IP Library Patent Application 18699571
Patent Application
App. No. 18/699,571

FILAMENT, ADDITIVE MANUFACTURING METHODS USING THE FILAMENT AND ARTICLES MANUFACTURED THEREBY

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Patent No.
US None
App. No.
18/699,571
Abstract

An additive manufacturing filament is provided, as are 3D manufacturing methods using the filament, and articles and composite materials made therefrom. The filament comprises a polymer composition, and the polymer composition comprises, in turn, at least 50 wt. % of a polyamide. The polyamide comprises recurring units R (PA1) from 30 mol % to 75 mol % recurring units R (PA1) according to formula (V′); and •from 25 mol % to 70 mol % of at least one of recurring units R (PA2) , R (PA3) a and R (PA4) , according to formulae (VI), (VII) and (VIII), respectively: •wherein ∘R 1 and R 2 are independently selected C 1 to C 3 alkyls; ∘R i , at each location, is selected from the group consisting of an alkyl, an aryl, an alkali or alkaline earth metal sulfonate, an alkyl sulfonate, and a quaternary ammonium; ∘i is an integer from 0 to 10; ∘R 3 is a C 7 -C 16 alkyl, preferably a C 7 -C 12 alkyl; ∘R 4 is a C 6 to C 20 alkyl or a C 6 to C 20 aryl, preferably a C 6 to C 16 alkyl or a C 6 to C 16 aryl, more preferably a C 6 to C 12 alkyl or a C 6 to C 12 aryl; and ∘mol % is relative to the total moles of recurring units in the polyamide. The filament has a cylindrical geometry and a diameter between 0.5 mm and 5 mm.

Claims (57)

1 . An additive manufacturing filament comprising a polymer composition (PC) which comprises at least 50.0 wt. % of at least one polyamide (PA) formed from polycondensation of a diamine component (A) and a diacid component (B), wherein:

the diamine component (A) consists essentially of:

a) between 40.0 and 80.0 mol % of at least one bis(aminoalkyl)cyclohexane represented by formula (I):

where the CH 2 — amino groups are relatively positioned in the meta position (1,3-) or the para position (1,4-); and

b) between 20.0 and 60.0 mol % of at least one diamine of formula (II):

H 2 N—R 3 —NH 2   (II)

where R 3 is a C 7 -C 16 aliphatic alkylene group;

wherein proportions in mol % are based on a total amount of diamines in the diamine component (A);

the diacid component (B) consists essentially of:

c) between 70.0 and 100.0 mol. % of terephthalic acid;

d) between 0 and 30.0 mol. % of at least one dicarboxylic acid other than terephthalic acid of formula (III):

HOOC—R 4 —COOH  (III)

where R 4 is a C 4 -C 20 alkylene group or a C 7 -C 20 arylene group;

wherein proportions in mol % are based on a total amount of diacids in the diacid component (B).

2 . (canceled)

3 . (canceled)

4 . (canceled)

5 . (canceled)

6 . (canceled)

7 . (canceled)

8 . (canceled)

9 . The filament of claim 1 , wherein the bis(aminoalkyl)cyclohexane is 1,3-bis(aminomethyl)cyclohexane.

10 . The filament of claim 1 , wherein the diamine of formula (II) is selected from the group consisting of 1,9-diaminononane, 1,10-diaminodecane and a combination of said two amines.

11 . The filament of claim 1 , wherein the proportion of terephthalic acid in the diacid component (B) is 100.0 mol %.

12 . The filament of claim 1 , wherein the proportion of terephthalic acid in the diacid component (B) is between 80.0 and 95.0 mol %.

13 . The filament of claim 1 , wherein the proportion of the dicarboxylic acid(s) other than terephthalic acid in the diacid component (B) is between 5.0 and 20.0 mol %.

14 . (canceled)

15 . The filament of claim 1 , wherein the dicarboxylic acid of formula (III) is selected from the group consisting of adipic acid, isophthalic acid and a combination of two or more of said diacids.

16 . (canceled)

17 . (canceled)

18 . (canceled)

19 . (canceled)

20 . (canceled)

21 . (canceled)

22 . (canceled)

23 . (canceled)

24 . (canceled)

25 . (canceled)

26 . (canceled)

27 . The filament according to claim 1 , wherein the polyamide (PA) exhibits a glass transition temperature (Tg) of at least 120° C.

28 . The filament according to claim 1 , wherein the polyamide (PA) exhibits a melting temperature (Tm) of at most 290° C.

29 . The filament according to claim 1 , wherein the polyamide (PA) exhibits a melting temperature (Tm) of at least 240° C.

30 . The filament according to claim 1 , wherein the polyamide (PA) exhibits a heat of fusion (“Hm”) of at least 20.0 J/g.

31 . The filament according to claim 1 , wherein the polymer composition (PC) comprises at least one reinforcing agent, selected from the group consisting of mineral fillers, glass fibers, carbon fibers, synthetic polymeric fibers, aramid fibers, aluminum fibers, titanium fibers, magnesium fibers, boron carbide fibers, rock wool fibers, steel fibers, wollastonite and any combination of two or more thereof.

32 . (canceled)

33 . The filament according to claim 1 , wherein the polymer composition (PC) comprises one or more additives selected from the group consisting of tougheners, plasticizers, colorants, pigments, antistatic agents, dyes, lubricants, thermal stabilizers, light stabilizers, flame retardants, nucleating agents, antioxidants and any combination thereof.

34 . (canceled)

35 . The filament according to claim 1 , having a diameter d between 0.5 mm and 5.0 mm.

36 . (canceled)

37 . (canceled)

38 . The filament according to claim 1 , having a substantially circular cross-section or a circular cross-section.

39 . The filament according to claim 1 , having a length L of at least 200 mm.

40 . A spool comprising the filament according to claim 39 .

41 . (canceled)

42 . A method of making a three-dimensional (3D) object comprising the step of printing layers of the three-dimensional object with the polymer composition (PC) of the filament according to claim 39 .

43 . (canceled)

44 . (canceled)

Assignments (2)
CHANGE OF NAME Recorded Oct 14, 2025
From: SOLVAY SPECIALTY POLYMERS USA, LLC
To: SYENSQO SPECIALTY POLYMERS USA, LLC
Reel/Frame 073076/0851 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 28, 2024
From: FLORES, JOEL; JEOL, STÉPHANE; WARD, CHRISTOPHER
To: SOLVAY SPECIALTY POLYMERS USA, LLC
Reel/Frame 067875/0692 →