A. Lewis (Bloomington, MN)
Assignee: Establishment Labs S.A.
G06K19/02A61B5/0031A61B5/062A61B90/02A61B90/98A61F2/12G06K19/04G06K19/0772G06K19/07758G06K19/07773G06K19/07779A61B2560/0219A61F2/484G06K19/07
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,406,161
App. No.
18/644,788
Granted
Sep 2, 2025
Kind
B2
Abstract

Implantable transponders comprising no ferromagnetic parts for use in medical implants are disclosed herein. Such transponders may assist in preventing interference of transponders with medical imaging technologies. Such transponders may optionally be of a small size, and may assist in collecting and transmitting data and information regarding implanted medical devices. Methods of using such transponders, readers for detecting such transponders, and methods for using such readers are also described.

Claims (59)

1. An implantable medical device comprising:

a shell defining a cavity, the shell including one or more layers;

wherein the one or more layers includes an electroconductive layer; and

a transponder enclosed within the electroconductive layer, the transponder including:

a capsule having a cavity;

an enameled wire having a first end and a second end; and

an integrated circuit chip coupled to each of the first end and the second end;

wherein the capsule configured to house the enameled wire and the integrated circuit chip;

wherein the capsule includes an adhesive material filling at least 30 percent of the cavity.

2. The implantable medical device of claim 1 , wherein the one or more layers includes an inner layer and an outer layer.

3. The implantable medical device of claim 2 , wherein the electroconductive layer is positioned between the inner layer and the outer layer;

wherein the one or more layers includes an inner layer and an outer layer formed from a non-electroconductive material.

4. The implantable medical device of claim 1 , wherein the transponder is configured to transmit radio frequency wave transmissions, the radio frequency wave transmissions between 100 kHz and 3 GHz.

5. The implantable medical device of claim 1 , including a sensor;

wherein the electroconductive layer is configured to interfere with transmission of a signal from the transponder or the sensor through the shell.

6. The implantable medical device of claim 1 , wherein the transponder includes a capsule enclosing the enameled wire and the integrated circuit chip.

7. An implantable medical device comprising:

a multilayered shell defining a cavity, the multilayered shell including:

an outer layer; and

an electroconductive layer;

an integrated port assembly coupled with a surface of the multilayered shell, the integrated port assembly including:

a chamber; and

a self-sealing port dome covering an opening of the chamber; and

a transponder positioned within the implantable medical device, the transponder including:

a non-ferromagnetic enameled wire.

8. The implantable medical device of claim 7 , wherein the transponder is positioned within the integrated port assembly.

9. The implantable medical device of claim 7 , wherein the multilayered shell includes an inner layer, and the electroconductive layer is positioned between the outer layer and the inner layer;

wherein the transponder is enclosed in the electroconductive layer.

10. The implantable medical device of claim 7 , wherein the electroconductive layer is a mesh layer;

wherein the electroconductive layer is configured to prevent a signal from being received by the transponder or a signal being transmitted from the transponder.

11. The implantable medical device of claim 7 , including:

a capsule defining a cavity; and

an integrated circuit chip in communication with the non-ferromagnetic enameled wire;

wherein the non-ferromagnetic wire and the integrated circuit chip are positioned within the cavity.

12. The implantable medical device of claim 11 , wherein the non-ferromagnetic enameled wire is formed in a coil having a first end and a second end;

wherein the integrated circuit chip is coupled with one or more of the first end or the second end of the coil.

13. A system for monitoring a status of an implantable medical device, the system including:

a multilayered shell defining a cavity, the multilayered shell including:

an outer layer;

an electroconductive layer; and

an integrated port assembly positioned on the multilayered shell, the integrated port assembly including:

an integrated port dome configured to fit against a wall of the multilayered shell; and

a valve assembly interconnected with the integrated port dome; and

a transponder positioned within the implantable medical device, the transponder including:

a non-ferromagnetic enameled wire; and

an external communication device configured to communicate with the transponder, the external communication device including:

a microcontroller; and

one or more antenna.

14. The system for monitoring the status of claim 13 , including an inner layer;

wherein the electroconductive layer is positioned between the outer layer and the inner layer;

wherein the transponder is enclosed by the electroconductive layer.

15. The system for monitoring the status of claim 13 , wherein the external communication device is configured to receive a stronger signal from the transponder when the electroconductive layer or the multilayered shell is breached than when the electroconductive layer or the multilayered shell is intact.

16. The system for monitoring the status of claim 13 , wherein the non-ferromagnetic enameled wire is formed in a coil, the coil having a first end and a second end, the transponder including:

a capsule enclosing the coil; and

an integrated circuit chip coupled to the first end and the second end;

wherein the external communication device is configured to send signals to the transponder and receive signals from the transponder.

17. The system for monitoring the status of claim 13 , including:

at least one sensor disposed in the multilayered shell, the at least one sensor configured to detect or measure one or more of biological, chemical or mechanical signals.

18. The system for monitoring the status of claim 13 , wherein the external communication device is configured to detect damage to the implantable medical device.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 25, 2024
From: GEISSLER, RANDOLPH KEITH; MAZZOCCHI, RUDY A; CHACON QUIROS, JUAN JOSE; LEWIS, STEVEN A
To: ESTABLISHMENT LABS S.A.
Reel/Frame 067227/0488 →
Continuity (8)
Continuation 18101684 · Jan 26, 2023
Continuation 17590491 · Feb 1, 2022
Continuation 17064001 · Oct 6, 2020
Continuation 16209063 · Dec 4, 2018
Continuation 15427599 · Feb 8, 2017
Provisional Application 62313218 · Mar 25, 2016
Provisional Application 62293052 · Feb 9, 2016
Related Publication 20240273327A1 · Aug 15, 2024
References Cited (271)
US 4574780A · Manders · 1986 [cited by applicant]
US 4671255A · Dubrul et al. · 1987 [cited by applicant]
US 4950292A · Audretsch · 1990 [cited by applicant]
US 5146933A · Boyd · 1992 [cited by applicant]
US 5211129A · Taylor et al. · 1993 [cited by applicant]
US 5373303A · D 'Hont · 1994 [cited by applicant]
US 5482008A · Stafford et al. · 1996 [cited by applicant]
US 5833603A · Kovacs et al. · 1998 [cited by applicant]
US 5871497A · Young · 1999 [cited by applicant]
US 5935164A · Iversen · 1999 [cited by applicant]
US 5977431A · Knapp et al. · 1999 [cited by applicant]
US 6071309A · Knowlton · 2000 [cited by applicant]
US 6228116B1 · Ledergerber · 2001 [cited by applicant]
US 6261247B1 · Ishikawa et al. · 2001 [cited by applicant]
US 6329958B1 · Mclean et al. · 2001 [cited by applicant]
US 6546982B1 · Brown et al. · 2003 [cited by applicant]
US 6579498B1 · Eglise · 2003 [cited by applicant]
US 6588432B1 · Rehder et al. · 2003 [cited by applicant]
US 6605116B2 · Falcon et al. · 2003 [cited by applicant]
US 6743254B2 · Guest et al. · 2004 [cited by applicant]
US 7081136B1 · Becker · 2006 [cited by applicant]
US 7508350B2 · Hein et al. · 2009 [cited by applicant]
US 7575597B2 · Rehnke · 2009 [cited by applicant]
US D604849S · Lauryssen · 2009 [cited by applicant]
US D605767S · Lauryssen · 2009 [cited by applicant]
US D616096S · Lauryssen · 2010 [cited by applicant]
US 7727141B2 · Hassler, Jr. et al. · 2010 [cited by applicant]
US 7731700B1 · Schytte · 2010 [cited by applicant]
US 8167836B2 · Lee et al. · 2012 [cited by applicant]
US 8192486B2 · Glicksman · 2012 [cited by applicant]
US 8398710B2 · Forsell · 2013 [cited by applicant]
US 8454690B2 · Mcclellan · 2013 [cited by applicant]
US 8506627B2 · Van et al. · 2013 [cited by applicant]
US 8636797B2 · Chitre et al. · 2014 [cited by applicant]
US 8821574B2 · Davodian · 2014 [cited by applicant]
US 8852276B2 · Del Vecchio · 2014 [cited by applicant]
US 8870952B2 · Holland et al. · 2014 [cited by applicant]
US 9011333B2 · Geissler et al. · 2015 [cited by applicant]
US 9017403B2 · Forsell · 2015 [cited by applicant]
US 9138311B2 · Van Epps et al. · 2015 [cited by applicant]
US 9211185B2 · Boyden · 2015 [cited by examiner]
US 9370414B2 · Glicksman · 2016 [cited by applicant]
US 9393106B2 · Van Epps et al. · 2016 [cited by applicant]
US 9399122B2 · Mosharrafa et al. · 2016 [cited by applicant]
US 9463087B2 · Hristov et al. · 2016 [cited by applicant]
US 9526584B2 · Payne et al. · 2016 [cited by applicant]
US 9549812B2 · Shetty et al. · 2017 [cited by applicant]
US 9636210B2 · Hristov et al. · 2017 [cited by applicant]
US 9673516B2 · Mejia · 2017 [cited by applicant]
US 9700404B2 · Martin et al. · 2017 [cited by applicant]
US 9700405B2 · Davila et al. · 2017 [cited by applicant]
US 9724189B2 · Forsell · 2017 [cited by applicant]
US 9808338B2 · Schuessler et al. · 2017 [cited by applicant]
US 9814566B1 · Cree · 2017 [cited by applicant]
US 9918829B2 · Van Epps et al. · 2018 [cited by applicant]
US 10004590B2 · Shetty et al. · 2018 [cited by applicant]
US 10010404B2 · Mcclellan · 2018 [cited by applicant]
US 10052190B2 · Chitre et al. · 2018 [cited by applicant]
US 10176412B2 · Geissler et al. · 2019 [cited by applicant]
US 10245117B2 · Payne et al. · 2019 [cited by applicant]
US 10251746B2 · Schuessler et al. · 2019 [cited by applicant]
US 10424837B2 · Mejia · 2019 [cited by applicant]
US 10537420B2 · Forsell · 2020 [cited by applicant]
US 10588737B2 · Mcclellan · 2020 [cited by applicant]
US 10617516B2 · Davila et al. · 2020 [cited by applicant]
US 10660742B2 · Algawi et al. · 2020 [cited by applicant]
US 10695165B2 · Shetty et al. · 2020 [cited by applicant]
US D889654S · Limem et al. · 2020 [cited by applicant]
US D889655S · Limem et al. · 2020 [cited by applicant]
US 10709851B2 · Geiger · 2020 [cited by applicant]
US D892329S · Limem et al. · 2020 [cited by applicant]
US 10751162B2 · Hristov et al. · 2020 [cited by applicant]
US 10751163B2 · Feinberg et al. · 2020 [cited by applicant]
US 10751164B2 · Govari et al. · 2020 [cited by applicant]
US D896383S · Schuessler et al. · 2020 [cited by applicant]
US 10765506B2 · Chitre et al. · 2020 [cited by applicant]
US 10792121B2 · Jones et al. · 2020 [cited by applicant]
US 10799313B2 · Davila et al. · 2020 [cited by applicant]
US 10799337B2 · David et al. · 2020 [cited by applicant]
US 10820984B2 · Renke · 2020 [cited by applicant]
US 10824925B2 · Geissler et al. · 2020 [cited by applicant]
US 10828148B2 · Forsell · 2020 [cited by applicant]
US 10898313B2 · Feinberg et al. · 2021 [cited by applicant]
US 11039898B2 · Mcclellan · 2021 [cited by applicant]
US 11065075B2 · Mosharrafa · 2021 [cited by applicant]
US D926984S · Schuessler et al. · 2021 [cited by applicant]
US D927690S · Limem et al. · 2021 [cited by applicant]
US 11154393B2 · Limem et al. · 2021 [cited by applicant]
US 11160630B2 · Schuessler et al. · 2021 [cited by applicant]
US 11207149B2 · Mcclellan · 2021 [cited by applicant]
US 11537829B2 · Geissler et al. · 2022 [cited by applicant]
US 11593601B2 · Geissler et al. · 2023 [cited by applicant]
US 12001904B2 · Geissler et al. · 2024 [cited by applicant]
US 20010004236A1 · Letkomiller et al. · 2001 [cited by applicant]
US 20010004709A1 · Dubrul · 2001 [cited by applicant]
US 20020038147A1 · Miller · 2002 [cited by applicant]
US 20020154065A1 · Mejia et al. · 2002 [cited by applicant]
US 20030120150A1 · Govari · 2003 [cited by applicant]
US 20030141963A1 · Furter et al. · 2003 [cited by applicant]
US 20030144734A1 · Dreschnack et al. · 2003 [cited by applicant]
US 20030149481A1 · Guest et al. · 2003 [cited by applicant]
US 20040008114A1 · Sawyer · 2004 [cited by applicant]
US 20050033407A1 · Weber et al. · 2005 [cited by applicant]
US 20050216094A1 · Prewett · 2005 [cited by applicant]
US 20060069403A1 · Shalon et al. · 2006 [cited by applicant]
US 20060211914A1 · Hassler et al. · 2006 [cited by applicant]
US 20060266435A1 · Yang et al. · 2006 [cited by applicant]
US 20070157828A1 · Susel et al. · 2007 [cited by applicant]
US 20070159336A1 · Tethrake et al. · 2007 [cited by applicant]
US 20070233195A1 · Wahlstrand et al. · 2007 [cited by applicant]
US 20070233273A1 · Connell · 2007 [cited by applicant]
US 20080049376A1 · Stevenson et al. · 2008 [cited by applicant]
US 20080106419A1 · Sakama · 2008 [cited by applicant]
US 20090270985A1 · Schuessler · 2009 [cited by applicant]
US 20090315681A1 · Blair · 2009 [cited by applicant]
US 20100004236A1 · Tehim et al. · 2010 [cited by applicant]
US 20100042211A1 · Van et al. · 2010 [cited by applicant]
US 20110077736A1 · Rofougaran · 2011 [cited by applicant]
US 20110150180A1 · Balakin · 2011 [cited by applicant]
US 20110226856A1 · Meilland et al. · 2011 [cited by applicant]
US 20110257491A1 · Robertson et al. · 2011 [cited by applicant]
US 20110259965A1 · Mejia · 2011 [cited by applicant]
US 20110297306A1 · Yang · 2011 [cited by applicant]
US 20120302874A1 · Hollstien · 2012 [cited by examiner]
US 20130131800A1 · Schuessler · 2013 [cited by applicant]
US 20130199027A1 · Singh et al. · 2013 [cited by applicant]
US 20130245758A1 · Chitre et al. · 2013 [cited by applicant]
US 20130325120A1 · Mcclellan · 2013 [cited by applicant]
US 20140074237A1 · Yacoub et al. · 2014 [cited by applicant]
US 20140078013A1 · Mejia · 2014 [cited by applicant]
US 20140081398A1 · Mejia et al. · 2014 [cited by applicant]
US 20150327985A1 · Hristov et al. · 2015 [cited by applicant]
US 20160128798A1 · Bovet et al. · 2016 [cited by applicant]
US 20160211924A1 · Deng et al. · 2016 [cited by applicant]
US 20160250017A1 · Mcclellan · 2016 [cited by applicant]
US 20160310048A1 · Pang et al. · 2016 [cited by applicant]
US 20170014226A1 · Fenaroli · 2017 [cited by applicant]
US 20170035999A1 · Wijay · 2017 [cited by applicant]
US 20170228627A1 · Geissler et al. · 2017 [cited by applicant]
US 20170256850A1 · Mejia · 2017 [cited by applicant]
US 20170348089A1 · Becker · 2017 [cited by applicant]
US 20180110612A1 · Schuessler et al. · 2018 [cited by applicant]
US 20190108427A1 · Geissler et al. · 2019 [cited by applicant]
US 20190223971A1 · Payne et al. · 2019 [cited by applicant]
US 20190247138A1 · Kirchhevel et al. · 2019 [cited by applicant]
US 20200100892A1 · Limem et al. · 2020 [cited by applicant]
US 20200146811A1 · Forsell · 2020 [cited by applicant]
US 20200246132A1 · Scott · 2020 [cited by applicant]
US 20200253717A1 · Nygaard · 2020 [cited by applicant]
US 20200268504A1 · Chitre et al. · 2020 [cited by applicant]
US 20200276397A1 · Geiger · 2020 [cited by applicant]
US 20200281714A1 · Shetty et al. · 2020 [cited by applicant]
US 20200297479A1 · Van Epps et al. · 2020 [cited by applicant]
US 20200315777A1 · Becker · 2020 [cited by applicant]
US 20200352704A1 · Schuessler et al. · 2020 [cited by applicant]
US 20200383773A1 · Feinberg et al. · 2020 [cited by applicant]
US 20200405473A1 · Nanni · 2020 [cited by applicant]
US 20210019583A1 · Geissler et al. · 2021 [cited by applicant]
US 20210093444A1 · Feinberg et al. · 2021 [cited by applicant]
US 20210121284A1 · Forsell · 2021 [cited by applicant]
US 20210259798A1 · Jones et al. · 2021 [cited by applicant]
US 20210307858A1 · Mcclellan · 2021 [cited by applicant]
US 20210346112A1 · Mosharrafa · 2021 [cited by applicant]
US 20220156541A1 · Geissler et al. · 2022 [cited by applicant]
US 20230169292A1 · Geissler et al. · 2023 [cited by applicant]
BR 112018016211A2 · 2018 [cited by applicant]
CA 2086149C · 1997 [cited by applicant]
CA 3013698A1 · 2017 [cited by applicant]
CN 1857178A · 2006 [cited by applicant]
CN 101051557A · 2007 [cited by applicant]
CN 101578064A · 2009 [cited by applicant]
CN 201489564U · 2010 [cited by applicant]
CN 101868192A · 2010 [cited by applicant]
CN 104239930A · 2014 [cited by applicant]
CN 204143476U · 2015 [cited by applicant]
CN 108697337A · 2018 [cited by applicant]
EP 3413788A2 · 2018 [cited by applicant]
EP 3556317A1 · 2019 [cited by applicant]
ES 2259554A1 · 2006 [cited by examiner]
HK 1262899A · 2020 [cited by applicant]
IL 260805A · 2019 [cited by applicant]
IL 260805B · 2021 [cited by applicant]
IL 285019 · 2021 [cited by applicant]
JP 2010018482A · 2010 [cited by applicant]
KR 20180116302A · 2018 [cited by applicant]
WO WO2011150180A2 · 2011 [cited by applicant]
WO WO2012062965A1 · 2012 [cited by applicant]
WO WO2014168926A1 · 2014 [cited by applicant]
WO WO2015121686A1 · 2015 [cited by applicant]
WO WO2016005667A1 · 2016 [cited by applicant]
WO WO2017137853A2 · 2017 [cited by applicant]
WO WO2017137853A3 · 2017 [cited by applicant]
WO WO2019110550A1 · 2019 [cited by applicant]
WO WO2019245241A1 · 2019 [cited by applicant]
WO WO2021045570A2 · 2021 [cited by applicant]
WO WO2021066472A1 · 2021 [cited by applicant]
WO WO2021217099A1 · 2021 [cited by applicant]
“U.S. Appl. No. 15/427,599, Examiner Interview Summary mailed May 17, 2018”, 3 pgs. [cited by applicant]
“U.S. Appl. No. 15/427,599, Non Final Office Action mailed May 4, 2018”, 17 pgs. [cited by applicant]
“U.S. Appl. No. 15/427,599, Notice of Allowance mailed Sep. 6, 2018”, 8 pgs. [cited by applicant]
“U.S. Appl. No. 15/427,599, Preliminary Amendment filed Apr. 17, 2017”, 6 pgs. [cited by applicant]
“U.S. Appl. No. 15/427,599, Response filed Aug. 3, 2018 to Non Final Office Action mailed May 4, 2018”, 6 pgs. [cited by applicant]
“U.S. Appl. No. 16/209,063, Non Final Office Action mailed Mar. 10, 2020”, 6 pgs. [cited by applicant]
“U.S. Appl. No. 16/209,063, Notice of Allowance mailed Jun. 29, 2020”, 7 pgs. [cited by applicant]
“U.S. Appl. No. 16/209,063, Preliminary Amendment filed Feb. 11, 2019”, 7 pgs. [cited by applicant]
“U.S. Appl. No. 16/209,063, Preliminary Amendment filed Dec. 4, 2018”, 3 pgs. [cited by applicant]
“U.S. Appl. No. 16/209,063, Response filed Jun. 10, 2020 to Non Final Office Action mailed Mar. 10, 2020”, 7 pgs. [cited by applicant]
“U.S. Appl. No. 17/064,001, Notice of Allowance mailed May 12, 2022”, 9 pgs. [cited by applicant]
“U.S. Appl. No. 17/064,001, Notice of Allowance mailed Aug. 17, 2022”, 8 pgs. [cited by applicant]
“U.S. Appl. No. 17/064,001, Preliminary Amendment filed Oct. 6, 2020”, 9 pgs. [cited by applicant]
“U.S. Appl. No. 17/064,001, Supplemental Preliminary Amendment filed Feb. 28, 2022”, 10 pgs. [cited by applicant]
“U.S. Appl. No. 17/590,491, Examiner Interview Summary mailed Jul. 28, 2022”, 2 pgs. [cited by applicant]
“U.S. Appl. No. 17/590,491, Final Office Action mailed Aug. 12, 2022”, 10 pgs. [cited by applicant]
“U.S. Appl. No. 17/590,491, Non Final Office Action mailed Apr. 27, 2022”, 8 pgs. [cited by applicant]
“U.S. Appl. No. 17/590,491, Notice of Allowance mailed Oct. 26, 2022”, 7 pgs. [cited by applicant]
“U.S. Appl. No. 17/590,491, Preliminary Amendment filed Feb. 1, 2022”, 9 pgs. [cited by applicant]
“U.S. Appl. No. 17/590,491, Response filed Jul. 27, 2022 to Non Final Office Action mailed Apr. 27, 2022”, 11 pgs. [cited by applicant]
“U.S. Appl. No. 17/590,491, Response filed Oct. 10, 2022 to Final Office Action mailed Aug. 12, 2022”, 10 pgs. [cited by applicant]
“U.S. Appl. No. 18/101,684, Corrected Notice of Allowability mailed Mar. 1, 2024”, 2 pgs. [cited by applicant]
“U.S. Appl. No. 18/101,684, Non Final Office Action mailed Jul. 5, 2023”, 15 pgs. [cited by applicant]
“U.S. Appl. No. 18/101,684, Notice of Allowance mailed Jan. 24, 2024”, 7 pgs. [cited by applicant]
“U.S. Appl. No. 18/101,684, Response filed Oct. 5, 2023 to Non Final Office Action mailed Jul. 5, 2023”, 8 pgs. [cited by applicant]
“U.S. Appl. No. 18/101,684, Response filed Dec. 15, 2023 to Restriction Requirement mailed Nov. 15, 2023”, 6 pgs. [cited by applicant]
“U.S. Appl. No. 18/101,684, Restriction Requirement mailed Nov. 15, 2023”, 6 pgs. [cited by applicant]
“Brazilian Application Serial No. 112018016211-6, Voluntary Amendment filed Feb. 7, 2020”, 18 pgs. [cited by applicant]
“Brazilian Application Serial No. 112018016211-6, Voluntary Amendment filed Mar. 28, 2019”, 11 pgs. [cited by applicant]
“Brazilian Application Serial No. BR112018016211-6, Office Action mailed Feb. 10, 2023”, W/English Translation, 5 pgs. [cited by applicant]
“Brazilian Application Serial No. BR112018016211-6, Response filed May 22, 2023 to Office Action mailed Feb. 10, 2023”, w/ English claims, 13 pgs. [cited by applicant]
“Canadian Application Serial No. 3,013,698, Examiners Rule 86(2) Requisition mailed Feb. 22, 2023”, 3 pgs. [cited by applicant]
“Canadian Application Serial No. 3,013,698, Response filed Jun. 15, 2023 to Examiners Rule 86(2) Requisition mailed Feb. 22, 2023”, 7 pgs. [cited by applicant]
“Canadian Examiner's Search Report Serial No. 3,013,698, mailed Jan. 22, 2024.”, 6 pgs. [cited by applicant]
“Chinese Application Serial No. 201780014434.9, Office Action mailed Aug. 9, 2021”, 11 pgs. [cited by applicant]
“Chinese Application Serial No. 201780014434.9, Office Action mailed Oct. 10, 2020”, 13 pgs. [cited by applicant]
“Chinese Application Serial No. 201780014434.9, Office Action mailed Dec. 22, 2021”, 13 pgs. [cited by applicant]
“Chinese Application Serial No. 201780014434.9, Response filed Apr. 2, 2022 to Office Action mailed Dec. 22, 2021”, 5 pgs. [cited by applicant]
“Chinese Application Serial No. 201780014434.9, Response filed Apr. 8, 2021 to Office Action mailed Oct. 10, 2020”, 11 pgs. [cited by applicant]
“Chinese Application Serial No. 201780014434.9, Response filed Oct. 25, 2021 to Office Action mailed Aug. 9, 2021”, 3 pgs. [cited by applicant]
“Electronic Skills Training”, Common Knowledge Evidence: Book, Press of Beijing University of Aeronautics, (Mar. 31, 2012), 22-23. [cited by applicant]
“European Application Serial No. 13836381.7, Extended European Search Report mailed Apr. 26, 2016”, 7 pgs. [cited by applicant]
“European Application Serial No. 17717214.5, Communication Pursuant to Article 94(3) EPC mailed Sep. 4, 2019”, 7 pgs. [cited by applicant]
“European Application Serial No. 17717214.5, Response filed Mar. 13, 2020 to Communication Pursuant to Article 94(3) EPC mailed Sep. 4, 2019”, 9 pgs. [cited by applicant]
“European Application Serial No. 17717214.5, Response to Communication pursuant to Rules 161(1) and 162 EPC filed Mar. 28, 2019”, 32 pgs. [cited by applicant]
“European Application Serial No. 19177728.3, Communication Pursuant to Article 94(3) EPC mailed Oct. 7, 2020”, 7 pgs. [cited by applicant]
“European Application Serial No. 19177728.3, Extended European Search Report mailed Sep. 4, 2019”, 8 pgs. [cited by applicant]
“European Application Serial No. 19177728.3, Response filed Feb. 16, 2021 to Communication Pursuant to Article 94(3) EPC mailed Oct. 7, 2020”, 81 pgs. [cited by applicant]
“European Application Serial No. 19177728.3, Response filed Apr. 30, 2020 to Extended European Search Report mailed Sep. 4, 2019”, 10 pgs. [cited by applicant]
“European Application Serial No. 17717214.5, Office Action mailed Aug. 7, 2023”, 6 pgs. [cited by applicant]
“International Application Serial No. PCT/IB2017/000247, International Preliminary Report on Patentability mailed Aug. 23, 2018”, 10 pgs. [cited by applicant]
“International Application Serial No. PCT/IB2017/000247, International Search Report mailed Aug. 18, 2017”, 6 pgs. [cited by applicant]
“International Application Serial No. PCT/IB2017/000247, Written Opinion mailed Aug. 18, 2017”, 8 pgs. [cited by applicant]
“International Application Serial No. PCT/US2013/059964, International Search Report mailed Jan. 10, 2014”, 2 pgs. [cited by applicant]
“International Application Serial No. PCT/US2013/059988, International Search Report mailed Dec. 5, 2013”, 3 pgs. [cited by applicant]
“Israel Application Serial No. 260805, Office Action mailed Apr. 23, 2020”, 3 pgs. [cited by applicant]
“Israel Application Serial No. 260805, Office Action mailed Oct. 23, 2019”, 2 pgs. [cited by applicant]
“Israel Application Serial No. 260805, Response filed Feb. 18, 2020 to Office Action mailed Oct. 23, 2019”, 23 pgs. [cited by applicant]
“Israel Application Serial No. 260805, Response filed Aug. 21, 2020 to Office Action mailed Apr. 23, 2020”, 21 pgs. [cited by applicant]
“Israel Application Serial No. 285019, Notice of Objection mailed Feb. 8, 2022”, w/ English Translation, 7 pgs. [cited by applicant]
“Israel Application Serial No. 285019, Notification of Defects in Patent Application mailed Mar. 15, 2023”, w/ English Translation, 7 pgs. [cited by applicant]
“Israel Application Serial No. 285019, Office Action mailed Jul. 25, 2021”, 2 pgs. [cited by applicant]
“Israel Application Serial No. 285019, Office Action mailed Aug. 8, 2023”, (W/ English Translation), 7 pgs. [cited by applicant]
“Israel Application Serial No. 285019, Response filed Jul. 13, 2022 to Office Action mailed Feb. 8, 2022”, w/ English claims, 14 pgs. [cited by applicant]
“Israel Application Serial No. 285019, Response filed Nov. 23, 2021 to Office Action mailed Jul. 25, 2021”, 2 pgs. [cited by applicant]
“LOCalizer Wire-free Guidance System”, Available at <https://www.hologic.com/hologic-products/breast-health-solutions/localizer-wire-free-guidance-system>, last accessed Jan. 24, 2022, 6 pgs. [cited by applicant]
“Wire-free Breast Lesion Guidance”, Available at <https://hologicbreastsurgery.com/en/portfolio/localizer-wire-free-guidance-system/>; last accessed Jan. 24, 2022, 4 pgs. [cited by applicant]
U.S. Appl. No. 15/427,599 U.S. Pat. No. 10,176,412, filed Feb. 8, 2017, Transponders and Sensors for Implantable Medical Devices and Methods of Use Thereof. [cited by applicant]
U.S. Appl. No. 16/209,063 U.S. Pat. No. 10,824,925, filed Dec. 4, 2018, Transponders and Sensors for Implantable Medical Devices and Methods of Use Thereof. [cited by applicant]
U.S. Appl. No. 17/064,001 U.S. Pat. No. 11,537,829, filed Oct. 6, 2020, Transponders and Sensors for Implantable Medical Devices and Methods of Use Thereof. [cited by applicant]
U.S. Appl. No. 18/101,684, filed Jan. 26, 2023, Transponders and Sensors for Implantable Medical Devices and Methods of Use Thereof. [cited by applicant]
U.S. Appl. No. 17/590,491, U.S. Pat. No. 11,593,601, filed Feb. 1, 2022, Transponders and Sensors for Implantable Medical Devices and Methods of Use Thereof. [cited by applicant]
“European Application Serial No. 17717214.5, Summons to attend oral proceedings pursuant to Rule 115(1) EPC mailed Jun. 20, 2024.”, (Jun. 20, 2024), 8 pgs. [cited by applicant]
“European Application Serial No. 19177728.3, Communication Pursuant to Article 94(3) EPC mailed Feb. 28, 2025”, 6 pgs. [cited by applicant]