Camera module
According to one embodiment, a camera module includes an image sensor and a liquid crystal panel. The liquid crystal panel includes an aperture portion in which first and second regions are formed, a liquid crystal layer disposed in a position overlapping the aperture portion, a first electrode disposed in a position overlapping the first region and a second electrode disposed in a position overlapping the second region, a driver which drives the liquid crystal layer, a non-aperture portion which surrounds the aperture portion, a first pad that electrically connects the first electrode to the driver and a second pad that electrically connects the second electrode to the driver.
1 . A camera module comprising:
an image sensor; and
a liquid crystal panel, wherein the liquid crystal panel including:
an aperture portion in which first and second regions are formed to be disposed in positions to allow light to enter the image sensor;
a liquid crystal layer disposed in a position overlapping the aperture portion;
a first electrode disposed in a position overlapping the first region and a second electrode disposed in a position overlapping the second region;
a driver which drives the liquid crystal layer by applying a voltage to each of the first and second electrodes;
a non-aperture portion which surrounds the aperture portion; and
a first pad that electrically connects the first electrode to the driver and a second pad that electrically connects the second electrode to the driver, the first and second pads being disposed in a position overlapping the non-aperture portion,
wherein
the first and second pads are disposed at position opposing each other while interposing the aperture portion therebetween,
the aperture portion has a circular shape, and
the first and second pads have an arc shape along the circular shape of the aperture portion.
2 . The camera module of claim 1 , wherein
the liquid crystal panel includes first and second substrates that hold the liquid crystal layer, and
the first and second pads are formed on the first substrate and are electrically connected to the driver mounted on a drive board disposed on a rear surface of the first substrate via a flexible circuit board.