METHODS OF MANUFACTURE OF MEMS MIRROR ARRAYS WITH REDUCED CROSSTALK

1 . A method of fabricating a microelectromechanical systems (MEMS) array, comprising:

forming a plurality of first trenches on a first side of a substrate, the first trenches containing dielectric material;

forming a plurality of vias on the first side of the substrate;

metalizing the first side of the substrate;

forming a plurality of reflective surfaces on the first side of the substrate;

forming a plurality of second trenches on the first side of the substrate to define a plurality of structures;

forming a pattern layer on a second side of the substrate that is opposite to the first side of the substrate;

etching the second side of the substrate to form a plurality of narrow blades;

boding a base wafer to the second side of the substrate after forming the narrow blades; and

etching through the second trenches on the first side of the substrate to release the structures and to provide electrical isolation;

wherein the plurality of structures includes a first structure and a second structure, the first structure including a first stage, a first frame pivotally coupled to the first stage, and a first stage reflective surface of the reflective surfaces, and the second structure including a second stage, a second frame pivotally coupled to the second stage, and a second stage reflective surface of the reflective surface,

wherein the first stage reflective surface has a first resonant frequency, and

wherein the second stage reflective surface has a second resonant frequency different from the first resonant frequency.

2 . The method of claim 1 , wherein the substrate comprises a silicon wafer.

3 . The method of claim 1 , wherein the dielectric material includes silicon dioxide.

4 . The method of claim 1 , further comprising forming a passivation dielectric layer on the first side of the substrate after metalizing the first side of the substrate.

5 . The method of claim 1 , further comprising providing a lid wafer to the first side of the substrate.

6 . The method of claim 5 , wherein providing the lid wafer comprises attaching the lid wafer to the first side of the substrate.

7 . The method of claim 5 , wherein the lid wafer comprises glass.

8 . The method of claim 1 , wherein metalizing the first side of the substrate comprises forming a plurality of contacts and a plurality of interconnects.

9 . The method of claim 1 ,

wherein the plurality of structures includes the first structure, the second structure, and a third structure, the third structure including a third stage, a third frame pivotally coupled to the third stage, and third stage reflective surface of the reflective surfaces,

wherein the third stage reflective surface has a third resonant frequency different from the first resonant frequency and the second resonant frequency,

wherein the first structure is disposed between the second structure and the third structure.

10 . The method of claim 1 ,

wherein the plurality of structures includes the first structure, the second structure, a third structure, and a fourth structure,

wherein the third structure includes a third stage, a third frame pivotally coupled to the third stage, and third stage reflective surface of the reflective surfaces,

wherein the fourth structure includes a fourth stage, a fourth frame pivotally coupled to the fourth stage, and fourth stage reflective surface of the reflective surfaces,

wherein the third stage reflective surface has a third resonant frequency,

wherein the fourth stage reflective surface has a fourth resonant frequency,

wherein the third resonant frequency is different from the first resonant frequency, the second resonant frequency, and the fourth resonant frequency,

wherein the fourth resonant frequency is different from the first resonant frequency, the second resonant frequency, and the third resonant frequency, and

wherein the second structure and the third structure, and the fourth structure are adjacent to the first structure.

11 . The method of claim 1 , wherein etching the second side of the substrate to form the plurality of narrow blades including forming a support webbing between the first structure and the second structure.

12 . The method of claim 11 , further comprising forming a support anchor on the base wafer, wherein the support anchor is overlapping with the support webbing in a first direction.

13 . The method of claim 12 , wherein the support webbing and the support anchor are in contact.

14 . A method of fabricating a microelectromechanical systems (MEMS) array, comprising:

forming a plurality of mirror structures on a first side of a substrate;

forming a plurality of support webbings between the mirror structures on a second side of the substrate;

forming a plurality of support anchors on a base wafer;

boding the base wafer to the second side of the substrate after forming the support anchors,

wherein the first side of the substrate is opposite to the second side of the substrate,

wherein the plurality of support webbings includes a first support webbing,

wherein the plurality of support anchors includes a first support anchor, and

wherein the first support webbing is overlapping with the first support anchor in a first direction.

15 . The method of claim 14 , wherein the first support webbing and the first support anchor are in contact.

16 . The method of claim 14 , further comprising providing a lid wafer to the first side of the substrate.

17 . The method of claim 14 , wherein the plurality of mirror structures includes a first structure and a second structure,

wherein the first structure includes a first stage, a first frame pivotally coupled to the first stage, and a first stage reflective surface,

wherein the second structure includes a second stage, a second frame pivotally coupled to the second stage, and a second stage reflective surface,

wherein the first stage reflective surface has a first resonant frequency, and

wherein the second stage reflective surface has a second resonant frequency different from the first resonant frequency.

18 . The method of claim 14 , wherein the plurality of mirror structures includes a first structure, a second structure, and a third structure,

wherein the first structure includes a first stage, a first frame pivotally coupled to the first stage, and a first stage reflective surface,

wherein the second structure includes a second stage, a second frame pivotally coupled to the second stage, and a second stage reflective surface,

wherein the third structure includes a third stage, a third frame pivotally coupled to the third stage, and a third stage reflective surface,

wherein the first stage reflective surface has a first resonant frequency,

wherein the second stage reflective surface has a second resonant frequency,

wherein the third stage reflective surface has a third resonant frequency,

wherein the first resonant frequency is different from the second resonant frequency and the third resonant frequency, and

wherein the second resonant frequency is different from the first resonant frequency and the third resonant frequency.

19 . The method of claim 14 , wherein the plurality of mirror structures includes a first structure, a second structure, a third structure, and a fourth structure,

wherein the first structure includes a first stage, a first frame pivotally coupled to the first stage, and a first stage reflective surface,

wherein the second structure includes a second stage, a second frame pivotally coupled to the second stage, and a second stage reflective surface,

wherein the third structure includes a third stage, a third frame pivotally coupled to the third stage, and a third stage reflective surface,

wherein the fourth structure includes a fourth stage, a fourth frame pivotally coupled to the fourth stage, and a fourth stage reflective surface,

wherein the first stage reflective surface has a first resonant frequency,

wherein the second stage reflective surface has a second resonant frequency,

wherein the third stage reflective surface has a third resonant frequency,

wherein the fourth stage reflective surface has a fourth resonant frequency,

wherein the first resonant frequency is different from the second resonant frequency, the third resonant frequency, and the fourth resonant frequency,

wherein the second resonant frequency is different from the first resonant frequency, the third resonant frequency, and the fourth resonant frequency, and

wherein the third resonant frequency is different from the first resonant frequency, the second resonant frequency, and the fourth resonant frequency.

20 . A method of fabricating a microelectromechanical systems (MEMS) array, comprising:

forming a plurality of mirror structures on a first side of a substrate,

wherein the plurality of mirror structures includes a plurality of first mirror structures having a first resonant frequency and a plurality of second mirror structures having a second resonant frequency different from the first resonant frequency.

21 . The method of claim 20 , wherein the plurality of mirror structures includes the plurality of first mirror structures, the plurality of second mirror structures, and a plurality of third mirror structures having a third resonant frequency different from the first resonant frequency and the second resonant frequency.

22 . The method of claim 21 , wherein one of the first mirror structures is surrounded by three second mirror structures of the second mirror structures and three third mirror structures of the third mirror structures.

23 . The method of claim 20 , wherein the plurality of mirror structures includes the plurality of first mirror structures, the plurality of second mirror structures, a plurality of third mirror structures having a third resonant frequency, and a plurality of fourth mirror structures having a fourth resonant frequency,

wherein the first resonant frequency is different from the second resonant frequency, the third resonant frequency, and the fourth resonant frequency,

wherein the second resonant frequency is different from the first resonant frequency, the third resonant frequency, and the fourth resonant frequency, and

wherein the third resonant frequency is different from the first resonant frequency, the second resonant frequency, and the fourth resonant frequency.

24 . The method of claim 23 , wherein one of the first mirror structures is surrounded by two second mirror structures of the second mirror structures, two third mirror structures of the third mirror structures, and two fourth mirror structures of the fourth mirror structures.

25 . The method of claim 20 , further comprising:

forming a plurality of support webbings between the mirror structures on a second side of the substrate,

forming a plurality of support anchors on a base wafer, and

boding the base wafer to the second side of the substrate after forming the support anchors,

wherein the second side of the substrate is opposite to the first side of the substrate,

wherein the plurality of support webbings includes a first support webbing,

wherein the plurality of support anchors includes a first support anchor, and

wherein the first support webbing is overlapping with the first support anchor in a first direction.

26 . The method of claim 25 , wherein the first support webbing and the first support anchor are in contact.