SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
A semiconductor device includes a semiconductor chip having a first surface and a second surface, the first surface facing a substrate, and the second surface being opposite to the first surface and being a circuit surface; a first bump connecting the first surface of the semiconductor chip and the substrate; and a metallic pillar connecting the first surface of the semiconductor chip and the substrate.
1 . A semiconductor device comprising:
a semiconductor chip having a first surface and a second surface, the first surface facing a substrate, the second surface being opposite to the first surface and being a circuit surface;
a first bump connecting the first surface of the semiconductor chip and the substrate; and
a metallic pillar connecting the first surface of the semiconductor chip and the substrate.
2 . The semiconductor device according to claim 1 , comprising:
a plurality of first bumps; and
a plurality of metallic pillars,
wherein the plurality of metallic pillars are disposed between the plurality of first bumps in a plan view, each of the plurality of first bumps being the first bump, and each of the plurality of metallic pillars being the metallic pillar.
3 . The semiconductor device according to claim 2 , wherein the plurality of metallic pillars and the plurality of first bumps are alternately disposed in a first axis direction in a plan view.
4 . The semiconductor device according to claim 3 , wherein the plurality of metallic pillars and the plurality of first bumps are alternately disposed in a second axis direction intersecting the first axis direction in a plan view.
5 . The semiconductor device according to claim 1 , wherein the metallic pillar is made of a metal having a higher thermal conductivity than the first bump.
6 . The semiconductor device according to claim 2 , further comprising:
a plurality of second bumps,
wherein the plurality of first bumps and the plurality of metallic pillars are disposed in a first region in a plan view, the first region including the semiconductor chip, and
the plurality of second bumps are disposed in a second region outside the first region in a plan view.
7 . The semiconductor device according to claim 1 , further comprising:
a redistribution layer disposed on the second surface side of the semiconductor chip.
8 . The semiconductor device according to claim 7 , further comprising:
an antenna disposed on a side opposite to the semiconductor chip with respect to the redistribution layer, the antenna being connected to the semiconductor chip via the redistribution layer.
9 . The semiconductor device according to claim 1 , wherein the first bump is a solder ball.
10 . The semiconductor device according to claim 6 , wherein each of the second bumps is a solder ball.
11 . An electronic apparatus comprising:
a semiconductor device;
a substrate on which the semiconductor device is mounted,
wherein the semiconductor device includes
a semiconductor chip having a first surface and a second surface, the first surface facing the substrate, and the second surface being opposite to the first surface and being a circuit surface;
a redistribution layer disposed on the second surface side of the semiconductor chip;
a first bump connecting the first surface of the semiconductor chip and the substrate; and
a metallic pillar connecting the first surface of the semiconductor chip and the substrate.
12 . The electronic apparatus according to claim 11 , wherein the substrate includes a metallic portion connected to the metallic pillar.