APPARATUS FOR PHYSICAL VAPOUR DEPOSITION OF METALLIC ACTIVE MATERIAL ANODES
A physical vapour deposition apparatus includes: a rotating drum carrying a substrate; a molten metal bath spaced from the substrate; a metal vapour conduit extending between the molten metal bath and the substrate, the metal vapour conduit having at least one wall; and temperature control elements configured to control a temperature of the at least one wall.
1 . A physical vapour deposition apparatus comprising:
a rotating drum carrying a substrate;
a molten metal bath spaced from the substrate;
a metal vapour conduit extending between the molten metal bath and the substrate, the metal vapour conduit having at least one wall; and
temperature control elements configured to control a temperature of the at least one wall.
2 . The physical vapour deposition apparatus of claim 1 , wherein the temperature control elements comprise at least one of: a resistive heating element; an induction heating susceptor; a coolant fluid circuit; and a combination thereof.
3 . The physical vapour deposition apparatus of claim 1 , wherein the temperature control elements are configured to heat the at least one wall to above a melting point of metal in the molten metal bath.
4 . The physical vapour deposition apparatus of claim 1 , wherein the metal vapour conduit is sized and positioned such that metal condensation on at least one wall flows downwardly along the surface of the at least one wall into the molten metal bath.
5 . The physical vapour deposition apparatus of claim 1 , wherein the at least one wall is spaced from the substrate to define a gap therebetween.
6 . The physical vapour deposition apparatus of claim 5 , wherein the gap is less than 5 mm.
7 . A physical vapour deposition apparatus comprising:
a rotating drum carrying a substrate;
a molten metal bath spaced from the substrate; and
a mask disposed between the substrate and the molten metal bath, the mask defining an aperture through which metal vapour flux passes to reach the substrate, the aperture and the substrate each having a respective width that is less than a width of the molten metal bath.
8 . The physical vapour deposition apparatus of claim 7 , wherein a portion of the mask surrounding the aperture blocks the metal vapour flux from reaching the substrate.
9 . The physical vapour deposition apparatus of claim 7 , wherein the mask is disposed closer to the substrate than to the molten metal bath.
10 . The physical vapour deposition apparatus of claim 7 , further comprising a metal vapour conduit extending between the molten metal bath and the substrate, the metal vapour conduit having at least one wall.
11 . The physical vapour deposition apparatus of claim 10 , wherein the mask comprises at least one flange extending inwardly from the at least one wall, the at least one flange defining the aperture.
12 . The physical vapour deposition apparatus of claim 10 , further comprising temperature control elements configured to control a temperature of at least one of:
said at least one wall; and
the mask.
13 . A physical vapour deposition apparatus comprising:
a rotating drum carrying a substrate;
a molten metal bath spaced from the substrate;
a metal vapour conduit extending between the molten metal bath and the substrate, the metal vapour conduit having at least one wall; and
at least one longitudinal slat disposed within the metal vapour conduit.
14 . The physical vapour deposition apparatus of claim 13 , wherein the at least one longitudinal slat is oriented substantially perpendicularly to a surface of the molten metal bath.
15 . The physical vapour deposition apparatus of claim 13 , wherein the at least one longitudinal slat is a single longitudinal slat positioned directly above a midpoint of a width of the molten metal bath.
16 . The physical vapour deposition apparatus of claim 15 , wherein the single longitudinal slat has a length that is greater than 0.7 times a spacing of the molten metal bath from the substrate.
17 . The physical vapour deposition apparatus of claim 13 , wherein the at least one wall is spaced from the substrate to define a gap therebetween.
18 . The physical vapour deposition apparatus of claim 17 , wherein the at least one longitudinal slat is sized and positioned to block metal vapour flux from entering the gap.
19 . The physical vapour deposition apparatus of claim 18 , wherein the longitudinal slat is positioned directly above a first side of a midpoint of a width of the molten metal bath, the longitudinal slat being sized and positioned to block metal vapour flux emitted from a second side of the midpoint of the width of the molten metal bath from entering the gap.
20 . The physical vapour deposition apparatus of claim 13 , further comprising temperature control elements configured to control a temperature of at least one of:
said at least one wall; and
said at least one longitudinal slat.