IP Library Patent Application 18874893
Patent Application
App. No. 18/874,893

POLISHING MATERIAL SLURRY AND POLISHING METHOD OF SAME

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Quick Facts
Patent No.
US None
App. No.
18/874,893
Abstract

An abrasive slurry of the present invention includes manganese oxide abrasive grains containing manganese oxide particles, permanganate ions, and phosphates. Furthermore, in a polishing method of the abrasive slurry of the present invention, an object to be polished is polished using the abrasive slurry of the present invention.

Claims (32)

1 . An abrasive slurry comprising:

manganese oxide abrasive grains containing manganese oxide particles;

permanganate ions; and

phosphates.

2 . The abrasive slurry according to claim 1 , wherein the phosphates are inorganic phosphorus compounds.

3 . The abrasive slurry according to claim 2 , wherein the inorganic phosphorus compounds are pyrophosphate compounds.

4 . The abrasive slurry according to claim 1 , further comprising:

a cellulose-based surfactant and/or a cationic surfactant.

5 . The abrasive slurry according to claim 4 , wherein the cellulose-based surfactant contains carboxymethyl cellulose.

6 . The abrasive slurry according to claim 1 , wherein the content of the manganese oxide abrasive grains is 0.5 mass % or more and 20 mass % or less,

the content of the permanganate ions is 0.5 mass % or more and 3.2 mass % or less, and

the content of the phosphates is 0.01 mass % or more and 0.1 mass % or less.

7 . The abrasive slurry according to claim 4 , wherein the content of the manganese oxide abrasive grains is 0.5 mass % or more and 20 mass % or less,

the content of the permanganate ions is 0.5 mass % or more and 3.2 mass % or less,

the content of the phosphates is 0.01 mass % or more and 0.1 mass % or less, and

the total content of the cellulose-based surfactant and/or the cationic surfactant is 1.0 mass % or less.

8 . A polishing method comprising:

polishing an object to be polished using the abrasive slurry according to claim 1 .

9 . A polishing method comprising:

polishing an object to be polished using the abrasive slurry according to claim 6 .

10 . A polishing method comprising:

polishing an object to be polished using the abrasive slurry according to claim 7 .

11 . The abrasive slurry according to claim 2 , wherein the content of the manganese oxide abrasive grains is 0.5 mass % or more and 20 mass % or less,

the content of the permanganate ions is 0.5 mass % or more and 3.2 mass % or less, and

the content of the phosphates is 0.01 mass % or more and 0.1 mass % or less.

12 . The abrasive slurry according to claim 3 , wherein the content of the manganese oxide abrasive grains is 0.5 mass % or more and 20 mass % or less,

the content of the permanganate ions is 0.5 mass % or more and 3.2 mass % or less, and

the content of the phosphates is 0.01 mass % or more and 0.1 mass % or less.

13 . The abrasive slurry according to claim 5 , wherein the content of the manganese oxide abrasive grains is 0.5 mass % or more and 20 mass % or less,

the content of the permanganate ions is 0.5 mass % or more and 3.2 mass % or less,

the content of the phosphates is 0.01 mass % or more and 0.1 mass % or less, and

the total content of the cellulose-based surfactant and/or the cationic surfactant is 1.0 mass % or less.

Assignments (2)
CHANGE OF NAME Recorded Nov 14, 2025
From: MITSUI MINING & SMELTING CO., LTD.
To: MITSUI KINZOKU COMPANY, LIMITED
Reel/Frame 073570/0734 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 13, 2024
From: NAKAMURA, TAKUMA; SARUWATARI, YASUNOBU
To: MITSUI MINING & SMELTING CO., LTD.
Reel/Frame 069579/0386 →