IP Library Patent Application 18714889
Patent Application
App. No. 18/714,889

PRESSURE-SENSITIVE ADHESIVE

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Quick Facts
Patent No.
US None
App. No.
18/714,889
Abstract

The present application can provide a pressure-sensitive adhesive suitable for a flexible device, and a device comprising the same. In one example, the present application can provide a pressure-sensitive adhesive that is applied to a flexible device to effectively respond to repeated deformation and recovery, does not cause defects before and after deformation, and has excellent recoverability as well.

Claims (348)

1 . A pressure-sensitive adhesive having a maximum stress S MAX of 1 MPa or less as measured while maintaining a strain of 100% applied to the pressure-sensitive adhesive for 1200 seconds, the strain of 100% obtained within 0.05 seconds by a shear force applied at −20° C., and having a stress S 1200 of 12,000 Pa or less at a time point when the strain of 100% is maintained for 1200 seconds.

2 . A pressure-sensitive adhesive, wherein ΔS X1 of Equation 1 below is 3,500 Pa/time or less, and S MAX50 of Equation 1 below is 250,000 Pa or less:

Δ

S

X

1

=

0.02

×

(

S

MAX

1

-

S

MAX

50

)

[

Equation

1

]

wherein, S MAX1 is a maximum stress (unit: Pa) identified within a time period of 0 seconds to 2 seconds in a process of applying a shear force to the pressure-sensitive adhesive for 100 seconds according to Equation 2 below at −20° C., and S MAX50 is a maximum stress (unit: Pa) identified within a time period of 99 seconds to 100 seconds in the process of applying the shear force to the pressure-sensitive adhesive for 100 seconds according to Equation 2 below at −20° C.:

Sin

wave

equation

=

4

×

sin

(

1

.

5

7

5

×

t

)

[

Equation

2

]

wherein, t is a time (unit: sec).

3 . The pressure-sensitive adhesive according to claim 1 , wherein a ratio (S MAX /S 1200 ) of the maximum stress S MAX relative to the stress S 1200 is in a range from 30 to 60.

4 . The pressure-sensitive adhesive according to claim 1 , wherein ΔS X2 of Equation 3 below is 15,000 Pa/time or less:

Δ

S

X

2

=

0

.

1

×

(

S

MAX

1

-

S

MAX

10

)

[

Equation

3

]

wherein, S MAX1 is a maximum stress (unit: Pa) identified within a time period of 0 seconds to 2 seconds in a process of applying a shear force to the pressure-sensitive adhesive for 100 seconds according to Equation 2 below at −20° C., and S MAX10 is a maximum stress (unit: Pa) identified within a time period of 19 seconds to 20 seconds in the process of applying the shear force to the pressure-sensitive adhesive for 100 seconds according to Equation 2 below at −20° C.:

Sin

wave

equation

=

4

×

sin

(

1

.

5

7

5

×

t

)

[

Equation

2

]

wherein, t is a time (unit: sec).

5 . The pressure-sensitive adhesive according to claim 1 , wherein ΔS X3 of Equation 4 below is 700 Pa/time or less:

Δ

S

X

3

=

0

.

0

2

5

×

(

S

MAX

10

-

S

MAX

50

)

[

Equation

4

]

wherein, S MAX10 is a maximum stress (unit: Pa) identified within a time period of 19 seconds to 20 seconds in a process of applying a shear force to the pressure-sensitive adhesive for 100 seconds according to Equation 2 below at −20° C., and S MAX50 is a maximum stress (unit: Pa) identified within a time period of 99 seconds to 100 seconds in the process of applying the shear force to the pressure-sensitive adhesive for 100 seconds according to Equation 2 below at −20° C.:

Sin

wave

equation

=

4

×

sin

(

1

.

5

7

5

×

t

)

[

Equation

2

]

wherein, t is a time (unit: sec).

6 . The pressure-sensitive adhesive according to claim 1 , wherein ΔS XL1 of Equation 5 below is 600,000 Pa or less:

Δ

S

XL

1

=

(

S

MAX

1

-

S

LAST

1

)

[

Equation

5

]

wherein, S MAX1 is a maximum stress (unit: Pa) identified within a time period of 0 seconds to 2 seconds in a process of applying a shear force to the pressure-sensitive adhesive for 100 seconds according to Equation 2 below at −20° C., and S LAST1 is a stress (unit: Pa) identified at 2 seconds during the process of applying the shear force to the pressure-sensitive adhesive for 100 seconds according to Equation 2 below at −20° C.:

Sin

wave

equation

=

4

×

sin

(

1

.

5

7

5

×

t

)

[

Equation

2

]

wherein, t is a time (unit: sec).

7 . The pressure-sensitive adhesive according to claim 1 , wherein ΔS XL50 of Equation 6 below is 500,000 Pa or less:

Δ

S

XL

50

=

(

S

MAX

50

-

S

LAST

50

)

[

Equation

6

]

wherein, S MAX50 is a maximum stress (unit: Pa) identified within a time period of 99 seconds to 100 seconds in a process of applying a shear force to the pressure-sensitive adhesive for 100 seconds according to Equation 2 below at −20° C., and S LAST50 is a stress (unit: Pa) identified at 100 seconds during the process of applying the shear force to the pressure-sensitive adhesive for 100 seconds according to Equation 2 below at −20° C.:

Sin

wave

equation

=

4

×

sin

(

1

.

5

7

5

×

t

)

[

Equation

2

]

wherein, t is a time (unit: sec).

8 . The pressure-sensitive adhesive according to claim 1 , wherein ΔS XL10 of Equation 7 below is 500,000 Pa or less:

Δ

S

XL

10

=

(

S

MAX

10

-

S

LAST

10

)

[

Equation

7

]

wherein, S MAX10 is a maximum stress (unit: Pa) identified within a time period of 19 seconds to 20 seconds in a process of applying a shear force to the pressure-sensitive adhesive for 100 seconds according to Equation 2 below at −20° C., and S LAST10 is a stress (unit: Pa) identified at 20 seconds during the process of applying the shear force to the pressure-sensitive adhesive for 100 seconds according to Equation 2 below at −20° C.:

Sin

wave

equation

=

4

×

sin

(

1

.

5

7

5

×

t

)

[

Equation

2

]

wherein, t is a time (unit: sec).

9 . The pressure-sensitive adhesive according to claim 1 , wherein a recovery rate is at least 70%.

10 . The pressure-sensitive adhesive according to claim 1 , wherein an elastic modulus at −20° C. is 1 MPa or less, and a maximum stress in a linear section of a strain-stress curve for identifying the elastic modulus is 30,000 Pa or less.

11 . The pressure-sensitive adhesive according to claim 1 , comprising a pressure-sensitive adhesive polymer.

12 . The pressure-sensitive adhesive according to claim 11 , wherein the pressure-sensitive adhesive polymer is an acrylic copolymer having a glass transition temperature (Tg) and a melting temperature (Tm).

13 . The pressure-sensitive adhesive according to claim 12 , wherein the acrylic copolymer has the glass transition temperature of −30° C. or less and the melting temperature of −10° C. or less.

14 . The pressure-sensitive adhesive according to claim 12 , wherein a difference (Tm−Tg) between the melting temperature and the glass transition temperature is at least 5° C.

15 . The pressure-sensitive adhesive according to claim 12 , wherein the acrylic copolymer has a molecular weight distribution of more than 3, and the acrylic copolymer is cross-linked with a thermal cross-linking agent.

16 . The pressure-sensitive adhesive according to claim 12 , wherein the acrylic copolymer has a molecular weight distribution of 3 or less, and the acrylic copolymer is cross-linked with a radical cross-linking agent.

17 . The pressure-sensitive adhesive according to claim 12 , wherein the acrylic copolymer comprises an alkyl (meth)acrylate unit, a unit of Formula 1 below, and a polar functional group-containing unit:

wherein, R 1 represents hydrogen or an alkyl group, and R 2 represents an alkyl group with 11 to 13 carbon atoms.

18 . A pressure-sensitive adhesive film comprising a base film; and the pressure-sensitive adhesive of claim 1 formed on one side or both sides of the base film.

19 . A flexible device comprising:

a display panel configured to be capable of folding or rolling through one or more folding axes or rolling axes; and

the pressure-sensitive adhesive of claim 1 formed on one side or both sides of the display panel.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 24, 2025
From: LG CHEM, LTD.
To: XINMEI FONTANA HOLDING (HONG KONG) LIMITED
Reel/Frame 070608/0517 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 23, 2025
From: LG CHEM, LTD
To: XINMEI FONTANA HOLDING (HONG KONG) LIMITED
Reel/Frame 070609/0245 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 24, 2024
From: KIM, BYEONG HO; PARK, BYUNG SU; LEE, HUI JE; MIN, JIN SEO
To: LG CHEM, LTD.
Reel/Frame 068067/0795 →