IP Library Granted Patent US 12,409,428
Granted Patent B2
US 12,409,428 · App. 18/651,623 · Granted Sep 9, 2025

Fire-class reinforced aerogel compositions

Inventors: David Mihalcik (Northborough, MA); Kathryn deKrafft (Hudson, MA); Nicholas Anthony Zafiropoulos (Wayland, MA); Owen Evans (Chelmsford, MA); George Gould (Mendon, MA); Wibke Lolsberg (Northborough, MA)
Assignee: Aspen Aerogels, Inc.
B01J13/0091C01B33/1585C08K5/0066C08L61/28C08L75/04C08L2201/02
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Quick Facts
Patent No.
US 12,409,428
App. No.
18/651,623
Granted
Sep 9, 2025
Kind
B2
Abstract

The current disclosure provides reinforced aerogel compositions that are durable and easy to handle, have favorable performance in aqueous environments, have favorable insulation properties, and have favorable, reaction to fire, combustion and flame-resistance properties. Also provided are methods of preparing or manufacturing such reinforced aerogel compositions. In certain embodiments, the composition has a silica-based aerogel framework, reinforced with an open-cell macroporous framework, and includes one or more fire-class additives, where the silica-based aerogel framework comprises at least one hydrophobic-bound silicon and the composition or each of its components has desired properties.

Claims (25)

1. A reinforced silica-based aerogel material comprising:

an open-cell macroporous framework (OCMF);

an aerogel disposed within the OCMF, the aerogel comprising silica; and

an endothermic fire-class additive disposed within the aerogel, wherein the endothermic fire-class additive decomposes, including absorbing energy via water during dehydration of the additive, at a temperature of at least 350 degrees Celsius (° C.); and

wherein the reinforced silica-based aerogel material has an onset of thermal decomposition within 50 degrees of the fire-class additive.

2. The aerogel of claim 1 , wherein the endothermic fire-class additive decomposes at the temperature, and wherein the temperature is within a range of 440° C. and 570° C.

3. The aerogel of claim 1 , wherein the endothermic fire-class additive is a hydrated aluminum silicate clay.

4. The aerogel of claim 3 , wherein the hydrated aluminum silicate clay is a halloysite clay or a kaolinite clay.

5. The aerogel of claim 1 , wherein the endothermic fire-class additive is present in the reinforced silica-based aerogel material in about 5 wt. % to 70 wt. %.

6. The aerogel of claim 1 , wherein the OCMF material comprises melamine.

7. The aerogel of claim 1 , wherein the OCMF material comprises a sheet or a foam.

8. The aerogel of claim 1 , wherein the reinforced silica-based aerogel material further comprises a hydrophobic component.

9. The aerogel of claim 1 , wherein the OCMF is flammable, combustible, or both.

10. The aerogel of claim 1 , wherein the reinforced silica-based aerogel material is characterized by:

i) a liquid water uptake of 20 wt % or less; and

ii) a thermal conductivity of 30 mW/M*K or less according to ASTM C518 standard at a temperature of about 37.5° C., in an ambient environment, at atmospheric pressure, and at a compression load of about 2 psi.

11. A reinforced silica-based aerogel material comprising:

an open-cell macroporous framework (OCMF);

an aerogel disposed within the OCMF, the aerogel comprising silica; and

an endothermic fire-class additive disposed within the aerogel, wherein the endothermic fire-class additive decomposes, including absorbing energy via water during dehydration of the additive, at a temperature of at least 350 degrees Celsius (C); and

wherein the reinforced silica-based aerogel material has an onset of thermal decomposition of within a range of 280° C. to 390° C.

12. The reinforced silica-based aerogel material of claim 11 , wherein the endothermic fire-class additive is a hydrated aluminum silicate clay.

13. The reinforced silica-based aerogel material of claim 12 , wherein the hydrated aluminum silicate clay is a halloysite clay or a kaolinite clay.

14. The reinforced silica-based aerogel material of claim 11 , wherein the endothermic fire-class additive is present in the reinforced silica-based aerogel material in about 5 wt. % to 70 wt. %.

15. The reinforced silica-based aerogel material of claim 11 , wherein the reinforced silica-based aerogel material further comprises a hydrophobic component.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2024
From: MIHALCIK, DAVID; DEKRAFFT, KATHRYN; ZAFIROPOULOS, NICHOLAS ANTHONY; EVANS, OWEN; GOULD, GEORGE
To: ASPEN AEROGELS, INC.
Reel/Frame 067826/0799 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2024
From: BASF SE
To: ASPEN AEROGELS, INC.
Reel/Frame 067826/0886 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 24, 2024
From: LOLSBERG, WIBKE
To: BASF SE
Reel/Frame 067815/0015 →
Continuity (4)
Continuation 18056067 · Nov 16, 2022
Continuation 16425825 · May 29, 2019
Provisional Application 62678850 · May 31, 2018
Related Publication 20240350997A1 · Oct 24, 2024
References Cited (285)
US 2117605A · Fowler et al. · 1938 [cited by applicant]
US 2188007A · Kistler · 1940 [cited by applicant]
US 2739134A · Parry et al. · 1956 [cited by applicant]
US 2789095A · Lindvig · 1957 [cited by applicant]
US 2811499A · Hervey · 1957 [cited by applicant]
US 2831820A · Aase et al. · 1958 [cited by applicant]
US 2920983A · John · 1960 [cited by applicant]
US 2926390A · Anselm et al. · 1960 [cited by applicant]
US 2936294A · Kohrn · 1960 [cited by applicant]
US 2993869A · Gmitter et al. · 1961 [cited by applicant]
US 3025200A · Powers · 1962 [cited by applicant]
US 3055360A · William · 1962 [cited by applicant]
US 3057750A · Bailey et al. · 1962 [cited by applicant]
US 3060137A · Gemeinhardt et al. · 1962 [cited by applicant]
US 3075926A · Stewart et al. · 1963 [cited by applicant]
US 3082611A · Alvis et al. · 1963 [cited by applicant]
US 3090094A · Karl et al. · 1963 [cited by applicant]
US 3094433A · John et al. · 1963 [cited by applicant]
US 3112524A · Bobby · 1963 [cited by applicant]
US 3129191A · Nickerson et al. · 1964 [cited by applicant]
US 3171820A · Volz · 1965 [cited by applicant]
US 3342922A · John et al. · 1967 [cited by applicant]
US 3386877A · Skochdopole et al. · 1968 [cited by applicant]
US 3459274A · Macphail · 1969 [cited by applicant]
US 3504064A · Bauer · 1970 [cited by applicant]
US 3506600A · Zocco et al. · 1970 [cited by applicant]
US 3650993A · Zocco et al. · 1972 [cited by applicant]
US 3860537A · Graham et al. · 1975 [cited by applicant]
US 3953566A · Gore · 1976 [cited by applicant]
US 4252517A · Milford et al. · 1981 [cited by applicant]
US 4363738A · Kummermehr · 1982 [cited by applicant]
US 4447345A · Kummermehr et al. · 1984 [cited by applicant]
US 4454248A · Pollock et al. · 1984 [cited by applicant]
US 4532316A · Henn · 1985 [cited by applicant]
US 4610863A · Tewari et al. · 1986 [cited by applicant]
US 4619908A · Cheng et al. · 1986 [cited by applicant]
US 4666948A · Woerner et al. · 1987 [cited by applicant]
US 4667417A · Graser et al. · 1987 [cited by applicant]
US 4717708A · Cheng et al. · 1988 [cited by applicant]
US 4904328A · Beecher et al. · 1990 [cited by applicant]
US 4966919A · Williams, Jr. et al. · 1990 [cited by applicant]
US 5026591A · Henn et al. · 1991 [cited by applicant]
US 5037859A · Williams, Jr. et al. · 1991 [cited by applicant]
US 5124101A · Hirao et al. · 1992 [cited by applicant]
US 5124364A · Wolff et al. · 1992 [cited by applicant]
US 5137927A · Wolff et al. · 1992 [cited by applicant]
US 5229429A · Hahn et al. · 1993 [cited by applicant]
US 5275796A · Tillotson et al. · 1994 [cited by applicant]
US 5306555A · Ramamurthi et al. · 1994 [cited by applicant]
US 5395805A · Droege et al. · 1995 [cited by applicant]
US 5420168A · Mayer et al. · 1995 [cited by applicant]
US 5502156A · St et al. · 1996 [cited by applicant]
US 5520960A · Rancourt et al. · 1996 [cited by applicant]
US 5565142A · Deshpande et al. · 1996 [cited by applicant]
US 5569513A · Fidler et al. · 1996 [cited by applicant]
US 5631097A · Andersen et al. · 1997 [cited by applicant]
US 5683772A · Andersen et al. · 1997 [cited by applicant]
US 5691392A · Okoroafor et al. · 1997 [cited by applicant]
US 5786059A · Frank et al. · 1998 [cited by applicant]
US 5789075A · Frank et al. · 1998 [cited by applicant]
US 5814405A · Branca et al. · 1998 [cited by applicant]
US 5830387A · Yokogawa et al. · 1998 [cited by applicant]
US 5866027A · Frank et al. · 1999 [cited by applicant]
US 5889071A · Biesmans et al. · 1999 [cited by applicant]
US 5962539A · Perrut et al. · 1999 [cited by applicant]
US 5972254A · Sander · 1999 [cited by applicant]
US 5973015A · Coronado et al. · 1999 [cited by applicant]
US 6034146A · Falke · 2000 [cited by examiner]
US 6040375A · Behme et al. · 2000 [cited by applicant]
US 6068882A · Ryu · 2000 [cited by applicant]
US 6080219A · Jha et al. · 2000 [cited by applicant]
US 6080475A · Frank et al. · 2000 [cited by applicant]
US 6083619A · Frank et al. · 2000 [cited by applicant]
US 6087407A · Coronado et al. · 2000 [cited by applicant]
US 6121336A · Okoroafor et al. · 2000 [cited by applicant]
US 6136216A · Fidler et al. · 2000 [cited by applicant]
US 6140377A · Schwertfeger et al. · 2000 [cited by applicant]
US 6147134A · Eling · 2000 [cited by applicant]
US 6187250B1 · Champagne · 2001 [cited by applicant]
US 6187831B1 · Miller et al. · 2001 [cited by applicant]
US 6197270B1 · Sonoda et al. · 2001 [cited by applicant]
US 6315971B1 · Wallace et al. · 2001 [cited by applicant]
US 6316092B1 · Frank et al. · 2001 [cited by applicant]
US 6399669B1 · Suzuki et al. · 2002 [cited by applicant]
US 6479416B1 · Frank et al. · 2002 [cited by applicant]
US 6544618B1 · Smith · 2003 [cited by applicant]
US 6620355B1 · Schmidt · 2003 [cited by applicant]
US 6656527B1 · Gessner et al. · 2003 [cited by applicant]
US 6670402B1 · Lee et al. · 2003 [cited by applicant]
US 6719947B1 · Jha et al. · 2004 [cited by applicant]
US 6770584B2 · Barney et al. · 2004 [cited by applicant]
US 6887563B2 · Frank et al. · 2005 [cited by applicant]
US 6989123B2 · Lee et al. · 2006 [cited by applicant]
US 7071287B2 · Rhine et al. · 2006 [cited by applicant]
US 7074880B2 · Rhine et al. · 2006 [cited by applicant]
US 7078359B2 · Stepanian et al. · 2006 [cited by applicant]
US 7101607B2 · Mollendorf et al. · 2006 [cited by applicant]
US 7112234B2 · Jha et al. · 2006 [cited by applicant]
US 7118801B2 · Ristic-Lehmann et al. · 2006 [cited by applicant]
US 7399439B2 · Lee et al. · 2008 [cited by applicant]
US 7504346B2 · Stepanian et al. · 2009 [cited by applicant]
US 7780890B2 · Lee et al. · 2010 [cited by applicant]
US 7781492B2 · Williams et al. · 2010 [cited by applicant]
US 7816413B2 · Feaver et al. · 2010 [cited by applicant]
US 7833916B2 · Leeser et al. · 2010 [cited by applicant]
US 7977411B2 · Williams et al. · 2011 [cited by applicant]
US 8105512B1 · Lucas et al. · 2012 [cited by applicant]
US 8214980B2 · Bullock et al. · 2012 [cited by applicant]
US 8453393B2 · Schroth et al. · 2013 [cited by applicant]
US 8546457B2 · Alteheld et al. · 2013 [cited by applicant]
US 8691883B2 · Cho et al. · 2014 [cited by applicant]
US 8937106B2 · Steinke et al. · 2015 [cited by applicant]
US 9077041B2 · Burnside et al. · 2015 [cited by applicant]
US 9199394B2 · Brown et al. · 2015 [cited by applicant]
US 9605427B2 · Besselievre et al. · 2017 [cited by applicant]
US 9868843B2 · Evans et al. · 2018 [cited by applicant]
US 10227472B2 · Evans et al. · 2019 [cited by applicant]
US 10233302B2 · Evans et al. · 2019 [cited by applicant]
US 10233303B2 · Evans et al. · 2019 [cited by applicant]
US 10253159B2 · Evans et al. · 2019 [cited by applicant]
US 11547977B2 · Mihalcik et al. · 2023 [cited by applicant]
US 12005413B2 · Mihalcik et al. · 2024 [cited by applicant]
US 20020094426A1 · Stepanian et al. · 2002 [cited by applicant]
US 20030003284A1 · Schwertfeger et al. · 2003 [cited by applicant]
US 20040142149A1 · Mollendorf et al. · 2004 [cited by applicant]
US 20050046086A1 · Lee et al. · 2005 [cited by applicant]
US 20050100728A1 · Ristic-Lehmann et al. · 2005 [cited by applicant]
US 20050192366A1 · Ou et al. · 2005 [cited by applicant]
US 20050192367A1 · Ou et al. · 2005 [cited by applicant]
US 20060054296A1 · Eriksson · 2006 [cited by applicant]
US 20060240216A1 · Stepanian et al. · 2006 [cited by applicant]
US 20060263587A1 · Ou et al. · 2006 [cited by applicant]
US 20060264132A1 · Leeser et al. · 2006 [cited by applicant]
US 20060269734A1 · Krajewski et al. · 2006 [cited by applicant]
US 20060286360A1 · Rhine et al. · 2006 [cited by applicant]
US 20070014979A1 · Bullock et al. · 2007 [cited by applicant]
US 20070128391A1 · Giacobone et al. · 2007 [cited by applicant]
US 20070152363A1 · Begag et al. · 2007 [cited by applicant]
US 20070173157A1 · Trifu et al. · 2007 [cited by applicant]
US 20070213417A1 · Stork et al. · 2007 [cited by applicant]
US 20070259979A1 · Lee · 2007 [cited by applicant]
US 20070272902A1 · Evans et al. · 2007 [cited by applicant]
US 20080057334A1 · Schroth et al. · 2008 [cited by applicant]
US 20080214690A1 · Komatsu et al. · 2008 [cited by applicant]
US 20080229704A1 · Augustyniak et al. · 2008 [cited by applicant]
US 20080287561A1 · Dalzell et al. · 2008 [cited by applicant]
US 20090029109A1 · Seth et al. · 2009 [cited by applicant]
US 20090029147A1 · Tang · 2009 [cited by examiner]
US 20100080949A1 · Ou et al. · 2010 [cited by applicant]
US 20100089551A1 · Quadbeck-Seeger et al. · 2010 [cited by applicant]
US 20110252739A1 · Leeser et al. · 2011 [cited by applicant]
US 20120064287A1 · Park et al. · 2012 [cited by applicant]
US 20120094062A1 · Park et al. · 2012 [cited by applicant]
US 20120097907A1 · Bauer et al. · 2012 [cited by applicant]
US 20120112117A1 · Vo et al. · 2012 [cited by applicant]
US 20120128958A1 · Zeng et al. · 2012 [cited by applicant]
US 20120142240A1 · Eling et al. · 2012 [cited by applicant]
US 20120142802A1 · Steinke et al. · 2012 [cited by applicant]
US 20120142804A1 · Blackwell · 2012 [cited by applicant]
US 20120169016A1 · Hisano et al. · 2012 [cited by applicant]
US 20130171439A1 · Shoseyov et al. · 2013 [cited by applicant]
US 20130196137A1 · Evans et al. · 2013 [cited by applicant]
US 20130337255A1 · Steinke et al. · 2013 [cited by applicant]
US 20130344279A1 · Doshi et al. · 2013 [cited by applicant]
US 20140044929A1 · Evans et al. · 2014 [cited by applicant]
US 20140110332A1 · Hirai et al. · 2014 [cited by applicant]
US 20140128488A1 · Lotti et al. · 2014 [cited by applicant]
US 20140287641A1 · Steiner, III · 2014 [cited by applicant]
US 20140349057A1 · Blackford et al. · 2014 [cited by applicant]
US 20150114696A1 · Hong et al. · 2015 [cited by applicant]
US 20160032584A1 · Doshi et al. · 2016 [cited by applicant]
US 20160096949A1 · Evans et al. · 2016 [cited by applicant]
US 20160115685A1 · Bonnardel et al. · 2016 [cited by applicant]
US 20160347924A1 · Min et al. · 2016 [cited by applicant]
US 20170210092A1 · Rikleen et al. · 2017 [cited by applicant]
US 20170210093A1 · Rikleen et al. · 2017 [cited by applicant]
US 20180094114A1 · Evans et al. · 2018 [cited by applicant]
US 20180112057A1 · Evans et al. · 2018 [cited by applicant]
US 20180112058A1 · Evans et al. · 2018 [cited by applicant]
US 20180134867A1 · Evans et al. · 2018 [cited by applicant]
US 20190203014A1 · Evans et al. · 2019 [cited by applicant]
US 20190374921A1 · Mihalcik et al. · 2019 [cited by applicant]
US 20230085627A1 · Mihalcik et al. · 2023 [cited by applicant]
AU 2019279894B2 · 2024 [cited by applicant]
BR 112020024176A2 · 2021 [cited by applicant]
CA 3101986A1 · 2019 [cited by applicant]
CN 102583407A · 2012 [cited by applicant]
CN 112512679A · 2021 [cited by applicant]
CN 112512679B · 2023 [cited by applicant]
CN 116532055A · 2023 [cited by applicant]
DE 102010033379A1 · 2012 [cited by applicant]
EP 0340707A2 · 1989 [cited by applicant]
EP 1808454A2 · 2007 [cited by applicant]
EP 2397513A2 · 2011 [cited by applicant]
EP 3801868A1 · 2021 [cited by applicant]
GB 2464369A · 2010 [cited by applicant]
HK 40041715A · 2021 [cited by applicant]
ID P000088106B · 2023 [cited by applicant]
IN 448702B · 2023 [cited by applicant]
JP H0834678A · 1996 [cited by applicant]
JP 2002059443A · 2002 [cited by applicant]
JP 2002275305A · 2002 [cited by applicant]
JP 2004306571A · 2004 [cited by applicant]
JP 2010047710A · 2010 [cited by applicant]
JP 2011005676A · 2011 [cited by applicant]
JP 2012225409A · 2012 [cited by applicant]
JP 2014040750A · 2014 [cited by applicant]
JP 2016074841A · 2016 [cited by applicant]
JP 2017036745A · 2017 [cited by applicant]
JP 2017533163A · 2017 [cited by applicant]
JP 2021525699A · 2021 [cited by applicant]
JP 7384838B2 · 2023 [cited by applicant]
KR 20170063800A · 2017 [cited by applicant]
KR 20210014675A · 2021 [cited by applicant]
RU 2161143C2 · 2000 [cited by applicant]
RU 2811474C2 · 2024 [cited by applicant]
SG 11202011338 · 2020 [cited by applicant]
WO WO9710188A1 · 1997 [cited by applicant]
WO WO0194436A2 · 2001 [cited by applicant]
WO WO2008051029A1 · 2008 [cited by applicant]
WO WO2012021499A1 · 2012 [cited by applicant]
WO WO2012076492A1 · 2012 [cited by applicant]
WO WO2013014683A1 · 2013 [cited by applicant]
WO WO2016054524A2 · 2016 [cited by applicant]
WO WO2019232087A1 · 2019 [cited by applicant]
Ptacek et al (“The kinetic analysis of the thermal decomposition of kaolinite by DTG technique”, Powder Technology 208 (2011) 20-25) (Year: 2011). [cited by examiner]
“Canadian Application Serial No. 3,101,986, Response filed Aug. 16, 2024 to Examiners Rule 86(2) Report mailed Feb. 9, 2024”, 30 pgs. [cited by applicant]
“U.S. Appl. No. 16/425,825, Examiner Interview Summary mailed Oct. 25, 2022”, 2 pgs. [cited by applicant]
“U.S. Appl. No. 16/425,825, Final Office Action mailed Apr. 20, 2022”, 21 pgs. [cited by applicant]
“U.S. Appl. No. 16/425,825, Non Final Office Action mailed Apr. 14, 2021”, 7 pgs. [cited by applicant]
“U.S. Appl. No. 16/425,825, Non Final Office Action mailed Sep. 7, 2022”, 19 pgs. [cited by applicant]
“U.S. Appl. No. 16/425,825, Notice of Allowance mailed Nov. 23, 2022”, 14 pgs. [cited by applicant]
“U.S. Appl. No. 16/425,825, Response filed Feb. 19, 2021 to Restriction Requirement mailed Jan. 13, 2021”, 13 pgs. [cited by applicant]
“U.S. Appl. No. 16/425,825, Response filed Jun. 3, 2022 to Final Office Action mailed Apr. 20, 2022”, 14 pgs. [cited by applicant]
“U.S. Appl. No. 16/425,825, Response filed Aug. 11, 2021 to Non Final Office Action mailed Apr. 14, 2021”, 18 pgs. [cited by applicant]
“U.S. Appl. No. 16/425,825, Response filed Oct. 21, 2022 to Non Final Office Action mailed Sep. 7, 2022”, 12 pgs. [cited by applicant]
“U.S. Appl. No. 16/425,825, Restriction Requirement mailed Jan. 13, 2021”, 7 pgs. [cited by applicant]
“U.S. Appl. No. 16/425,825, Third-Party Submission filed Jun. 16, 2020”, 34 pgs. [cited by applicant]
“U.S. Appl. No. 18/056,067, Corrected Notice of Allowability mailed Feb. 14, 2024”, 8 pgs. [cited by applicant]
“U.S. Appl. No. 18/056,067, Non Final Office Action mailed Oct. 12, 2023”, 10 pgs. [cited by applicant]
“U.S. Appl. No. 18/056,067, Notice of Allowance mailed Feb. 1, 2024”, 9 pgs. [cited by applicant]
“U.S. Appl. No. 18/056,067, Response filed Oct. 31, 2023 to Non Final Office Action mailed Oct. 12, 2023”, 7 pgs. [cited by applicant]
“Australian Application Serial No. 2019279894, First Examination Report mailed Mar. 19, 2024”, 3 pgs. [cited by applicant]
“Australian Application Serial No. 2019279894, Response filed Jun. 24, 2024 to First Examination Report mailed Mar. 19, 2024”, 18 pgs. [cited by applicant]
“Brazilian Application Serial No. BR112020024176-8, Office Action mailed Jan. 23, 2023”, with English claims, 9 pgs. [cited by applicant]
“Brazilian Application Serial No. BR112020024176-8, Response filed Jun. 9, 2023 to Office Action mailed Jan. 23, 2023”, with machine translation, 17 pgs. [cited by applicant]
“Canadian Application Serial No. 3,101,986, Examiners Rule 86(2) Report mailed Feb. 9, 2024”, 5 pgs. [cited by applicant]
“Chinese Application Serial No. 201980050544.X, Office Action mailed Jun. 20, 2022”, w/ English Translation, 10 pgs. [cited by applicant]
“Chinese Application Serial No. 201980050544.X, Response filed Jan. 6, 2023”, with English claims, 12 pgs. [cited by applicant]
“Chinese Application Serial No. 201980050544.X, Response filed Nov. 7, 2022 to Office Action mailed Jun. 20, 2022”, with machine translation, 7 pgs. [cited by applicant]
“Chinese Application Serial No. 201980050544.X, Response filed Dec. 28, 2022”, with English claims, 12 pgs. [cited by applicant]
“Chinese Application Serial No. 202310347878.1, Notification to Make Rectification mailed Apr. 28, 2023”, with machine translation, 3 pgs. [cited by applicant]
“European Application Serial No. 19731087.3, Communication pursuant to Article 94(3) EPC mailed Jun. 29, 2022”, 6 pgs. [cited by applicant]
“European Application Serial No. 19731087.3, Response filed Sep. 30, 2022 to Communication pursuant to Article 94(3) EPC mailed Jun. 29, 2022”, 8 pgs. [cited by applicant]
“European Application Serial No. 19731087.3, Response to Communication pursuant to Rules 161(1) and 162 EPC filed Jul. 29, 2021”, 13 pgs. [cited by applicant]
“Indian Application Serial No. 202037051240, First Examination Report mailed Mar. 14, 2022”, 8 pgs. [cited by applicant]
“Indian Application Serial No. 202037051240, Response filed Sep. 13, 2022 to First Examination Report mailed Mar. 14, 2022”, 12 pgs. [cited by applicant]
“Indonesian Application Serial No. P00202009001, Response filed Dec. 28, 2022”, with machine translation and English claims, 242 pgs. [cited by applicant]
“Indonesian Application Serial No. P00202214421, Response filed Oct. 24, 2023 to Substantive Examination Report mailed Jul. 24, 2023”, w/ English claims, 272 pgs. [cited by applicant]
“Indonesian Application Serial No. P00202214421, Response filed Dec. 8, 2022”, with English claims, 240 pgs. [cited by applicant]
“Indonesian Application Serial No. P00202214421, Substantive Examination Report mailed Jul. 24, 2023”, with machine Translation, 6 pgs. [cited by applicant]
“International Application Serial No. PCT/US2019/034448, International Preliminary Report on Patentability mailed Dec. 10, 2020”, 16 pgs. [cited by applicant]
“International Application Serial No. PCT/US2019/034448, International Search Report mailed Nov. 6, 2019”, 8 pgs. [cited by applicant]
“International Application Serial No. PCT/US2019/034448, Invitation to Pay Additional Fees mailed Sep. 12, 2019”, 18 pgs. [cited by applicant]
“International Application Serial No. PCT/US2019/034448, Written Opinion mailed Nov. 6, 2019”, 14 pgs. [cited by applicant]
“Japanese Application Serial No. 2020-566921, Notification of Reasons for Refusal mailed Jan. 10, 2023”, w/ English Translation, 10 pgs. [cited by applicant]
“Japanese Application Serial No. 2020-566921, Response filed Jul. 10, 2023 to Notification of Reasons for Refusal mailed Jan. 10, 2023”, with English claims, 44 pgs. [cited by applicant]
“Korean Application Serial No. 10-2020-7037508, Notice of Preliminary Rejection mailed Feb. 8, 2024”, w/ English Translation, 12 pgs. [cited by applicant]
“Korean Application Serial No. 10-2020-7037508, Response filed May 3, 2024 to Notice of Preliminary Rejection mailed Feb. 8, 2024”, W/English Claims, 25 pgs. [cited by applicant]
“Malaysia Application Serial No. PI2020006009, Response filed Jan. 11, 2024 to Substantive Examination Adverse Report mailed Oct. 23, 2023”, w/ English claims, 71 pgs. [cited by applicant]
“Russian Application Serial No. 201810967520.8, Official Action mailed Nov. 17, 2022”, w/ English Translation, 13 pgs. [cited by applicant]
“Russian Application Serial No. 201810967520.8, Response filed Mar. 27, 2023 to Official Action mailed Nov. 17, 2022”, with English claims, 20 pgs. [cited by applicant]
“Russian Application Serial No. 2020143275, Office Action mailed May 24, 2023”, with English translation, 12 pgs. [cited by applicant]
“Russian Application Serial No. 2020143275, Response filed Sep. 15, 2023 to Office Action mailed May 24, 23”, with English claims, 19 pgs. [cited by applicant]
“Singapore Application Serial No. 11202011338T, Office Action mailed Apr. 15, 2024”, 5 pgs. [cited by applicant]
“Singapore Application Serial No. 11202011338T, Response filed Mar. 15, 2024 to Search Report and Written Opinion mailed Oct. 18, 2023”, 10 pgs. [cited by applicant]
“Singapore Application Serial No. 11202011338T, Response filed Jun. 5, 2024 to Office Action mailed Apr. 15, 2024”, 14 pgs. [cited by applicant]
“Singapore Application Serial No. 11202011338T, Search Report and Written Opinion mailed Oct. 18, 2023”, 10 pgs. [cited by applicant]
Chen, Z, “Preparation and characteristics of composite phase change material (CPCM) with SiO2 and diatomite as endothermal-hydroscopic material”, Energy and Buildings, vol. 86, (2015), 1-6. [cited by applicant]
Dohnalova, et al., “Characterization of Kaolin Dispersion using Acoustic and Electroacoustic Spectroscopy”, Journal of Mining and Metallurgy Section B Metallurgy 44(1), (2008), 10 pgs. [cited by applicant]
Eslah, Sanaz, et al., “Electrospinning and characterization of poly (vinyl alcohol)-sericin nanofibers as a potential for tissue engineering applications”, The Journal of the Textile Institute, 2016, vol. 107, No. 8, (A… [cited by applicant]
Gharehbagh, et al., “Polyurethane Flexible Foam Fire Behavior”, INTECH, (2012), 101-120. [cited by applicant]
Guao, Jiao, “Clay reinforced polyimide/silica hybrid aerogel”, Journal of materials chemistry A vol. 1 No. 24, (May 7, 2013), 7211-7221. [cited by applicant]
Kistler, S. S, “Coherent Expanded-Aerogels”, The Journal of Physical Chemistry, vol. 36, No. 1, (1932), 52-64. [cited by applicant]
Liu, Hongli, et al., “Novel Three-Dimensional Halloysite Nanotubes/Silica Composite Aerogels with Enhanced Mechanical Strength and Low Thermal Conductivity Prepared At Ambient Pressure”, Journal Of Sol-Gel Science And T… [cited by applicant]