CHEMICAL MECHANICAL PLANARIZATION SLURRY PROCESSING TECHNIQUES AND SYSTEMS AND METHODS FOR POLISHING SUBSTRATE USING THE SAME
A Chemical Mechanical Planarization (CMP) system, apparatus, and method comprising providing a source of CMP slurry; modifying the source of CMP slurry to form a modified CMP slurry by directing a source of at least one of mechanical or electromagnetic wave energy at the source of CMP slurry; applying a flow of the modified CMP slurry to a wafer polishing apparatus at which a substrate is positioned; and performing a polishing operation on the substrate.
1 . A Chemical Mechanical Planarization (CMP) method, the method comprising:
mixing (1) an aqueous CMP slurry (2) a capsulizing agent that forms a supramolecular structure selected from a group consisting of a vesicle, a micelle, a polyelectrolyte and a liposome and (3) a material additive selected from a group consisting of a ligand, a ligand-metal complex and a non-metal reactive-oxygen species (ROS) catalyst, thereby forming a modified slurry;
directing at least one of mechanical or electromagnetic wave energy at the modified slurry, thereby forming an activated modified slurry; and
planarizing a substrate while the substrate is exposed to the activated modified slurry.
2 . The method as recited in claim 1 , wherein the capsulizing agent is a poloxamer.
3 . The method as recited in claim 1 , wherein the capsulizing agent is an organic quaternary ammonium salt.
4 . The method as recited in claim 1 , wherein the capsulizing agent is selected from a group consisting of a hydrogen trialkane ammonium salt and a sulfate ester salt.
5 . The method as recited in claim 1 , wherein the capsulizing agent is a salt of a carboxylic acid that has at least ten carbons.
6 . The method as recited in claim 1 , wherein the capsulizing agent is selected from a group consisting of a sorbitan ester and a polyethylene glycol sorbitan ester.
7 . The method as recited in claim 1 , wherein the capsulizing agent is selected from a group consisting alginate, chitosan, pectin, polydiallyldimethylammonium halide, polyethyleneimine, polyacrylic acid, polysodium 4-styrenesulfonate, poly(2-dimethylamino)ethyl methacrylate) methyl halide quaternary salt, poly(allylamine) hydrohalide, poly(dialyldimethylammonium halide).
8 . The method as recited in claim 1 , wherein the capsulizing agent is a phospholipid.
9 . The method as recited in claim 1 , wherein the material additive is a ligand that has a water solubility of less than 20 grams per liter when measured at 22° C.
10 . The method as recited in claim 1 , wherein the material additive is a ligand that has a water solubility of less than 10 grams per liter when measured at 22° C.
11 . The method as recited in claim 1 , wherein the material additive is a ligand that is xanthine or hypoxanthine.
12 . The method as recited in claim 1 , wherein the material additive is a ligand selected from a group consisting of salicyhydroxamic acid (SHA), suberohydroxamic acid, tert-butyl N-(benzyloxy)carbamate, bipyridyl, lysine, tryptophan, phenylalanine, tyrosine, ethyl acetohydroxamate, hydroxycarbamide, benzhydroxamic acid, trans-cinnamic acid, adipic acid and caproic acid.
13 . The method as recited in claim 1 , wherein the material additive is a ligand that is a hydroxamic acid.
14 . The method as recited in claim 1 , wherein the material additive is a ligand that is a hydroxamic acid selected from a group consisting of salicyhydroxamic acid (SHA), suberohydroxamic acid, hydroxycarbamide and benzohydroxamic acid.
15 . The method as recited in claim 1 , wherein the material additive is a ligand that is salicyhydroxamic acid (SHA).
16 . The method as recited in claim 1 , wherein the material additive is a ligand that is an amino acid.
17 . The method as recited in claim 1 , wherein the material additive is a ligand that is an amino acid selected from a group consisting of tryptophan and phenylalanine.
18 . The method as recited in claim 1 , wherein the material additive is a ligand-metal complex with a metal ion selected from a group consisting of a magnesium ion, a calcium ion, a barium ion, a nickel ion, a copper ion, a zinc ion, a strontium ion, an iron ion, a cobalt ion, a titanium ion, a vanadium ion, a chromium ion, a molybdenum ion, and a manganese ion.
19 . The method as recited in claim 18 , wherein the ligand has a water solubility of less than 20 grams per liter when measured at 22° C.
20 . The method as recited in claim 18 , wherein the ligand is salicyhydroxamic acid (SHA).
21 . The method as recited in claim 1 , wherein the step of directing directs mechanical wave energy.
22 . A Chemical Mechanical Planarization (CMP) method, the method comprising:
mixing (1) an aqueous CMP slurry (2) a capsulizing agent that forms a supramolecular structure selected from a group consisting of a vesicle, a micelle, a polyelectrolyte and a liposome and (3) a material additive selected from a group consisting of a ligand, a ligand-metal complex and a non-metal reactive-oxygen species (ROS) catalyst, thereby forming a modified slurry, wherein the material additive has a water solubility of less than 20 grams per liter when measured at 22° C.;
directing mechanical wave energy at the modified slurry, thereby forming an activated modified slurry; and
planarizing a substrate while the substrate is exposed to the activated modified slurry.
23 . The method as recited in claim 22 , wherein the material additive is salicyhydroxamic acid (SHA) and the capsulizing agent is a poloxamer.