Heat sink that varies in height
A heat sink for cooling computing devices is disclosed. The heat sink includes a plurality of fin stages arranged in spaced relation between an intake side and an exhaust side. The plurality of fin stages each include a plurality of fins extending along a flow direction. At least one of the plurality of fin stages is distinct in fin width and/or fin height from another one of the plurality of fin stages.
1. A heat sink for cooling computing devices, comprising:
a plurality of fin stages arranged in spaced relation between an intake side and an exhaust side, the plurality of fin stages each including a plurality of fins extending along a flow direction;
wherein at least one of the plurality of fin stages is distinct in fin width and/or fin height from another one of the plurality of fin stages; and
a plurality of air separators extending from the intake side downstream to a corresponding one of the plurality of fin stages.
2. The heat sink of claim 1 , wherein a fin height of the plurality of fin stages increases successively from the intake side to the exhaust side with a shortest one of the plurality of fin stages being disposed proximate to the intake side and a tallest one of the plurality of fin stages being disposed proximate to the exhaust side.
3. The heat sink of claim 1 , wherein at least one of:
a fin height of each of the plurality of fin stages increases by 5%-25% from the intake side to the exhaust side; and
the plurality of fins of at least one of plurality of fin stages are longitudinal rectangular fins.
4. The heat sink of claim 1 , wherein the plurality of fin stages have a fin width that increases from the intake side to the exhaust side.
5. The heat sink of claim 1 , wherein at least one of:
the plurality of air separators extend over an entire width of the corresponding one of the plurality of fin stages; and
the plurality of air separators comprise baffles that are substantially flat and rectangular.
6. The heat sink of claim 1 , wherein at least one of:
the plurality of air separators are positioned at a different height relative to one another; and
each of the plurality of air separators have a different longitudinal extent from one another.
7. The heat sink of claim 1 , wherein each fin stage of the plurality of fin stages are separated from an adjacent stage by a spacing in the flow direction.
8. A system for cooling computing devices, comprising:
a casing having an air inlet and an air outlet;
a chip board arranged within the casing;
a heat sink disposed on the chip board, the heat sink including a plurality of fin stages arranged in spaced relation from one another between the air inlet and the air outlet, the plurality of fin stages each including a plurality of fins extending along a flow direction;
wherein at least one of the plurality of fin stages is distinct in fin width and/or fin height from another one of the plurality of fin stages; and
wherein the casing includes a plurality of air separators extending from the air inlet in a downstream direction.
9. The system of claim 8 , wherein the plurality of fin stages include a first fin stage at the air inlet with a smaller width than a further fin stage closer to the air outlet.
10. The system of claim 8 , wherein at least one of:
the plurality of air separators extend over an entire width of an associated one of the plurality of fin stages;
the plurality of air separators are formed integrally with the casing;
the plurality of air separators respectively extend in the downstream direction to a corresponding one of the plurality of fin stages; and
the plurality of air separators are substantially flat and rectangular.
11. The system of claim 8 , wherein at least one of:
the plurality of air separators are disposed at different heights relative to the chip board to separate air for the plurality of heat sinks; and
the plurality of air separators have a different length from one another.
12. The system of claim 8 , wherein the plurality of air separators comprise baffles or flow guides.
13. The system of claim 8 , wherein the plurality of fin stages have a fin height that increases from the air inlet to the air outlet.
14. The system of claim 13 , wherein a fin stage proximal to the air outlet has a gap in a height direction from a top of the plurality of fins and the adjacent chip board.
15. The system of claim 8 , a fin height of the plurality of fin stages increases from each stage by 5%-25% from the intake side to the exhaust side.
16. The system of claim 8 , further comprising a second chip board arranged in parallel with the chip board within the casing, the second chip board including a second plurality of fin stages arranged in spaced relation along the flow direction.
17. The system of claim 8 , wherein each fin stage of the plurality of fin stages are separated from an adjacent stage by a spacing in the flow direction.
18. The system of claim 8 , further comprising a fan disposed at the air inlet and/or the air outlet.
19. The system of claim 8 , further comprising a computing device, wherein the casing is part of the computing device.
20. The system of claim 8 , wherein the heat sink is composed of a metal.