CONTAINER MANUFACTURING METHOD

1 . A container manufacturing method comprising:

an RFID inlay disposing step of disposing an RFID inlay provided with a thermoplastic adhesive on an inner surface of a mold with the thermoplastic adhesive exposed; and

a molding step of supplying a heated material to the mold and molding a container provided with the RFID inlay on an outer surface thereof via the thermoplastic adhesive.

2 . The container manufacturing method according to claim 1 , wherein

the thermoplastic adhesive is provided on a surface of the RFID inlay on which an IC chip is disposed.

3 . The container manufacturing method according to claim 1 , wherein

a melting point of the thermoplastic adhesive is lower than a melting point of the material.

4 . The container manufacturing method according to claim 1 , wherein

a melting point of the thermoplastic adhesive is lower than a softening point of the material.

5 . The container manufacturing method according to claim 2 , wherein

the RFID inlay includes a substrate made of paper, an RFID antenna provided on the substrate, and the IC chip.

6 . The container manufacturing method according to claim 5 , wherein

the RFID antenna is made of metal, and the container is made of resin.

7 . The container manufacturing method according to claim 1 , further comprising:

before the RFID inlay disposing step, an adhesive disposing step of laminating a film formed of the thermoplastic adhesive on an RFID inlay continuous body in which the RFID inlays are connected.

8 . The container manufacturing method according to claim 1 , wherein

in the molding step, the container is molded by blow molding.

9 . The container manufacturing method according to claim 1 , wherein

in the molding step, the container is molded by injection molding.