GEIGER-MODE FOCAL PLANE ARRAY HAVING INCREASED TOLERANCE TO OPTICAL OVERSTRESS
A GmAPD FPA having increased tolerance optical overstress includes a limit resistor that is monolithically integrated into each pixel in the FPA, and which limits the magnitude of the current entering the read out integrated circuit.
1 . A Geiger mode avalance photodiode (GmAPD) focal plane array (FPA) comprising a plurality of pixels, each pixel comprising:
an electrical circuit including:
a GmAPD;
a unit cell of a read-out integrated circuit (ROIC unit cell); and
a limit resistor, wherein the limit resistor is located in the electrical circuit between the GmAPD and the ROIC unit cell,
wherein the ROIC unit cell comprises a plurality of transistors, and one end of the limit resistor is directly connected with one of the plurality of transistors,
wherein the plurality of transistors provide active-quenching functionality for the GmAPD,
wherein the limit resistor is configured to discharge total charge injected in the ROIC unit cell and reduce a peak magnitude of a current generated by the GmAPD, and
wherein the limit resistor is monolithically integrated in the pixel.
2 . The GmAPD FPA of claim 1 , wherein the limit resistor is monolithically integrated with only the GmAPD of each pixel.
3 . The GmAPD FPA of claim 1 , wherein the limit resistor is monolithically integrated with only the ROIC of each pixel.
4 . The GmAPD FPA of claim 1 , wherein the limit resistor comprises a first limit resistor and a second limit resistor, the first limit resistor being monolithically integrated with the GmAPD of each pixel and the second limit resistor being monolithically integrated with the ROIC of each pixel.
5 . The GmAPD FPA of claim 1 , wherein the limit resistor is a thin-film resistor.
6 . The GmAPD FPA of claim 1 , wherein the limit resistor comprises materials selected from the group consisting of NiCr and TaN.
7 . The GmAPD FPA of claim 1 , wherein the limit resistor has a resistance in the range of about 1 kOhm to about 100 kOhms.
8 . The GmAPD FPA of claim 1 , wherein the GmAPD comprises:
an active region formed within APD device layers;
a passivation layer disposed on the APD device layers;
an electrical contact formed on a portion of the active region;
the limit resistor, wherein the limit resistor is disposed on the passivation layer and is in electrical communication with the electrical contact; and
a bond pad formed on at least a portion of the limit resistor.
9 . The GmAPD FPA of claim 8 , wherein the limit resistor has a serpentine shape, and wherein the serpentine shape comprises a predetermined number of resistor squares between the active region and the bond pad.
10 . The GmAPD FPA of claim 9 , wherein the predetermined number of resistor squares corresponds to a desired tunable resistance of the limit resistor.
11 . The GmAPD FPA of claim 1 , wherein the plurality of transistors includes an active quenching circuit comprising:
a sense transistor configured to receive an avalanche current from the GmAPD;
an arm transistor; and
a disarm transistor.
12 . The GmAPD FPA of claim 11 , wherein the limit resistor is electrically coupled between an electrical contact of the GmAPD and an input of the sense transistor in the active quenching circuit within the ROIC.
13 . The GmAPD FPA of claim 11 , wherein the active quenching circuit is configured to, in response to detecting the avalanche current, turn on the disarm transistor to reduce a voltage drop across the GmAPD.
14 . The GmAPD FPA of claim 13 , wherein the active quenching circuit is further configured to:
detect a level of the voltage drop across the GmAPD falling to a level below a predetermined threshold voltage, and
in response to detecting the voltage drop across the GmAPD, turn on the arm transistor to re-arm the GmAPD.
15 . The GmAPD FPA of claim 14 , wherein the predetermine threshold voltage corresponds to the breakdown voltage of the GmAPD.