PROCESS FOR MANUFACTURING MICROELECTROMECHANICAL DEVICES WITH REDUCED STICTION PHENOMENON

1 . A process for manufacturing a microelectromechanical device, comprising:

on a body containing semiconductor material, forming a sacrificial layer of dielectric material having a first surface, opposite to the body;

producing a sacrificial surface roughness on the first surface of the sacrificial layer by forming a transfer layer of semiconductor material with intrinsic porosity on the sacrificial layer and partially removing the sacrificial layer through the transfer layer; and

on the first surface of the sacrificial layer, forming a structural layer of semiconductor material having a second surface in contact with the first surface of the sacrificial layer.

2 . The manufacturing process according to claim 1 , wherein the sacrificial surface roughness is defined by root mean square values between 5 and 20 nm.

3 . The manufacturing process according to claim 1 , wherein the transfer layer includes polycrystalline silicon with an intrinsic porosity having a full/empty mass ratio lower than 80%.

4 . The manufacturing process according to claim 1 , wherein the sacrificial layer includes silicon oxide.

5 . The manufacturing process according to claim 1 , wherein partially removing the sacrificial layer includes dry etching the sacrificial layer.

6 . The manufacturing process according to claim 1 , wherein the body includes:

a substrate of semiconductor material;

a permanent dielectric layer on the substrate; and

an electrically conductive connection layer on the permanent dielectric layer.

7 . The manufacturing process according to claim 6 , further comprising:

anchoring the structural layer to the connection layer;

forming a movable mass from the structural layer; and

selectively removing the sacrificial layer, thus releasing the movable mass, wherein the movable mass is constrained to the connection layer so as to be capable of oscillating along a direction transverse to the connection layer.

8 . The manufacturing process according to claim 7 , further includes forming a connection surface roughness to a main face of the connection layer, the main face facing the movable mass, wherein the connection layer is of polycrystalline silicon.

9 . The manufacturing process according to claim 1 , further comprising:

anchoring the structural layer to the body;

forming a dielectric bonding layer on the structural layer;

bonding a support substrate of semiconductor material to the dielectric bonding layer;

forming a movable mass from the body; and

selectively removing the sacrificial layer, thus releasing the movable mass, wherein the movable mass is constrained to the structural layer so as to be capable of oscillating along a direction transverse to the structural layer.

10 . The manufacturing process according to claim 9 , wherein the body includes monocrystalline silicon; and

wherein the structural layer is electrically conductive.

11 . The manufacturing process according to claim 1 , wherein the second surface of the structural layer has a structural surface roughness, the structural surface roughness being complementary to the sacrificial surface roughness.

12 . The manufacturing process according to claim 1 , wherein the structural layer includes polycrystalline silicon.

13 . A method, comprising:

manufacturing a moveable mass on a microelectromechanical device, by:

on a body layer, forming a sacrificial layer containing silicon oxide, wherein the sacrificial layer has a first surface opposite to the body layer;

forming a transfer layer of semiconductor material with intrinsic porosity on the first surface of the sacrificial layer;

partially removing the sacrificial layer through the transfer layer and creating a sacrificial surface roughness on the first surface of the sacrificial layer;

removing select portions of the sacrificial layer to expose the body layer;

forming a structural layer containing polycrystalline silicon, coupled to both the first surface of the sacrificial layer and the body layer, wherein, on the structural layer, a structural surface roughness is produced being complementary to the sacrificial surface roughness; and

forming with the structural layer with an anchor in the select portions, thereby coupling the structural layer to the body layer; and

selectively removing the sacrificial layer, thus releasing the movable mass, wherein the movable mass is constrained to the anchor.

14 . The manufacturing process according to claim 13 , wherein the sacrificial surface roughness is defined by root mean square values between 5 and 20 nm.

15 . The manufacturing process according to claim 13 , wherein the transfer layer includes polycrystalline silicon with an intrinsic porosity having a full/empty mass ratio lower than 80%.

16 . The manufacturing process according to claim 13 , wherein the moveable mass is formed from the structural layer, oscillating along a direction traverse to the body layer containing a substrate of semiconductor material, a permanent dielectric layer on the substrate, and an electrically conductive connection layer on the permanent dielectric layer.

17 . The manufacturing process according to claim 13 , wherein the moveable mass is formed from the body layer containing monocrystalline silicon, oscillating along a direction transverse to the electrically conductive structural layer.

18 . A microelectromechanical device, comprising:

a body containing semiconductor material and having a main face; and

a structural layer of semiconductor material, having a surface facing the main face of the body, wherein either the main face or the surface or both have a surface roughness.

19 . The device according to claim 18 , wherein the body comprises:

a substrate of semiconductor material;

a permanent dielectric layer on the substrate; and

an electrically conductive connection layer on the permanent dielectric layer, the connection layer being delimited by the main face; and

the device further includes a movable mass formed from the structural layer, the movable mass being delimited by the surface,

wherein the movable mass is constrained to the connection layer so as to be capable of oscillating along a direction transverse to the connection layer, and

wherein the main face has a connection surface roughness and the surface has a structural surface roughness.

20 . The device according to claim 18 , further comprising:

a dielectric bonding layer on the structural layer and opposite to the surface;

a support substrate of semiconductor material bonded to the dielectric bonding layer; and

a movable mass formed from the body, the movable mass being delimited by the main face,

wherein the movable mass is constrained to the structural layer so as to be capable of oscillating along a direction transverse to the structural layer, and

wherein the structural layer is electrically conductive and the surface has a structural surface roughness.