HEAT SINK ASSEMBLY FOR DUAL IN-LINE MEMORY MODULES
Disclosed is a heat sink assembly for dual in-line memory modules (DIMMs). The heat sink assembly includes side plates and a heat sink of an electronic device. The side plates clamp the DIMMs. Heat from the DIMMs is conducted to the heat sink of the electronic device, which is cooled by a liquid coolant.
1 . A heat sink assembly comprising:
a plurality of side plates that supports a plurality of dual in-line memory modules (DIMMs), each of the plurality of DIMMs is clamped by a pair of side plates of the plurality of side plates;
a cold plate comprising an inlet port and an outlet port that are connected to flow a liquid coolant through the cold plate, wherein the cold plate is attached to an electronic device; and
a transfer plate that is attached to the cold plate and to the plurality of side plates to conduct heat from the plurality of DIMMs to the cold plate.
2 . The heat sink assembly of claim 1 , further comprising a first thermal pad that is disposed between each side plate of the plurality of side plates and a corresponding DIMM of the plurality of DIMMs.
3 . The heat sink assembly of claim 1 , wherein the transfer plate is attached to top surfaces of the plurality of side plates.
4 . The heat sink assembly of claim 3 , further comprising a second thermal pad that is disposed between the top surfaces of the plurality of side plates and the transfer plate.
5 . The heat sink assembly claim 1 , further comprising:
a base plate, wherein the cold plate is attached to the electronic device by way of the base plate.
6 . The heat sink assembly of claim 1 , wherein the plurality of side plates are identical and interchangeable.
7 . The heat sink assembly of claim 6 , wherein the plurality of side plates is die-casted using a same mold.
8 . The heat sink assembly of claim 1 , wherein the electronic device is a central processing unit (CPU).
9 . A method of dissipating heat from a plurality of dual in-line memory modules (DIMMs), the method comprising:
clamping each of the plurality of DIMMs by a pair of side plates of a plurality of side plates;
conducting heat from the plurality of DIMMs to a heat sink of an electronic device by way of the plurality of side plates;
conducting heat from the electronic device to the heat sink;
flowing a liquid coolant through the heat sink; and
cooling the liquid coolant.
10 . The method of claim 9 , wherein clamping each of the plurality of DMMs by a pair of side plates of the plurality of side plates includes placing a thermal pad between each of the plurality of DIMMs and a corresponding side plate of the plurality of side plates.
11 . The method of claim 9 , wherein the electronic device is a central processing unit (CPU).
12 . The method of claim 9 , wherein the heat sink includes a cold plate and flowing the liquid coolant through the heat sink includes pumping, using a pump, the liquid coolant through the cold plate by way of an inlet port and an outlet port of the cold plate.
13 . The method of claim 12 , wherein the liquid coolant is cooled using a heat exchanger that is disposed between the pump and the cold plate.
14 . A heat sink assembly comprising:
a plurality of side plates that are joined together, each side plate of the plurality of side plates comprising a sidewall, wherein each dual in-line memory module (DIMM) of a plurality of DIMMs is clamped between side walls of a pair of side plates of the plurality of side plates; and
a thermal interface material between a sidewall of each side plate of the plurality of side plates and a corresponding DIMM of the plurality of DIMMs.
15 . The heat sink assembly of claim 14 , further comprising a fastener that goes through holes of the plurality of side plates.
16 . The heat sink assembly of claim 15 , wherein the fastener comprises a long bolt that goes through the holes and is secured by a nut.
17 . The heat sink assembly of claim 14 , wherein each side plate of the plurality of side plates has a first bar portion on a front end and a second bar portion on a back end that prevent a DIMM clamped by the side plate from moving laterally.
18 . The heat sink assembly of claim 14 , wherein connectors of the plurality of DIMMs extend past bottom ends of the plurality of side plates.
19 . The heat sink assembly of claim 17 , wherein heat from the DIMMs is conducted to a cold plate by way of a transfer plate, and the cold plate dissipates heat of an electronic device.
20 . The heat sink assembly of claim 17 , wherein the plurality of side plates are identical and interchangeable.