MICROELECTROMECHANICAL SENSOR ASSEMBLY AND PROCESS FOR MANUFACTURING A MICROELECTROMECHANICAL SENSOR ASSEMBLY

1 . A microelectromechanical sensor assembly, comprising:

a semiconductor die having a sealed cavity;

a microelectromechanical inertial sensor having a sensing mass; and

a piezoelectric vibration sensor having a piezoelectric membrane;

wherein the sensing mass and the piezoelectric membrane are housed in the sealed cavity.

2 . The sensor assembly according to claim 1 , wherein the microelectromechanical inertial sensor and the piezoelectric vibration sensor are stacked on top of one another in the sealed cavity.

3 . The sensor assembly according to claim 1 , wherein the semiconductor die comprises a substrate, a supporting body, and a cap joined together, and wherein the sealed cavity is defined between the substrate, the supporting body, and the cap.

4 . The sensor assembly according to claim 3 , wherein the sensing mass of the microelectromechanical inertial sensor is arranged between the substrate and the piezoelectric membrane of the piezoelectric vibration sensor.

5 . The sensor assembly according to claim 4 , wherein the microelectromechanical inertial sensor and the piezoelectric vibration sensor are supported by the supporting body, and the piezoelectric membrane is coupled to the supporting body so that vibrations propagating in the supporting body are transmitted to the piezoelectric vibration sensor.

6 . The sensor assembly according to claim 5 , wherein the supporting body comprises a first portion, said first portion joined to the substrate and laterally delimiting a first volume of the cavity, and wherein the inertial sensor comprises a sensing mass elastically supported by the first portion of the supporting body in the first volume of the cavity so as to be able to oscillate along a sensing axis.

7 . The sensor assembly according to claim 6 , wherein the supporting body comprises a second portion, joined to the first portion on a side opposite to the substrate and laterally delimiting a second volume of the cavity, the second volume being in communication with the first volume, and wherein the piezoelectric membrane is anchored to the second portion of the supporting body and delimits at least partially the second volume of the cavity on a side opposite to the first volume.

8 . The sensor assembly according to claim 7 , wherein the cap is joined to the second portion of the supporting body by bonding structures, wherein the cap and the bonding structures delimit a third volume of the cavity.

9 . The sensor assembly according to claim 8 , wherein the piezoelectric membrane separates at least partially the second volume and the third volume of the cavity.

10 . The sensor assembly according to claim 8 , wherein the piezoelectric membrane has through slits and wherein the second volume and the third volume of the cavity are in communication with each other by way of said through slits.

11 . The sensor assembly according to claim 7 , wherein the second portion of the supporting body defines a spacer element between the microelectromechanical inertial sensor and the piezoelectric vibration sensor.

12 . A process for manufacturing a microelectromechanical sensor assembly, comprising:

forming a semiconductor die having a sealed cavity;

forming a microelectromechanical inertial sensor having a sensing mass;

forming a piezoelectric vibration sensor having a piezoelectric membrane; and

housing the sensing mass and the piezoelectric membrane in the sealed cavity.

13 . The process according to claim 12 , wherein housing comprises stacking the microelectromechanical inertial sensor and the piezoelectric vibration sensor on top of one another in the sealed cavity.

14 . The manufacturing process according to claim 12 , wherein forming the microelectromechanical inertial sensor comprises:

forming a first structural layer on a substrate containing semiconductor material; and

defining the sensing mass in the first structural layer in a region corresponding to a first volume of the cavity;

wherein defining the sensing mass comprises forming flexures between the movable mass and a remaining portion of the first structural layer and electrodes fixed to the substrate and capacitively coupled to the movable mass.

15 . The process according to claim 14 , wherein forming the piezoelectric vibration sensor comprises:

forming a second structural layer on the first structural layer;

etching the second structural layer in a region corresponding to a second volume of the cavity, the second volume being in communication with the first volume;

forming a sacrificial supporting structure in the second volume;

forming the piezoelectric membrane on the sacrificial supporting structure; and

releasing the second volume underneath the piezoelectric membrane.