Electromagnetic interference (EMI) shielding in optical sensors
Methods, systems, and apparatuses for electromagnetic interference (EMI) shielding are provided. An apparatus comprises a plurality of electrical components coupled to a substrate. The plurality of electrical components comprises a first electrical component coupled to a first region of the substrate and at least one other electrical component coupled to at least one other region of the substrate. The first electrical component is configured to emit electromagnetic waves. The apparatus also comprises an EMI shield forming a conductive envelopment around the first region. The first electrical component is inside the conductive envelopment and the one other electrical component is outside of the conductive envelopment. The EMI shield comprises an aperture positioned above the first electrical component. The apparatus further comprises a lens coupled to the EMI shield. The lens is positioned above the first electrical component and is substantially aligned with the aperture.
1 . An apparatus comprising:
a substrate;
a plurality of electrical components coupled to the substrate, wherein the plurality of electrical components comprises a first electrical component coupled to a first region of the substrate and at least one other electrical component coupled to at least one other region of the substrate, and wherein the first electrical component is configured to emit electromagnetic waves;
a first electromagnetic interference (EMI) shield forming a first conductive envelopment around at least the first region, wherein the first electrical component is inside the first conductive envelopment and the at least one other electrical component is outside of the first conductive envelopment, and wherein the first EMI shield comprises a first aperture positioned above the first electrical component; and
a lens coupled to the first EMI shield, wherein the lens is positioned above the first electrical component, and wherein the lens is substantially aligned with the first aperture.
2 . The apparatus of claim 1 , further comprising:
a second EMI shield forming a second conductive envelopment around a second region of the substrate, wherein the plurality of electrical components comprises a second electrical component coupled to the second region of the substrate, wherein the second electrical component is inside the second conductive envelopment, and wherein the second electrical component is configured to emit electromagnetic waves.
3 . The apparatus of claim 2 , wherein:
the first EMI shield comprises a first protrusion that extends towards the second EMI shield,
the second EMI shield comprises a second protrusion that extends towards the first EMI shield, and
at least a first portion of the first protrusion is positioned under at least a second portion of the second protrusion.
4 . The apparatus of claim 2 , wherein:
the first EMI shield is configured to substantially isolate first electromagnetic waves associated with the first electrical component from the second electrical component; and
the second EMI shield is configured to substantially isolate second electromagnetic waves associated with the second electrical component from the first electrical component.
5 . The apparatus of claim 2 , wherein the first EMI shield and the second EMI shield comprise metal.
6 . The apparatus of claim 1 , wherein:
the plurality of electrical components comprises a second electrical component coupled to a second region of the substrate,
the second electrical component is configured to emit electromagnetic waves, and
the first EMI shield forms the first conductive envelopment around the first electrical component and at least a portion of the second electrical component.
7 . The apparatus of claim 6 , wherein the first EMI shield comprises a resin, and wherein an underside of the first EMI shield comprises a metal layer that forms the first conductive envelopment.
8 . The apparatus of claim 7 , wherein a thickness of the metal layer is about 1 micron to about 12 microns.
9 . The apparatus of claim 7 , wherein the metal layer comprises at least one of the following:
beryllium, copper, brass, steel, stainless steel, nickel, or silver.
10 . The apparatus of claim 6 , wherein the first EMI shield comprises a protrusion that extends towards the second electrical component and is positioned above the portion of the second electrical component, and wherein the protrusion extends the first conductive envelopment around the portion of the second electrical component.
11 . The apparatus of claim 6 , wherein the first electrical component comprises a laser diode and the second electrical component comprises a current source associated with the laser diode.
12 . The apparatus of claim 1 , wherein the first EMI shield comprises metal.
13 . A system comprising:
an optical sensor comprising:
a substrate;
a plurality of electrical components coupled to the substrate, wherein the plurality of electrical components comprises a first electrical component coupled to a first region of the substrate and at least one other electrical component coupled to at least one other region of the substrate, and wherein the first electrical component is configured to emit electromagnetic waves;
a first electromagnetic interference (EMI) shield forming a first conductive envelopment around at least the first region, wherein the first electrical component is inside the first conductive envelopment and the at least one other electrical component is outside of the first conductive envelopment, and wherein the first EMI shield comprises a first aperture positioned above the first electrical component; and
a lens coupled to the first EMI shield, wherein the lens is positioned above the first electrical component, and wherein the lens is substantially aligned with the first aperture; and
a cover coupled to the substrate of the optical sensor, wherein the cover forms an enclosure around the first region and the at least one other region of the substrate, wherein the first EMI shield is inside the enclosure, and wherein the cover comprises at least a second aperture that is substantially aligned with the lens.
14 . The system of claim 13 , wherein:
the optical sensor further comprises a second EMI shield forming a second conductive envelopment around a second region of the substrate,
the plurality of electrical components comprises a second electrical component coupled to the second region of the substrate,
the second electrical component is inside the second conductive envelopment, and the second electrical component is configured to emit electromagnetic waves.
15 . The system of claim 14 , wherein:
the first EMI shield comprises a first protrusion that extends towards the second EMI shield,
the second EMI shield comprises a second protrusion that extends towards the first EMI shield, and
at least a first portion of the first protrusion is positioned under at least a second portion of the second protrusion.
16 . The system of claim 13 , wherein:
the plurality of electrical components comprises a second electrical component coupled to a second region of the substrate,
the second electrical component is configured to emit electromagnetic waves, and
the first EMI shield forms the first conductive envelopment around the first electrical component and at least a portion of the second electrical component.
17 . The system of claim 16 , wherein the first EMI shield comprises a resin, and wherein an underside of the first EMI shield comprises a metal layer that forms the first conductive envelopment.
18 . The system of claim 16 , wherein the first EMI shield comprises a protrusion that extends towards the second electrical component and is positioned above the portion of the second electrical component, and wherein the protrusion extends the first conductive envelopment around the portion of the second electrical component.
19 . A method comprising:
coupling a plurality of electrical components to a substrate, wherein the plurality of electrical components comprises a first electrical component coupled to a first region of the substrate and at least one other electrical component coupled to at least one other region of the substrate, and wherein the first electrical component is configured to emit electromagnetic waves;
coupling a first electromagnetic interference (EMI) shield to the substrate, wherein the first EMI shield forms a first conductive envelopment around at least the first region, wherein the first electrical component is inside the first conductive envelopment and the at least one other electrical component is outside of the first conductive envelopment, and wherein the first EMI shield comprises a first aperture positioned above the first electrical component;
coupling a lens to the first EMI shield, wherein the lens is positioned above the first electrical component, and wherein the lens is substantially aligned with the first aperture; and
coupling a cover to the substrate, wherein the cover forms an enclosure around the first region and the at least one other region of the substrate, wherein the first EMI shield is inside the enclosure, and wherein the cover comprises at least a second aperture that is substantially aligned with the lens.
20 . The method of claim 19 , further comprising:
grounding the first EMI shield onto the substrate via at least one conductive connection, wherein the at least one conductive connection comprises a conductive adhesive or solder.