IC CHIP MOUNTING APPARATUS AND IC CHIP MOUNTING METHOD

1 . An IC chip mounting apparatus comprising:

a conveyor configured to convey an antenna continuous body, the antenna continuous body having a base material and a plurality of inlay antennas continuously formed on the base material;

an IC placement unit configured to place an IC chip on an adhesive, the adhesive being provided at a reference position of each of the antennas of the antenna continuous body; and

a unit attachment configured to replaceably attach a light curing unit and a thermal curing unit, the light curing unit curing the adhesive by irradiating the adhesive with light, while pressing the IC chip placed on the adhesive toward an antenna side, the thermal curing unit curing the adhesive by heating the adhesive, while pressing the IC chip placed on the adhesive toward an antenna side.

2 . The IC chip mounting apparatus according to claim 1 , wherein

each of the light curing unit and the thermal curing unit comprises an attachment of an identical shape at the opposite side of a pressing surface for pressing the IC chip toward the antenna side, and

the unit attachment comprises a holder for holding the attachment of each of the light curing unit and the thermal curing unit, while positioning the attachment.

3 . The IC chip mounting apparatus according to claim 2 , wherein

the attachment of each of the light curing unit and the thermal curing unit is provided with a magnet, and

the holder has a holding surface formed with a material of ferromagnetic property to hold either the light curing unit or the thermal curing unit.

4 . The IC chip mounting apparatus according to claim 2 , wherein

the unit attachment is configured to attach, along a conveying direction of the antenna continuous body, a plurality of the light curing units or a plurality of the thermal curing units at fixed intervals, and

the holder comprises an opening-formed plate with a plurality of openings formed at fixed intervals along the conveying direction of the antenna continuous body, each of the plurality of openings receiving and holding the attachment of each of the plurality of the light curing units or each of the plurality of the thermal curing unit.

5 . The IC chip mounting apparatus according to claim 4 , wherein the opening-formed plate is detachably attached.

6 . The IC chip mounting apparatus according to claim 1 , wherein the light curing unit comprises a pressing surface made of glass, the pressing surface pressing the IC chip placed on the adhesive and transmitting light.

7 . An IC chip mounting method comprising:

conveying an antenna continuous body, the antenna continuous body having a base material and a plurality of inlay antennas continuously formed on the base material;

placing an IC chip on an adhesive, the adhesive being provided at a reference position of each of the antennas of the antenna continuous body; and

attaching selectively a light curing unit or a thermal curing unit to a unit attachment device, the light curing unit curing the adhesive by irradiating the adhesive with light, while pressing the IC chip placed on the adhesive toward an antenna side, the thermal curing unit curing the adhesive by heating the adhesive, while pressing the IC chip placed on the adhesive toward an antenna side.

8 . The IC chip mounting apparatus according to claim 3 , wherein

the unit attachment is configured to attach, along a conveying direction of the antenna continuous body, a plurality of the light curing units or a plurality of the thermal curing units at fixed intervals, and

the holder comprises an opening-formed plate with a plurality of openings formed at fixed intervals along the conveying direction of the antenna continuous body, each of the plurality of openings receiving and holding the attachment of each of the plurality of the light curing units or each of the plurality of the thermal curing unit.

9 . The IC chip mounting method according to claim 7 , wherein

the unit attachment device holds an attachment of the light curing unit or the thermal curing unit, while positioning the attachment.

10 . The IC chip mounting method according to claim 9 , wherein

the unit attachment device holds an attachment with magnetic force.