IP Library Patent Application 18806197
Patent Application
App. No. 18/806,197

SCAN NEEDLE AND SCAN DISPLAY SYSTEM INCLUDING SAME

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Quick Facts
Patent No.
US None
App. No.
18/806,197
Abstract

A micro-light emitting diode (LED) structure includes a substrate and at least one micro-LED formed above the substrate. The at least one micro-LED incudes a metal layer formed above the substrate; a light emitting layer formed above the metal layer; an insulating layer covering the micro-LED and including an opening exposing a portion of the light emitting layer; and a transparent conductive layer covering the insulating layer and electrically connected to the light emitting layer via the opening of the insulating layer.

Claims (37)

1 . A micro-light emitting diode (LED) structure, comprising:

a substrate;

at least one micro-LED formed above the substrate, wherein the at least one micro-LED comprises:

a metal layer formed above the substrate;

a light emitting layer formed above the metal layer;

an insulating layer covering the micro-LED and including an opening exposing a portion of the light emitting layer; and

a transparent conductive layer covering the insulating layer and electrically connected to the light emitting layer via the opening of the insulating layer.

2 . The micro-LED structure of claim 1 , further comprising:

a micro-lens formed above the micro-LED, and vertically aligned with the micro-LED.

3 . The micro-LED structure of claim 2 , further comprising:

a transparent isolation layer formed between the micro-lens and the micro-LED.

4 . The micro-LED structure of claim 1 , wherein a profile of the light emitting layer vertically projected on a top surface of the substrate is surrounded by a profile of the bonding layer vertically projected on the top surface of the substrate.

5 . The micro-LED structure of claim 1 , wherein the insulating layer includes a protrusion protruding in a direction away from the substrate, the protrusion surrounding the opening of the insulating layer.

6 . The micro-LED structure of claim 1 , comprising:

a plurality of the micro-LEDs formed above the substrate.

7 . The micro-LED structure of claim 6 , comprising:

a light-isolating wall formed between adjacent micro-LEDs.

8 . The micro-LED structure of claim 7 , wherein a height of the light-isolating wall is greater than or equal to a height of the adjacent micro-LED.

9 . The micro-LED structure of claim 6 , wherein the plurality of the micro-LEDs are configured to emit light having the same color.

10 . The micro-LED structure of claim 6 , wherein the plurality of the micro-LEDs are configured to emit light having different colors.

11 . The micro-LED structure of claim 6 ,

wherein the plurality of the micro-LEDs are arranged in an array.

12 . The micro-LED structure of claim 6 , wherein each one of the plurality of the micro-LEDs is a red LED, a green LED, or a blue LED.

13 . The micro-LED structure of claim 6 , wherein each one of the plurality of the micro-LEDs is configured to emit light with a color selected from red, green, blue, yellow, orange, and cyan.

14 . The micro-LED structure of claim 6 , wherein a pixel is formed by an array of the plurality of the micro-LEDs.

15 . The micro-LED structure of claim 6 , wherein a pixel is formed by one of the plurality of the micro-LEDs.

16 . The micro-LED structure of claim 6 , wherein a space between adjacent micro-LEDs is less than 5 μm.

17 . The micro-LED structure of claim 6 , wherein the plurality of the micro-LEDs are formed to have the same size.

18 . The micro-LED structure of claim 6 , wherein the plurality of the micro-LEDs are formed to have different sizes.

19 . The micro-LED structure of claim 1 , wherein the substrate comprises:

a drive circuit configured to control the at least one micro-LED; and

an interconnection layer electrically connected to the metal layer of the at least one micro-LED.

20 . The micro-LED structure of claim 1 , wherein the metal layer contacts an entirety of a bottom surface of the light emitting layer.

21 . The micro-LED structure of claim 1 , wherein the insulating layer is formed at least at the sidewall of the micro-LED.

22 . The micro-LED structure of claim 21 , wherein the insulating layer is further formed on the sidewall surface of the metal layer.

23 . The micro-LED structure of claim 21 , wherein the insulating layer is further formed on the substrate at a side of the metal layer.

24 . The micro-LED structure of claim 1 , wherein the light emitting layer comprises multiple layers.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 9, 2026
From: JADE BIRD DISPLAY (SHANGHAI) LIMITED
To: HUE INC.
Reel/Frame 075373/0207 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 15, 2024
From: XU, QUNCHAO; LI, QIMING
To: HONG KONG BEIDA JADE BIRD DISPLAY LIMITED
Reel/Frame 068301/0088 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 15, 2024
From: HONG KONG BEIDA JADE BIRD DISPLAY LIMITED
To: JADE BIRD DISPLAY (SHANGHAI) LIMITED
Reel/Frame 068301/0262 →