IP Library Granted Patent US 12,361,259
Granted Patent B2
US 12,361,259 · App. 18/665,843 · Granted Jul 15, 2025

Neural network chip for ear-worn device

Inventors: Andrew Casper (Inver Grove Heights, MN); Matthew de Jonge (Brooklyn, NY); Igor Lovchinsky (New York, NY); Nicholas Morris (Brooklyn, NY); Jonathan Macoskey (Pittsburgh, PA)
Assignee: Chromatic Inc.
G06N3/044G06F7/5443G06F9/5016H04R25/507
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,361,259
App. No.
18/665,843
Granted
Jul 15, 2025
Kind
B2
Abstract

A hearing aid may include a neural network chip having tiles arranged in an array, each tile including memory, 16-128 multiplier-accumulator circuits (MACs), and routing circuitry. The memory of each tile may be configured to store a portion of elements of a matrix A comprising weights of a recurrent neural network. Each tile may be configured to receive and store elements of an activation vector X, and all tiles in a column of the array may be configured to receive the same elements of X. The plurality of tiles may be configured to perform a matrix-vector multiplication A*X by performing multiply-and-accumulate sub-operations in parallel among the plurality of tiles. The routing circuitry from the tiles in each respective row of tiles may be configured to combine results of the multiply-and-accumulate sub-operations.

Claims (71)

1. An ear-worn device, comprising:

a neural network chip, comprising:

a plurality of tiles arranged in a tile array, each tile comprising memory, a number of multiplier-accumulator circuits (MACs), and routing circuitry;

wherein:

the memory of each tile is configured to store a portion of elements of a matrix A comprising weights of a neural network;

each tile is configured to receive and store elements of an activation vector X, wherein the activation vector X is derived from an input audio signal;

all or a subset of the plurality of tiles are configured to perform a matrix-vector multiplication A*X by performing multiply-and-accumulate sub-operations in parallel among all or the subset of the plurality of tiles;

routing circuitries of tiles in the tile array are configured to combine results of the multiply-and-accumulate sub-operations; and

a tile of the plurality of tiles is configured to share an element of the activation vector X across calculations performed by multiple MACs in the tile.

2. The ear-worn device of claim 1 , wherein the tile of the plurality of tiles is configured, when sharing the element of the activation vector X across the calculations performed by the multiple MACs in the tile, to share the element of the activation vector X across calculations performed by all MACs in the tile.

3. The ear-worn device of claim 1 , wherein the tile of the plurality of tiles is configured, when sharing the element of the activation vector X across the calculations performed by the multiple MACs in the tile, to share the element of the activation vector X across calculations performed by the multiple MACs in the tile on a single clock cycle.

4. The ear-worn device of claim 1 , wherein the tile of the plurality of tiles is configured, when sharing the element of the activation vector X across the calculations performed by the multiple MACs in the tile, to share the element of the activation vector X across calculations performed by all MACs in the tile on a single clock cycle.

5. The ear-worn device of claim 1 , wherein the routing circuitries of the tiles in the tile array are configured, when combining the results of the multiply-and-accumulate sub-operations, to combine the results of the multiply-and-accumulate sub-operations from each respective row of tiles in the tile array.

6. An ear-worn device, comprising:

a neural network chip, comprising:

a plurality of tiles arranged in a tile array, each tile comprising memory, a number of multiplier-accumulator circuits (MACs), and routing circuitry;

wherein:

the memory of each tile is configured to store a portion of elements of a matrix A comprising weights of a neural network;

each tile is configured to receive and store elements of an activation vector X, wherein the activation vector X is derived from an input audio signal;

all or a subset of the plurality of tiles are configured to perform a matrix-vector multiplication A*X by performing multiply-and-accumulate sub-operations in parallel among all or the subset of the plurality of tiles;

routing circuitries of tiles in the tile array are configured to combine results of the multiply-and-accumulate sub-operations; and

a tile of the plurality of tiles is configured to fan out a single element of the activation vector X from the memory to each of multiple MACs in the tile.

7. The ear-worn device of claim 6 , wherein the tile of the plurality of tiles is configured, when fanning out the single element of the activation vector X from the memory to each of the multiple MACs in the tile, to simultaneously fan out the single element of the activation vector X from the memory to each of the multiple MACs in the tile.

8. The ear-worn device of claim 6 , wherein the tile of the plurality of tiles is configured, when fanning out the single element of the activation vector X from the memory to each of the multiple MACs in the tile, to fan out the single element of the activation vector X from the memory to all MACs in the tile.

9. The ear-worn device of claim 6 , wherein the tile of the plurality of tiles is configured, when fanning out the single element of the activation vector X from the memory to each of the multiple MACs in the tile, to simultaneously fan out the single element of the activation vector X from the memory to all MACs in the tile.

10. An ear-worn device, comprising:

a neural network chip, comprising:

a plurality of tiles arranged in a tile array, each tile comprising memory, a number of multiplier-accumulator circuits (MACs), and routing circuitry; and

a vector memory storing an activation vector X derived from an input audio signal;

wherein:

the memory of each tile is configured to store a portion of elements of a matrix A comprising weights of a neural network;

each tile is configured to receive and store elements of the activation vector X;

all or a subset of the plurality of tiles are configured to perform a matrix-vector multiplication A*X by performing multiply-and-accumulate sub-operations in parallel among all or the subset of the plurality of tiles;

routing circuitries of tiles in the tile array are configured to combine results of the multiply-and-accumulate sub-operations; and

groups of tiles in the tile array are coupled to the vector memory only by a single, shared bus.

11. The ear-worn device of claim 10 , wherein each group of the groups of tiles comprises tiles in a single column of the tile array.

12. An ear-worn device, comprising:

a neural network chip, comprising:

a plurality of tiles arranged in a tile array, each tile comprising memory, a number of multiplier-accumulator circuits (MACs), and routing circuitry; and

a vector memory storing an activation vector X derived from an input audio signal;

wherein:

the memory of each tile is configured to store a portion of elements of a matrix A comprising weights of a neural network;

each tile is configured to receive and store elements of the activation vector X;

all or a subset of the plurality of tiles are configured to perform a matrix-vector multiplication A*X by performing multiply-and-accumulate sub-operations in parallel among all or the subset of the plurality of tiles;

routing circuitries of tiles in the tile array are configured to combine results of the multiply-and-accumulate sub-operations; and

at least one tile in the tile array is not configured for transmitting data to at least one adjacent tile in the tile array.

13. The ear-worn device of claim 12 , wherein the at least one tile in the tile array is not configured for transmitting data to another tile in a same column of the tile array.

14. The ear-worn device of claim 12 , wherein the tile array lacks independent connections between adjacent tiles in a column of the tile array.

15. An ear-worn device, comprising:

a neural network chip, comprising:

a plurality of tiles arranged in a tile array, each tile comprising memory, a number of multiplier-accumulator circuits (MACs), and routing circuitry; and

a vector memory storing an activation vector X derived from an input audio signal;

wherein:

the memory of each tile is configured to store a portion of elements of a matrix A comprising weights of a neural network;

each tile is configured to receive and store elements of the activation vector X;

all or a subset of the plurality of tiles are configured to perform a matrix-vector multiplication A*X by performing multiply-and-accumulate sub-operations in parallel among all or the subset of the plurality of tiles;

routing circuitries of tiles in the tile array are configured to combine results of the multiply-and-accumulate sub-operations; and

all memory in the plurality of tiles together comprises no more than approximately 40 Mbits of memory for the weights of the neural network.

16. An ear-worn device, comprising:

a neural network chip, comprising:

a plurality of tiles arranged in a tile array, each tile comprising memory, a number of multiplier-accumulator circuits (MACs), and routing circuitry;

wherein:

the memory of each tile is configured to store a portion of elements of a matrix A comprising weights of a neural network;

each tile is configured to receive and store elements of an activation vector X, wherein the activation vector X is derived from an input audio signal;

all or a subset of the plurality of tiles are configured to perform a matrix-vector multiplication A*X by performing multiply-and-accumulate sub-operations in parallel among all or the subset of the plurality of tiles;

routing circuitries of tiles in the tile array are configured to combine results of the multiply-and-accumulate sub-operations; and

the neural network chip is configured to achieve a power efficiency of at least 4 GOPs/milliwatt when operating at 100 GOPs/second.

17. The ear-worn device of claim 16 , wherein the neural network comprises up to 10M 8-bit weights.

18. The ear-worn device of claim 17 , wherein the 100 GOPs/second are performed on time series data.

19. The ear-worn device of claim 18 , wherein the neural network chip is at 40 degrees Celsius, uses supply voltages between 0.5-1.8V, and is performing operations without idling.

20. The ear-worn device of claim 16 , wherein the neural network chip has an area less than 20 mm 2 .

Assignments (1)
CHANGE OF NAME Recorded Oct 9, 2025
From: CHROMATIC INC.
To: FORTELL RESEARCH INC.
Reel/Frame 073065/0936 →
Continuity (4)
Continuation 18411730 · Jan 12, 2024
Continuation 18232854 · Aug 11, 2023
Provisional Application 63514641 · Jul 20, 2023
Related Publication 20250028930A1 · Jan 23, 2025
References Cited (25)
US 10504022B2 · Temam · 2019 [cited by examiner]
US 11330378B1 · Jelčicová · 2022 [cited by examiner]
US 20180129933A1 · Wang · 2018 [cited by examiner]
US 20200034148A1 · Sumbul et al. · 2020 [cited by applicant]
US 20210287074A1 · Coenen · 2021 [cited by examiner]
US 20220027152A1 · Ware · 2022 [cited by examiner]
US 20220172052A1 · Bunandar · 2022 [cited by examiner]
US 20220256294A1 · Diehl et al. · 2022 [cited by applicant]
US 20220334776A1 · Lew et al. · 2022 [cited by applicant]
US 20220405598A1 · Lichtenau · 2022 [cited by examiner]
JP 2001117900A · 2001 [cited by applicant]
“GAP9 Next Generation Processor for Hearables and Smart Sensors”, Greenwaves Technologies, 2021, 2 pages. [cited by applicant]
C. Zhang, et al., “Optimizing FPGA-based Accelerator Design for Deep Convolution Neural Networks”, pp. 161-170, FPGA'15, Feb. 22-24, 2015, Monterey California, CA, ACM. [cited by applicant]
E. Nurvitadhi, et al, “Accelerating Binarized Neural Networks: Comparison of FPGA, CPU, GPU, and ASIC”, 2016 IEEE, 8 pages. [cited by applicant]
E. Nurvitadhi, et al., “Hardware Accelerator for Anayltics of Sparse Data”, Intel Corp., pp. 1616-1621, 2016, Design, Automation & Test in Europe Conference & Exhibition. [cited by applicant]
F. Conti, et al., “A Ultra-Low-Energy Convolution Engine for Fast Brain-Inspired Vision in Multicore Clusters”, pp. 683-688, 2015, Design, Automation & Test in Europe Conference & Exhibition. [cited by applicant]
J. Li, et al., “CSCNN: Algorithm-hardware Co-design for CNN Accelerators using Centrosymmetric Filters”, 14 pages. [cited by applicant]
K. Ando, et al., “BRein Memory: A Single-Chip Binary/Ternary Reconfigurable in-Memory Deep Neural Network Accelerator Achieving 1.4 TOPS at 0.6 W”, IEEE Journal of Solid-State Circuits, pp. 983-994, vol. 53, No. 4, Apr.… [cited by applicant]
K. Kiningham, et al., “Design and Analysis of a Hardware CNN Accelerator”, 8 pages. [cited by applicant]
K. Siu, “Reducing Off-Chip Memory Accesses in Deep Neural Network Accelerators”, 2019, 63 pages. [cited by applicant]
M. Capra, et al., “An Updated Survey of Efficient Hardward Architectures for Accelerating Deep Convolutional Neural Networks”, Future Internet 2020, 12, 113, 22 pgs. [cited by applicant]
Supervisor Prof. Mihai Teodor Lazarescu and Candidate Andrea Andrea Casale, “FPGA-based Deep Learning Inference Acceleration at the Edge”, 2020-2021, Master Degree Thesis, 100 pages. [cited by applicant]
T. Chen, et al., “DianNao a Small-Footprint High-Throughput Accelerator for Ubiquitous Machine-Learning”, ASPLOS'14, Mar. 1-5, 2014, ACM, pp. 269-283. [cited by applicant]
V. Sze, et al., “Efficient Processing of Deep Neural Networks: A Tutorial and Survey”, vol. 105, No. 12, Dec. 2017, Proceeding of the IEEE, pp. 2295-2329. [cited by applicant]
International Search Report and Written Opinion from International Application No. PCT/US2024/038704 mailed Dec. 6, 2024, 16 pages. [cited by applicant]