PHOTOPOLYMERIZABLE ADHESIVE COMPOSITION FOR ENCAPSULATING ELECTRONIC OR OPTOELECTRONIC DEVICES

1 . A photopolymerizable adhesive composition comprising by weight of total weight of the photopolymerizable adhesive composition:

20 to 35% of at least one block copolymer;

45 to 75% of at least one (meth)acrylic monomer having a glass transition temperature (Tg) of at least 85° C.;

2 to 15% of at least one alkoxysilane(meth)acrylic monomer; and

0.1 to 5% of at least one photoinitiator.

2 . The photopolymerizable adhesive composition according to claim 1 , wherein the block copolymer is chosen from the group consisting of block copolymers having at least one block M and at least one block B;

said block M designating a block polymer comprising at least 50 weight % of methyl methacrylate; and

said block B designating an elastomer block polymer incompatible with block M, and having a glass transition temperature (Tg) lower than 20° C.

3 . The photopolymerizable adhesive composition according to claim 1 , wherein the (meth)acrylate monomer having a glass transition temperature of at least 85° C. is chosen from the group consisting of methyl methacrylate, tert-butyl methacrylate, phenyl-methacrylate, isopropyl methacrylate, isobornyl methacrylate, isobornyl acrylate, cyclohexyl methacrylate, 4-ter-butylcyclohexyl methacrylate, dihydrodicyclopentadienyl acrylate, and mixtures thereof.

4 . The photopolymerizable adhesive composition according to claim 1 , wherein the alkoxysilane (meth)acrylate monomer is chosen from the group consisting of trialkoxysilane (meth)acrylate monomers.

5 . The photopolymerizable adhesive composition according to claim 1 , further comprising at least one (meth)acrylate monomer having a glass transition temperature lower than 0° C., a methacrylic acid monomer, at least one urethane (meth)acrylate oligomer, at least one monofunctional reactive diluent, and mixtures thereof.

6 . The photopolymerizable adhesive composition according to claim 5 , wherein the (meth)acrylate monomer having a glass transition temperature lower than 0° C., if included, is chosen from the group consisting of butyl acrylate, ethyl acrylate, propyl acrylate, hexyl acrylate, octyl acrylate, dodecyl acrylate, isopropyl acrylate, isobutyl acrylate, isodecyl acrylate, 2-ethylhexyl acrylate, 2-propylheptyl acrylate, isodecyl methacrylate, dodecyl methacrylate, 2-hydroxyethyl acrylate, and mixtures thereof.

7 . The photopolymerizable adhesive composition according to claim 1 , in that it is a one-component composition.

8 . The photopolymerizable adhesive composition according to claim 1 , in that it has a glass transition temperature of at least 85° C.

9 . An adhesive product comprising the photopolymerizable adhesive composition according to claim 1 and an opaque container in which it is contained.

10 . An adhesive obtained with the method comprising the following steps:

applying the photopolymerizable adhesive composition according to claim 1 to at least one barrier layer and/or at least one electronic or optoelectronic device;

photopolymerizing the photopolymerizable adhesive composition applied, to obtain a polymerized adhesive; and

optionally forming the polymerized adhesive.

11 . An electronic or optoelectronic module comprising the assembly of a series of layers comprising in this order:

first barrier layer;

first adhesive according to claim 10 ;

flexible electronic or optoelectronic device;

second adhesive according to claim 10 ; and

second barrier layer.

12 . The electronic or optoelectronic module according to claim 11 , wherein the flexible electronic or optoelectronic is chosen from among organic light-emitting diodes, organic photovoltaic cells, organic transistors, or organic sensors.

13 . The electronic or optoelectronic module according to claim 11 , wherein the flexible electronic or optoelectronic device is a device of perovskite type.

14 . A method for obtaining the module according to claim 11 , the method comprising the following steps:

providing an electronic or optoelectronic device;

providing a photopolymerizable adhesive composition according to comprising by weight of total weight of the photopolymerizable adhesive composition

20 to 35% of at least one block copolymer,

45 to 75% of at least one (meth)acrylic monomer having a glass transition temperature (T) of at least 85° C.,

2 to 15% of at least one alkoxysilane(meth)acrylic monomer, and

0.1 to 5% of at least one photoinitiator,

providing a first barrier layer;

providing a second barrier layer;

applying layers of photopolymerizable adhesive composition to the surface of the device and/or to the respective inner surfaces of the first and second barrier layers;

laminating the device and layers of photopolymerizable adhesive composition between the respective inner surfaces of the first and second barrier layers; and

photopolymerizing the layers of photopolymerizable adhesive composition.

15 . Use of the photopolymerizable adhesive composition according to claim 1 , for the encapsulation of flexible electronic or optoelectronic devices.

16 . The photopolymerizable adhesive composition according to claim 1 , wherein the at least one block copolymer is a (meth)acrylic block copolymer.

17 . The photopolymerizable adhesive composition according to claim 1 , in that it has a glass transition temperature of at least 100° C.

18 . The photopolymerizable adhesive composition according to claim 1 , in that it has a glass transition temperature of at least 100° C.

19 . An electronic or optoelectronic module comprising the assembly of a series of layers comprising in this order:

first barrier layer;

first adhesive obtained from the photopolymerizable adhesive composition according to claim 1 ;

flexible electronic or optoelectronic device;

second adhesive obtained from the photopolymerizable adhesive composition according to claim 1 ; and

second barrier layer.

20 . Use of the adhesive product according to claim 12 , for the encapsulation of flexible electronic or optoelectronic devices.