Granted Patent B2

US 12,569,925 · App. 18/828,032 · Granted Mar 10, 2026

Inventor: Lu-Min Chen (New Tapei, TW)

Assignee: Kulicke and Soffa Hi-Tech Co. Ltd.

B23K3/0623

Abstract

Claims (23)

1 . A solder jetting head for depositing a solder paste onto a target surface, comprising:

a tappet portion driven to provide a striking force;

a nozzle portion for forming an enclosing contact with the tappet portion, the nozzle portion being configured to force the solder paste to exit from the nozzle portion;

a support portion for supporting the nozzle portion; and

a buffering portion positioned between the support portion and the nozzle portion, the buffering portion being formed of an elastic structure that deforms as a result of the enclosing contact and reforms when the enclosing contact ends, and the buffering portion being configured to absorb impact energy generated when the enclosing contact is formed.

2 . The solder jetting head of claim 1 wherein the buffering portion includes a plurality of elastic material lavers.

3 . The solder jetting head of claim 1 wherein the buffering portion includes a thermoplastic elastomer.

4 . The solder jetting head of claim 1 wherein the buffering portion includes a plurality of layers of different material.

5 . The solder jetting head of claim 4 wherein the buffering portion includes a first layer, a second layer, and a third layer.

6 . The solder jetting head of claim 5 wherein the first layer includes a first material, the second layer includes a second material, and the third layer includes the first material.

7 . The solder jetting head of claim 1 wherein the buffering portion includes a layer of natural rubber between two layers of a thermoplastic elastomer.

8 . A dispensing system for depositing a solder paste onto a target surface, the dispensing system comprising:

a support structure for supporting a workpiece during a dispensing operation; and

a solder jetting head including (i) a tappet portion driven to provide a striking force, (ii) a nozzle portion for forming an enclosing contact with the tappet portion, the nozzle portion being configured to force the solder paste to exit from the nozzle portion, (iii) a support portion for supporting the nozzle portion, and (iv) a buffering portion positioned between the support portion and the nozzle portion, the buffering portion being formed of an elastic structure that deforms as a result of the enclosing contact and reforms when the enclosing contact ends, and the buffering portion being configured to absorb impact energy generated when the enclosing contact is formed.

9 . The dispensing system of claim 8 further comprising a motion system for moving the solder jetting head with respect to the support structure.

10 . The dispensing system of claim 8 further comprising a solder supply for providing solder to the solder jetting head.

11 . The dispensing system of claim 8 wherein the buffering portion includes an elastic structure.

12 . The dispensing system of claim 8 wherein the buffering portion includes a thermoplastic structure.

13 . The dispensing system of claim 8 wherein the buffering portion includes a plurality of elastic material layers.

14 . The dispensing system of claim 8 wherein the buffering portion includes a layer of natural rubber between two layers of a thermoplastic elastomer.

15 . The dispensing system of claim 8 wherein the buffering portion includes a plurality of layers of different material.

16 . The dispensing system of claim 15 wherein the buffering portion includes a first layer, a second layer, and a third layer.

17 . The dispensing system of claim 16 wherein the first layer includes a first material, the second layer includes a second material, and the third layer includes the first material.

Assignments (1)

Continuity (2)

References Cited (22)