IP Library Granted Patent US 12,465,773
Granted Patent B2
US 12,465,773 · App. 18/752,494 · Granted Nov 11, 2025

Implantable electronic devices

Inventors: Laura Tyler Perryman (Pompano Beach, FL); Graham Patrick Greene (Miami Beach, FL); Benjamin Speck (Boca Raton, FL); Patrick Larson (Surfside, FL); Paul Lombard (Coral Springs, FL)
Assignee: CURONIX LLC
A61N1/375A61N1/05A61N1/37205A61N1/3787A61N1/37229H01Q1/273H01Q1/38H05K1/118H05K1/189H05K2201/0939
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,465,773
App. No.
18/752,494
Granted
Nov 11, 2025
Kind
B2
Abstract

An implantable electronic device includes a flexible circuit board, one or more circuit components attached to the flexible circuit board and configured to convert electrical energy into electrical pulses, and one or more electrodes attached to the flexible circuit board without cables connecting the electrodes to each other or to the flexible circuit board, the one or more electrodes configured to apply the electrical pulses to a tissue adjacent the implantable electronic device.

Claims (19)

1 . A method of using an implantable electronic device in a body, the method comprising:

converting electrical energy into electrical pulses via one or more circuit components attached to a flexible circuit board in the implantable electronic device, the flexible circuit board being rectangular in shape and substantially planar; and

applying the electrical pulses to tissue via one or more substantially cylindrical electrodes, the flexible circuit board passing through openings in the one or more electrodes and the one or more electrodes attached to the flexible circuit board in the openings via one or more joints and without cables connecting the one or more electrodes to each other or to the flexible circuit board.

2 . The method of claim 1 , further comprising receiving an input signal carrying the electrical energy via an antenna attached to the flexible circuit board.

3 . The method of claim 1 , further comprising implanting the implantable electronic device subcutaneously in the body to be adjacent to the tissue.

4 . The method of claim 3 , wherein the implanting the implantable electronic device includes passing the implantable electronic device through an introducer needle into the body that includes the tissue.

5 . A method for constructing an implantable electronic device, the method comprising:

obtaining a flexible circuit board for use in the implantable electronic device, the flexible circuit board being rectangular in shape and substantially planar;

passing the flexible circuit board through openings in one or more substantially cylindrical electrodes; and

attaching the one or more electrodes to the flexible circuit board in the openings of the one or more electrodes via one or more joints and without cables connecting the one or more electrodes to each other or to the flexible circuit board, the one or more electrodes configured to apply electrical energy to tissue adjacent the implantable electronic device.

6 . The method of claim 5 , wherein the one or more electrodes are attached to the flexible circuit board respectively along one or more interior surfaces of the openings of the one or more electrodes.

7 . The method of claim 5 , wherein the one or more joints includes a rectangular joint.

8 . The method of claim 5 , wherein the one or more electrodes are attached to the flexible circuit board respectively along one or more interior surfaces of the openings at a location that has a shape that is complimentary to at least one or more portions of the one or more joints.

9 . The method of claim 5 , wherein the one or more electrodes are attached to the flexible circuit board in an automated manner.

10 . The method of claim 5 , wherein the one or more electrodes are attached to the flexible circuit board via laser welding, soldering, or conductive epoxy application via the one or more joints.

11 . The method of claim 5 , further comprising before attaching the one or more electrodes to the flexible circuit board, attaching the one or more joints to the flexible circuit board.

12 . The method of claim 5 , further comprising coupling an antenna to the flexible circuit board, the antenna configured to receive an input signal carrying the electrical energy.

13 . The method of claim 5 , further comprising coupling one or more circuit components to the flexible circuit board, the one or more circuit components configured to provide the electrical energy to the one or more electrodes.

14 . The method of claim 13 , wherein obtaining the flexible circuit board includes constructing the flexible circuit board to include an antenna.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 26, 2024
From: STIMWAVE TECHNOLOGIES INCORPORATED
To: SWT SPV LLC
Reel/Frame 069679/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 26, 2024
From: SWT SPV LLC
To: CURONIX LLC
Reel/Frame 069790/0974 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 12, 2024
From: PERRYMAN, LAURA TYLER; GREENE, GRAHAM PATRICK; SPECK, BENJAMIN; LARSON, PATRICK; LOMBARD, PAUL
To: STIMWAVE TECHNOLOGIES INCORPORATED
Reel/Frame 069565/0667 →
Continuity (4)
Continuation 17879575 · Aug 2, 2022
Continuation 16691738 · Nov 22, 2019
Provisional Application 62790119 · Jan 9, 2019
Related Publication 20240416134A1 · Dec 19, 2024
References Cited (39)
US 7856707B2 · Cole · 2010 [cited by applicant]
US 7957155B2 · Kent · 2011 [cited by examiner]
US 8897894B1 · Orinski · 2014 [cited by examiner]
US 9220897B2 · Perryman et al. · 2015 [cited by applicant]
US 9248276B2 · Pianca et al. · 2016 [cited by applicant]
US 9789314B2 · Perryman et al. · 2017 [cited by applicant]
US 10238874B2 · Perryman et al. · 2019 [cited by applicant]
US 10245436B2 · Perryman et al. · 2019 [cited by applicant]
US 11439832B2 · Perryman · 2022 [cited by examiner]
US 12017080B2 · Perryman · 2024 [cited by examiner]
US 20060161204A1 · Colvin et al. · 2006 [cited by applicant]
US 20090227127A1 · Kim et al. · 2009 [cited by applicant]
US 20100010565A1 · Lichtenstein et al. · 2010 [cited by applicant]
US 20110130816A1 · Howard · 2011 [cited by examiner]
US 20110284263A1 · Yumi · 2011 [cited by applicant]
US 20140031837A1 · Perryman et al. · 2014 [cited by applicant]
US 20150366508A1 · Chou et al. · 2015 [cited by applicant]
US 20160023003A1 · Perryman et al. · 2016 [cited by applicant]
US 20160038741A1 · Perryman · 2016 [cited by examiner]
US 20160101287A1 · Perryman et al. · 2016 [cited by applicant]
US 20160184597A1 · Andresen et al. · 2016 [cited by applicant]
US 20170143959A1 · Boling et al. · 2017 [cited by applicant]
US 20170165476A1 · Greenberg et al. · 2017 [cited by applicant]
US 20180008821A1 · Gonzalez et al. · 2018 [cited by applicant]
US 20180008828A1 · Perryman et al. · 2018 [cited by applicant]
US 20180169406A1 · Shah et al. · 2018 [cited by applicant]
US 20180289971A1 · Yeh et al. · 2018 [cited by applicant]
US 20190143124A1 · Perryman et al. · 2019 [cited by applicant]
US 20190247660A1 · Perryman · 2019 [cited by examiner]
US 20190282297A1 · Schultz · 2019 [cited by applicant]
US 20200215333A1 · Perryman et al. · 2020 [cited by applicant]
US 20210170184A1 · Greene · 2021 [cited by applicant]
WO 2012103519A2 · 2012 [cited by applicant]
WO 2012138782A1 · 2012 [cited by applicant]
WO 2013019757A2 · 2013 [cited by applicant]
WO 2013025632A1 · 2013 [cited by applicant]
WO 2013040549A1 · 2013 [cited by applicant]
International Preliminary Report on Patentability in International Appin. No. PCT/US2020/060578, dated May 27, 2022, 7 pages. [cited by applicant]
PCT International Search Report and Written Opinion in International Appin. No. PCT/US2020/060578, dated Jan. 11, 2021, 8 pages. [cited by applicant]