IP Library Granted Patent US 12,586,604
Granted Patent B2
US 12,586,604 · App. 18/671,094 · Granted Mar 24, 2026

Gimbal design for hard disk drive device

Inventors: Kuen Chee Ee (Chino, CA); Long Zhang (Winchester, CA); David Glaess (Bangkok, TH); Treesoon Kotchaplayuk (Wangnoi, TH)
Assignee: Magnecomp Corporation
G11B5/483G11B5/4873
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,586,604
App. No.
18/671,094
Granted
Mar 24, 2026
Kind
B2
Abstract

A head gimbal assembly includes a gimbal having a base portion and a tongue that are joined together by a neck portion, a circuit mounted on the gimbal, a slider mounted on the tongue and electrically connected to the circuit, a first PZT actuator having a proximal end mounted on a first bonding site of the circuit and a distal end mounted on a second bonding site of the circuit, and a second PZT actuator having a proximal end mounted on a third bonding site of the circuit and a distal end mounted on a fourth bonding site of the circuit. The first and third bonding sites do not overlap with and are not directly supported by the base portion. The second and fourth bonding sites overlap with and are directly supported by the tongue.

Claims (76)

1 . A head gimbal assembly comprising:

a gimbal having a base portion and a tongue that are joined together by a neck portion;

a circuit mounted on the gimbal;

a slider mounted on the tongue, and electrically connected to the circuit;

a first PZT actuator having a proximal end mounted on a first bonding site of the circuit and a distal end mounted on a second bonding site of the circuit; and

a second PZT actuator having a proximal end mounted on a third bonding site of the circuit and a distal end mounted on a fourth bonding site of the circuit;

wherein the first and third bonding sites do not overlap with and are not directly supported by the base portion, wherein a set of cutouts are formed in the base portion at the first bonding site and the third bonding site to remove a portion of the base portion disposed under the first bonding site and the third bonding site;

wherein the second and fourth bonding sites overlap with and are directly supported by the tongue.

2 . The head gimbal assembly of claim 1 , wherein:

wherein a portion of the circuit different from the first and third bonding sites overlaps with and is directly supported by the base portion.

3 . The head gimbal assembly of claim 1 , wherein the circuit and the slider are mounted on a first side of the gimbal.

4 . The head gimbal assembly of claim 1 , wherein the each of the first and second PZT actuators comprise:

a first layer of piezoelectric material;

a second layer of piezoelectric material disposed over the first layer of piezoelectric material;

a third layer of piezoelectric material disposed over the second layer of piezoelectric material;

a first electrode disposed under the first layer of piezoelectric material;

a second electrode disposed between the first and second layers of piezoelectric material;

a third electrode disposed between the second and third layers of piezoelectric material; and

a fourth electrode disposed over the fourth layer of piezoelectric material;

wherein the fourth electrode has a length that is shorter than lengths of the first, second and third electrodes.

5 . The head gimbal assembly of claim 1 , wherein the each of the first and second PZT actuators comprise:

a first layer of piezoelectric material;

a second layer of piezoelectric material disposed over the first layer of piezoelectric material;

a third layer of piezoelectric material disposed over the second layer of piezoelectric material;

a first electrode disposed under the first layer of piezoelectric material;

a second electrode disposed between the first and second layers of piezoelectric material;

a third electrode disposed between the second and third layers of piezoelectric material; and

a fourth electrode disposed over the fourth layer of piezoelectric material;

wherein the fourth electrode has a length that is shorter than a length of the third electrode.

6 . A suspension assembly comprising:

a baseplate;

a load beam connected to the baseplate by a hinge;

a gimbal mounted to the load beam, wherein the gimbal comprises a base portion and a tongue that are joined together by a neck portion;

a circuit mounted on the gimbal;

a slider mounted on the tongue, and electrically connected to the circuit;

a first PZT actuator having a proximal end mounted on a first bonding site of the circuit and a distal end mounted on a second bonding site of the circuit; and

a second PZT actuator having a proximal end mounted on a third bonding site of the circuit and a distal end mounted on a fourth bonding site of the circuit;

wherein the first and third bonding sites do not overlap with and are not directly supported by the base portion, wherein a set of cutouts are formed in the base portion at the first bonding site and the third bonding site to remove a portion of the base portion disposed under the first bonding site and the third bonding site;

wherein the second and fourth bonding sites overlap with and are directly supported by the tongue.

7 . The suspension assembly of claim 6 , wherein:

wherein a portion of the circuit different from the first and third bonding sites overlaps with and is directly supported by the base portion.

8 . The suspension assembly of claim 6 , wherein the circuit and the slider are mounted on a first side of the gimbal.

9 . The suspension assembly of claim 6 , wherein the each of the first and second PZT actuators comprise:

a first layer of piezoelectric material;

a second layer of piezoelectric material disposed over the first layer of piezoelectric material;

a third layer of piezoelectric material disposed over the second layer of piezoelectric material;

a first electrode disposed under the first layer of piezoelectric material;

a second electrode disposed between the first and second layers of piezoelectric material;

a third electrode disposed between the second and third layers of piezoelectric material; and

a fourth electrode disposed over the fourth layer of piezoelectric material;

wherein the fourth electrode has a length that is shorter than lengths of the first, second and third electrodes.

10 . The suspension assembly of claim 6 , wherein the each of the first and second PZT actuators comprise:

a first layer of piezoelectric material;

a second layer of piezoelectric material disposed over the first layer of piezoelectric material;

a third layer of piezoelectric material disposed over the second layer of piezoelectric material;

a first electrode disposed under the first layer of piezoelectric material;

a second electrode disposed between the first and second layers of piezoelectric material;

a third electrode disposed between the second and third layers of piezoelectric material; and

a fourth electrode disposed over the fourth layer of piezoelectric material;

wherein the fourth electrode has a length that is shorter than a length of the third electrode.

11 . A head gimbal assembly comprising:

a gimbal having a base portion and a tongue that are joined together by a neck portion, and being configured to receive a circuit;

the tongue being configured to receive a slider and the slider being electrically connected the circuit;

a first PZT actuator having a proximal end mounted on a first bonding site of the circuit and a distal end mounted on a second bonding site of the circuit; and

a second PZT actuator having a proximal end mounted on a third bonding site of the circuit and a distal end mounted on a fourth bonding site of the circuit;

wherein the first and third bonding sites do not overlap with and are not directly supported by the base portion, wherein a set of cutouts are formed in the base portion at the first bonding site and the third bonding site to remove a portion of the base portion disposed under the first bonding site and the third bonding site;

wherein the second and fourth bonding sites overlap with and are directly supported by the tongue.

12 . A suspension assembly comprising:

a baseplate;

a load beam connected to the baseplate by a hinge;

a gimbal mounted to the load beam, wherein the gimbal comprises a base portion and a tongue that are joined together by a neck portion, and being configured to receive a circuit;

the tongue being configured to receive a slider and the slider being electrically connected the circuit;

a first PZT actuator having a proximal end mounted on a first bonding site of the circuit and a distal end mounted on a second bonding site of the circuit; and

a second PZT actuator having a proximal end mounted on a third bonding site of the circuit and a distal end mounted on a fourth bonding site of the circuit;

wherein the first and third bonding sites do not overlap with and are not directly supported by the base portion, wherein a set of cutouts are formed in the base portion at the first bonding site and the third bonding site to remove a portion of the base portion disposed under the first bonding site and the third bonding site;

wherein the second and fourth bonding sites overlap with and are directly supported by the tongue.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 29, 2024
From: EE, KUEN CHEE; ZHANG, LONG; GLAESS, DAVID; KOTCHAPLAYUK, TREESOON
To: MAGNECOMP CORPORATION
Reel/Frame 067552/0057 →
Continuity (2)
Provisional Application 63469321 · May 26, 2023
Related Publication 20240395284A1 · Nov 28, 2024
References Cited (113)
US 5282103A · Hatch et al. · 1994 [cited by applicant]
US 5333085A · Prentice et al. · 1994 [cited by applicant]
US 5530606A · Baasch et al. · 1996 [cited by applicant]
US 5771136A · Girard · 1998 [cited by applicant]
US 5838517A · Frater et al. · 1998 [cited by applicant]
US 5892637A · Brooks, Jr. et al. · 1999 [cited by applicant]
US 5959807A · Jurgenson · 1999 [cited by applicant]
US 6163438A · Kajitani · 2000 [cited by applicant]
US 6172853B1 · Davis et al. · 2001 [cited by applicant]
US 6195237B1 · Perez · 2001 [cited by applicant]
US 6233121B1 · Pan · 2001 [cited by applicant]
US 6320729B1 · Coon · 2001 [cited by applicant]
US 6424498B1 · Patterson et al. · 2002 [cited by applicant]
US 6445546B1 · Coon · 2002 [cited by applicant]
US 6483670B1 · Watanabe · 2002 [cited by applicant]
US 6538850B1 · Hadian et al. · 2003 [cited by applicant]
US 6556383B2 · Murphy et al. · 2003 [cited by applicant]
US 6611402B1 · Mangold · 2003 [cited by applicant]
US 6747849B1 · Le et al. · 2004 [cited by applicant]
US 6757137B1 · Mei · 2004 [cited by applicant]
US 6801400B2 · Fu et al. · 2004 [cited by applicant]
US 6885523B1 · Summers et al. · 2005 [cited by applicant]
US 6967821B2 · Himes et al. · 2005 [cited by applicant]
US 6995953B2 · Mahoney et al. · 2006 [cited by applicant]
US 7006333B1 · Summers · 2006 [cited by applicant]
US 7010847B1 · Hadian et al. · 2006 [cited by applicant]
US 7085104B1 · Hadian et al. · 2006 [cited by applicant]
US 7307817B1 · Mei · 2007 [cited by applicant]
US 7551401B1 · Ciurea et al. · 2009 [cited by applicant]
US 7719797B1 · Mei · 2010 [cited by applicant]
US 7751149B1 · Mei · 2010 [cited by applicant]
US 7852604B2 · Sassine · 2010 [cited by applicant]
US 8107198B1 · Ee · 2012 [cited by applicant]
US 8116039B2 · Takikawa · 2012 [cited by applicant]
US 8351159B2 · Hirano et al. · 2013 [cited by applicant]
US 8446695B1 · Ee et al. · 2013 [cited by applicant]
US 8675314B1 · Bjorstrom et al. · 2014 [cited by applicant]
US 8837090B2 · Greminger et al. · 2014 [cited by applicant]
US 9025282B1 · Miller · 2015 [cited by applicant]
US 9064510B1 · Kikuchi · 2015 [cited by examiner]
US 9214176B1 · Sharma et al. · 2015 [cited by applicant]
US 9330698B1 · Hahn · 2016 [cited by examiner]
US 10276195B2 · Ee et al. · 2019 [cited by applicant]
US 10566016B2 · Yamada et al. · 2020 [cited by applicant]
US 11043236B1 · Pallay · 2021 [cited by applicant]
US 11176961B2 · Suzuki et al. · 2021 [cited by applicant]
US 11410693B2 · Ee et al. · 2022 [cited by applicant]
US 11495731B2 · Zhang · 2022 [cited by examiner]
US 11900972B2 · Ee et al. · 2024 [cited by applicant]
US 11915732B1 · Ee · 2024 [cited by applicant]
US 20010012182A1 · Boutaghou et al. · 2001 [cited by applicant]
US 20030137774A1 · Fu et al. · 2003 [cited by applicant]
US 20030202284A1 · Arya · 2003 [cited by applicant]
US 20040032695A1 · Sassine et al. · 2004 [cited by applicant]
US 20040070883A1 · Mahoney et al. · 2004 [cited by applicant]
US 20050028353A1 · Kidachi et al. · 2005 [cited by applicant]
US 20050180052A1 · Suzuki et al. · 2005 [cited by applicant]
US 20060034017A1 · Agari et al. · 2006 [cited by applicant]
US 20060092571A1 · Kang · 2006 [cited by applicant]
US 20060171080A1 · Yamaguchi · 2006 [cited by applicant]
US 20060209466A1 · Ono et al. · 2006 [cited by applicant]
US 20060274452A1 · Arya · 2006 [cited by applicant]
US 20060274453A1 · Arya · 2006 [cited by applicant]
US 20070070552A1 · Yao et al. · 2007 [cited by applicant]
US 20070247760A1 · Hanya et al. · 2007 [cited by applicant]
US 20070253115A1 · Yao et al. · 2007 [cited by applicant]
US 20090195938A1 · Yao et al. · 2009 [cited by applicant]
US 20090244786A1 · Hatch · 2009 [cited by applicant]
US 20100079915A1 · Kido · 2010 [cited by applicant]
US 20100315744A1 · Virmani et al. · 2010 [cited by applicant]
US 20100315745A1 · Virmani et al. · 2010 [cited by applicant]
US 20110085270A1 · Hirano et al. · 2011 [cited by applicant]
US 20120287536A1 · Kuwajima · 2012 [cited by applicant]
US 20140085754A1 · Hanya et al. · 2014 [cited by applicant]
US 20140085755A1 · Hanya et al. · 2014 [cited by applicant]
US 20140098440A1 · Miller et al. · 2014 [cited by applicant]
US 20140362476A1 · Miller et al. · 2014 [cited by applicant]
US 20150062758A1 · Miller et al. · 2015 [cited by applicant]
US 20170162218A1 · Miller et al. · 2017 [cited by applicant]
US 20170316796A1 · Kumar et al. · 2017 [cited by applicant]
US 20170330589A1 · Bjorstrom et al. · 2017 [cited by applicant]
US 20180005653A1 · Pokornowski et al. · 2018 [cited by applicant]
US 20180182418A1 · Ee · 2018 [cited by examiner]
US 20180294006A1 · Miller et al. · 2018 [cited by applicant]
US 20190066720A1 · Yamada · 2019 [cited by examiner]
US 20190362745A1 · Pokornowski · 2019 [cited by examiner]
US 20200091404A1 · Zhang · 2020 [cited by examiner]
US 20210012795A1 · Zhang · 2021 [cited by examiner]
US 20210151073A1 · Yamada · 2021 [cited by applicant]
US 20210280209A1 · Suzuki et al. · 2021 [cited by applicant]
US 20220157337A1 · Aoki · 2022 [cited by applicant]
US 20240161774A1 · Ee et al. · 2024 [cited by applicant]
CN 1828726A · 2006 [cited by applicant]
EP 1638086A2 · 2006 [cited by applicant]
EP 2105918A1 · 2009 [cited by applicant]
JP 2004326891A · 2004 [cited by applicant]
JP 201086630A · 2010 [cited by applicant]
JP 201467474A · 2014 [cited by applicant]
WO 2014190001A1 · 2014 [cited by applicant]
WO 2015027034A2 · 2015 [cited by applicant]
International Search Report and Written Opinion in International Application No. PCT/US2024/030892, mailed Aug. 30, 2024. [cited by applicant]
International Search Report and Written Opinion in International Application No. PCT/US2021/036642, mailed Sep. 22, 2021. [cited by applicant]
International Preliminary Report on Patentability in International Application No. PCT/US2021/036642, mailed Dec. 22, 2022. [cited by applicant]
Office Action in U.S. Appl. No. 17/342,297, dated Dec. 20, 2021. [cited by applicant]
Office Action in U.S. Appl. No. 17/342,297, dated Jun. 10, 2022. [cited by applicant]
Office Action in U.S. Appl. No. 17/342,297, dated Aug. 24, 2022. [cited by applicant]
Office Action in U.S. Appl. No. 17/342,297, dated Feb. 15, 2023. [cited by applicant]
Office Action in U.S. Appl. No. 17/342,297, dated Jun. 1, 2023. [cited by applicant]
Notice of Allowance in U.S. Appl. No. 17/342,297, dated Oct. 13, 2023. [cited by applicant]
Notice of Allowance in U.S. Appl. No. 18/212,586, dated Oct. 24, 2023. [cited by applicant]
Notification of Reasons for Rejection in Japanese Patent Application No. 2022-575922, dated Jul. 8, 2025. [cited by applicant]
Office Action in U.S. Appl. No. 18/421,150, dated Apr. 18, 2025. [cited by applicant]
Office Action in U.S. Appl. No. 18/421,150, dated Jul. 16, 2025. [cited by applicant]