SEMICONDUCTOR DEVICE
A semiconductor device includes a semiconductor stack, an insulating structure, a metal oxide structure and a metal structure. The semiconductor stack includes a first semiconductor structure, a second semiconductor structure and an active structure located between the first semiconductor structure and the second semiconductor structure. The insulating structure is disposed below the first semiconductor structure and comprising a first opening and a second opening. The metal oxide structure is disposed below the insulating structure and located in the first opening, and contacts the semiconductor stack to form a first contact surface therebetween. The metal structure is located in the second opening, and contacts the semiconductor stack to form a second contact surface therebetween. The first contact surface is separated from the second contact surface.
1 . A semiconductor device, comprising:
a semiconductor stack comprising a first semiconductor structure, a second semiconductor structure and an active structure located between the first semiconductor structure and the second semiconductor structure;
an insulating structure disposed below the first semiconductor structure and comprising a first opening and a second opening;
a metal oxide structure disposed below the insulating structure and located in the first opening, wherein the metal oxide structure contacts the semiconductor stack to form a first contact surface therebetween; and
a metal structure located in the second opening and contacting the semiconductor stack to form a second contact surface therebetween, wherein the second contact surface is separated from the first contact surface.
2 . The semiconductor device according to claim 1 , further comprising a first electrode structure disposed on the second semiconductor structure, wherein the second contact surface does not overlap with the first electrode structure in a vertical direction.
3 . The semiconductor device according to claim 2 , wherein the first electrode structure comprises a pad, and the first contact surface overlaps the pad in the vertical direction.
4 . The semiconductor device according to claim 3 , wherein the insulating structure does not overlap with the pad in the vertical direction.
5 . The semiconductor device according to claim 2 , wherein the first electrode structure comprises a first section and a second section which are parallel to each other, and the first opening and the second opening are located between the first section and the second section and do not overlap with the first section and the second section in the vertical direction.
6 . The semiconductor device according to claim 5 , wherein in a top view, the first opening is located between the second opening and the first section or between the second opening and the second section.
7 . The semiconductor device according to claim 6 , wherein a distance between the second opening and the first section is in a range of 20 μm to 100 μm.
8 . The semiconductor device according to claim 2 , wherein the metal oxide structure extends in into the second opening to contact the metal structure.
9 . The semiconductor device according to claim 2 , wherein the metal structure comprises a first surface facing the metal oxide structure, and the first surface is partially covered by the insulating structure.
10 . The semiconductor device according to claim 2 , wherein the metal oxide structure comprises a first conductive layer and a second conductive layer.
11 . The semiconductor device according to claim 1 , further comprising a reflective structure located below the insulating structure and connecting the metal oxide structure.
12 . The semiconductor device according to claim 11 , further comprising a base located below the reflective structure and a bonding structure located between the base and the reflective structure.
13 . The semiconductor device according to claim 1 , wherein the first contact surface has an area larger than that of the second contact surface.
14 . The semiconductor device according to claim 1 , wherein the first opening has a first area, and the second opening has a second area smaller than the first area.
15 . The semiconductor device according to claim 1 , wherein the first contact surface and the second contact surface are substantially coplanar.
16 . The semiconductor device according to claim 1 , wherein the insulating structure has a first thickness and the metal structure has a second thickness smaller than the first thickness.
17 . The semiconductor device according to claim 1 , wherein the metal structure has a thickness in a range of 100 nm to 500 nm.
18 . The semiconductor device according to claim 1 , wherein the semiconductor stack comprises a first contact structure disposed between the first semiconductor structure and the insulating structure.
19 . The semiconductor device according to claim 18 , wherein the semiconductor stack comprises a plurality of first contact structures located in the first opening and the second opening.
20 . A package structure comprising:
a package substrate;
the semiconductor device of claim 1 on the package substrate; and
an encapsulating structure covering the semiconductor device.