CALIBRATION ASSEMBLY FOR A LITHIUM DEPOSITION PROCESS, LITHIUM DEPOSITION APPARATUS, AND METHOD OF DETERMINING A LITHIUM DEPOSITION RATE IN A LITHIUM DEPOSITION PROCESS

1 . A calibration assembly for a lithium deposition process, the calibration assembly comprising

a carrier; and a piezoelectric resonator coupled to the carrier,

wherein:

the calibration assembly is configured for being processed in the lithium deposition process, the lithium deposition process including a passivation, the piezoelectric resonator is configured for being electrically connected to a driver for determining a resonant frequency of the piezoelectric resonator,

the resonant frequency is indicative of a thickness of a lithium film deposited on the piezoelectric resonator in the lithium deposition process, and

a change of the resonant frequency over time is indicative of the passivation of the lithium film.

2 . The calibration assembly according to claim 1 , wherein the piezoelectric resonator comprises an inert metal electrode on a face of the piezoelectric resonator.

3 . The calibration assembly according to claim 2 , wherein

the inert metal electrode comprises silver metal.

4 . The calibration assembly according to claim 1 , wherein

the carrier comprises an opening exposing the inert metal electrode to a lithium deposition source of the lithium deposition process for having a lithium film deposited on the inert metal electrode when processed in the lithium deposition process.

5 . The calibration assembly according to claim 1 , wherein the piezoelectric resonator is removably coupled to the carrier, and wherein the piezoelectric resonator is configured for being removed from the carrier before or after the lithium deposition process.

6 . The calibration assembly according to claim 5 , wherein the piezoelectric resonator is insertable into a connector of the driver for electrically connecting the piezoelectric resonator to the driver.

7 . The calibration assembly according to claim 1 , wherein the piezoelectric resonator, when electrically connected to the driver, is a resonator of a microbalance, or a quartz crystal microbalance, and wherein the piezoelectric resonator comprises one selected from the group consisting of: a quartz crystal, an AT-cut quartz crystal or a SC or a RC-cut quartz crystal.

8 . The calibration assembly according to claim 1 , wherein the calibration assembly is inert when processed in a lithium vapor atmosphere, the lithium vapor atmosphere being generated by evaporating lithium at 500° C. or more under vacuum.

9 . A lithium deposition apparatus, comprising:

a calibration assembly, the calibration assembly comprising:

a carrier; and

a piezoelectric resonator coupled to the carrier, wherein:

the calibration assembly is configured for being processed in the lithium deposition process, the lithium deposition process including a passivation,

the piezoelectric resonator is configured for being electrically connected to a driver for determining a resonant frequency of the piezoelectric resonator,

the resonant frequency is indicative of a thickness of a lithium film deposited on the piezoelectric resonator in the lithium deposition process, and

a change of the resonant frequency over time is indicative of the passivation of the lithium film; the lithium deposition apparatus further comprising:

a processing chamber, comprising a lithium evaporation device; and a transfer chamber connected to the processing chamber, wherein the lithium deposition apparatus is configured for:

processing the calibration assembly in the processing chamber,

transferring the calibration assembly from the processing chamber to the transfer chamber,

passivating a lithium film deposited on the calibration assembly during processing in the transfer chamber, and

electrically connecting the piezoelectric resonator to a driver with a connector, the connector being provided in a testing environment.

10 . The lithium deposition apparatus according to claim 9 , wherein the lithium deposition apparatus comprises the testing environment, the testing environment being connected to the transfer chamber, and wherein the lithium deposition apparatus is configured for transferring the calibration assembly from the transfer chamber to the testing environment.

11 . (canceled)

12 . A method of determining a lithium deposition rate in a lithium deposition process, the method comprising:

providing a calibration assembly comprising a carrier and a piezoelectric resonator coupled to the carrier;

processing the calibration assembly as a substrate in a processing chamber of the lithium deposition process, wherein the piezoelectric resonator is disconnected from a driver during processing;

removing the calibration assembly from the processing chamber; electrically connecting the piezoelectric resonator to a driver;

determining a resonant frequency of the piezoelectric resonator, wherein the resonant frequency is indicative of a thickness of a lithium film deposited on the piezoelectric resonator in the lithium deposition process; and

determining the lithium deposition rate from the thickness of the lithium film.

13 . The method of claim 12 , wherein the piezoelectric resonator is removably coupled to the carrier, the method further comprising:

removably coupling the piezoelectric resonator to the carrier before processing the calibration assembly; and

removing the piezoelectric resonator from the carrier before electrically connecting the piezoelectric resonator to the driver.

14 . The method according to claim 12 , further comprising:

determining a first resonant frequency of the piezoelectric resonator before processing the calibration assembly; determining a second resonant frequency of the piezoelectric resonator after processing the calibration assembly;

determining a resonant frequency difference from the first resonant frequency and the second resonant frequency; and

determining the thickness of the lithium film deposited on the piezoelectric resonator in the lithium deposition process from the resonant frequency difference.

15 . The method according to claim 12 , further comprising:

adjusting a process parameter of the lithium deposition process according to the determined lithium deposition rate.

16 . The method according to claim 12 , further comprising:

forming a passivation layer on the lithium film deposited on the piezoelectric resonator to form a passivated lithium film; and

monitoring a change of the resonant frequency of the piezoelectric resonator over time, wherein

the change of the resonant frequency is indicative of the chemical stability of the passivated lithium film.

17 . The method according to claim 16 , wherein the monitoring is performed in a defined environment, the defined environment having a defined temperature and a defined humidity.

18 . The method according to claim 16 , wherein the passivation layer is formed in a transfer chamber of the lithium deposition process.

19 . A method of characterizing a lithium deposition process, the method comprising:

providing a calibration assembly comprising a carrier and a piezoelectric resonator coupled to the carrier;

processing the calibration assembly as a substrate in a processing chamber of the lithium deposition process;

forming a passivation layer on the lithium film deposited on the piezoelectric resonator to form a passivated lithium film;

removing the calibration assembly from the processing chamber;

electrically connecting the piezoelectric resonator to a driver;

determining a first resonant frequency of the piezoelectric resonator, wherein the first resonant frequency is indicative of a thickness of a lithium film deposited on the piezoelectric resonator in the lithium deposition process;

determining a second resonant frequency, wherein:

determining the second resonant frequency comprises monitoring a change of the second resonant frequency of the piezoelectric resonator over time, and

a change of the second resonant frequency over time is indicative of the chemical stability of the passivated lithium film.

20 . The method according to claim 19 , wherein the piezoelectric resonator is disconnected from a driver while processing and forming the passivation layer.

21 . The method according to claim 19 , wherein the second resonant frequency is determined in a defined environment, the defined environment having a defined temperature and a defined humidity.

22 . (canceled)