SEMICONDUCTOR DEVICE ARRANGEMENT STRUCTURE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device arrangement structure includes a carrier, semiconductor devices, and an adhesive layer. The semiconductor devices are separately disposed on the carrier, and each of the semiconductor devices includes an electrode. The adhesive layer is disposed between the carrier and the semiconductor devices, and the semiconductor devices are attached to the adhesive layer which is a continuous distributed single-layered structure. The adhesive layer includes unselected regions and a selected region, wherein the unselected regions are covered by the semiconductor devices respectively, and the selected region is not covered by the semiconductor devices. The adhesive layer further includes an indentation disposed on a surface of the selected region, and in a cross-sectional view or a top view, the contour of the indentation is a scaled copy of a contour of and the electrode, and the indentation has a depth less than that of the electrode.
1 . A semiconductor device arrangement structure, comprising:
a carrier;
a plurality of semiconductor devices separately disposed on the carrier, the plurality of semiconductor devices each comprising an electrode, the electrode each comprising a contour and a thickness;
an adhesive layer disposed between the carrier and the plurality of semiconductor devices, the plurality of semiconductor devices attached to the adhesive layer, wherein the adhesive layer is a single-layered structure which is continuously distributed and comprises a plurality of unselected regions and a selected region, the plurality of unselected regions are covered by the plurality of semiconductor devices one-on-one respectively, and the selected region is not covered by one of the plurality of semiconductor devices and has a surface; and
an indentation disposed on the surface of the selected region and comprising a depth, and in a cross-sectional view, the indentation having a contour which is a scaled copy of the contour of the electrode of one of the plurality of semiconductor devices, and the depth of the indentation is less than the thickness of the electrode of the aforementioned one of the plurality of semiconductor devices.
2 . The semiconductor device arrangement structure as claimed in claim 1 , wherein the plurality of the semiconductor devices comprises a first semiconductor device and a second semiconductor device, each of the first semiconductor device and the second semiconductor device comprises a width respectively, the first semiconductor device is adjacent to the second semiconductor device, a shortest distance defined between the first semiconductor device and the second semiconductor device is less than the width of each of the first semiconductor device and the second semiconductor device and greater than one fifth of the width of each of the first semiconductor device and second semiconductor device.
3 . The semiconductor device arrangement structure as claimed in claim 1 , wherein a portion of the electrode is embedded in the adhesive layer and the portion of the electrode has a depth ranged from 0.02 μm to 0.5 μm.
4 . The semiconductor device arrangement structure as claimed in claim 1 , wherein the adhesive layer comprises:
a covered portion, disposed at one of the unselected regions and covered by a corresponding one of the plurality of semiconductor devices, the covered portion comprising a first average thickness; and
an exposed portion, disposed at the aforementioned one of the unselected regions and surrounding the covered portion, the exposed portion exposed from the corresponding one of the plurality of semiconductor devices, and the exposed portion comprising a second average thickness;
wherein a ratio of the first average thickness to the second average thickness is ranged from 0.96 to 1.
5 . The semiconductor device arrangement structure as claimed in claim 1 , wherein when the unselected region of the adhesive layer is irradiated by a laser light with a wavelength of 193 nm, a volume of the unselected region that is irradiated of the adhesive layer is swollen and a pushing force which is equal to or greater than 25 gram-force is generated toward a corresponding one of the plurality of semiconductor devices.
6 . A manufacturing method for semiconductor device arrangement structure, comprising steps of:
providing a carrier, wherein the carrier is provided with an adhesive layer on a surface thereof, and the adhesive layer is a single-layered elastomer;
attaching a semiconductor device to a selected region of the adhesive layer;
providing a target substrate comprising a surface facing the semiconductor device and not contacting the semiconductor device; and
energizing the selected region of the adhesive layer to make the semiconductor device separated from the adhesive layer and transferred to the surface of the target substrate, wherein before energizing the selected region of the adhesive layer, the selected region of the adhesive layer is remained to be attached to the carrier.
7 . The manufacturing method for semiconductor device arrangement structure as claimed in claim 6 , wherein when the adhesive layer is an UV light debonding glue, before energizing the selected region of the adhesive layer, further comprising a step of:
irradiating UV light to the UV light debonding glue to reduce adhesion of the UV light debonding glue.
8 . The manufacturing method for semiconductor device arrangement structure as claimed in claim 6 , wherein the semiconductor device comprises an electrode, a portion of the electrode is embedded in the adhesive layer, and the portion of the electrode comprises a depth ranged from 0.02 μm to 0.5 μm.
9 . The manufacturing method for semiconductor device arrangement structure as claimed in claim 6 , wherein in the step of energizing the selected region of the adhesive layer, laser light is employed to irradiate the selected region of the adhesive layer.
10 . The manufacturing method for semiconductor device arrangement structure as claimed in claim 6 , further comprising:
before proving the target substrate, attaching another semiconductor device to an unselected region of the adhesive layer; and
after energizing the selected region of the adhesive layer, the aforementioned another one semiconductor device is remained to be attached to the unselected region of the adhesive layer.