IP Library Patent Application 18911264
Patent Application
App. No. 18/911,264

MICRO LED DISPLAY PANEL

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Quick Facts
Patent No.
US None
App. No.
18/911,264
Abstract

A micro LED display panel includes a micro LED array area including a plurality of micro LED structures. Each of the micro LED structures includes: a first type epitaxial layer; a light emitting layer formed on the first type epitaxial layer; and a second type epitaxial layer formed on the light emitting layer. The second type epitaxial layer includes: a micro lens structure and a bottom structure, the micro lens structure and the bottom structure being an integrative structure.

Claims (42)

1 . A micro LED display panel, comprising a micro LED array area including a plurality of micro LED structures, wherein each of the micro LED structures comprises:

a first type epitaxial layer;

a light emitting layer formed on the first type epitaxial layer; and

a second type epitaxial layer formed on the light emitting layer, wherein the second type epitaxial layer comprises:

a micro lens structure and a bottom structure, the micro lens structure and the bottom structure being an integrated structure.

2 . The micro LED display panel according to claim 1 , wherein a mesa structure comprises the first type epitaxial layer, the light emitting layer, and the bottom structure of the second type epitaxial layer; and the micro LED structure further comprising a dielectric layer formed between adjacent mesa structures of adjacent micro LED structures.

3 . The micro LED display panel according to claim 2 , wherein a sidewall of the mesa structure is inclined.

4 . The micro LED display panel according to claim 2 , wherein the micro LED structure further comprises: a passivation layer formed on a sidewall surface of the mesa structure.

5 . The micro LED display panel according to claim 4 , wherein the passivation layer is further formed on a top surface of the dielectric layer.

6 . The micro LED display panel according to claim 4 , further comprising:

one or more IO (input/output) vias formed outside the micro LED array area and through the dielectric layer and the passivation layer;

one or more top connection pads corresponding to the one or more IO vias, wherein one top connection pad is formed on a top of one IO via;

an integrated circuit (IC) backplane provided at a bottom of the dielectric layer; and

one or more bottom pads provided on the IC backplane corresponding to plurality of micro LED structures, wherein a bottom of one IO via is bonded with one bottom pad.

7 . The micro LED display panel according to claim 4 , wherein the micro LED structure further comprises a reflective layer formed on a sidewall surface of a portion of the passivation layer.

8 . The micro LED display panel according to claim 7 , wherein the reflective layer is further formed on a bottom of the mesa structure.

9 . The micro LED display panel according to claim 8 , wherein a bottom contact is further formed on the bottom of the mesa structure and on an inner surface of the reflective layer.

10 . The micro LED display panel according to claim 7 , wherein a material of the reflective layer is selected from one or more of Al, Ag, Ti, Pt, Au, Ni, Cr, or Sn.

11 . The micro LED display panel according to claim 4 , wherein a material of the passivation layer is selected from one or more of SiO 2 , Si 3 N 4 , or Al 2 O 3 .

12 . The micro LED display panel according to claim 2 , further comprising an integrated circuit (IC) backplane formed at a bottom of the dielectric layer.

13 . The micro LED display panel according to claim 12 , wherein the micro LED structure further comprises: a bottom contact formed at a bottom of the first type epitaxial layer and bonded with a bottom pad of the IC backplane.

14 . The micro LED display panel according to claim 1 , wherein the micro LED structure further comprises a top transparent conductive layer formed on a surface of the micro lens structure.

15 . The micro LED display panel according to claim 14 , wherein a material of the top transparent conductive layer is selected from one of ITO (Indium Tin Oxide), Al doped ZnO, or Ga doped ZnO.

16 . The micro LED display panel according to claim 14 , wherein the top transparent conductive layer continuously covers a whole surface of the second type epitaxial layer.

17 . The micro LED display panel according to claim 16 , further comprising a top contact formed on the top transparent conductive layer between adjacent micro lens structures

18 . The micro LED display panel according to claim 14 , wherein a thickness of the top transparent conductive layer is in a range of 5 nm to 500 nm.

19 . The micro LED display panel according to claim 14 , further comprising an electrode pad formed on an edge of the micro LED array area and connected with the top transparent conductive layer.

20 . The micro LED display panel according to claim 19 , wherein an end of the top transparent conductive layer is formed on part of a top of the electrode pad and on a sidewall of the electrode pad.

21 . The micro LED display panel according to claim 19 , wherein a sidewall of the top transparent conductive layer is connected with a sidewall of the electrode pad.

22 . The micro LED display panel according to claim 21 , wherein a top of the electrode pad is higher than a top of an end of the top transparent conductive layer.

23 . The micro LED display panel according to claim 14 , further comprising:

an integrated circuit (IC) backplane provided at a bottom of the micro LED array area; and

a signal source electrically connected with the IC backplane and the top transparent conductive layer.

24 . The micro LED display panel according to claim 1 , wherein a material of the first type epitaxial layer is selected from one or more of GaN, AlGaN, GaP, AlGaInP, or AlInP; a material of the second type epitaxial layer is selected from one or more of AlInP, AlGaInP, GaN, or AlGaN; and the light emitting layer is a quantum well layer.

25 . The micro LED display panel according to claim 1 , wherein the micro lens structure and the bottom structure are made of a same material.

26 . The micro LED display panel according to claim 25 , wherein the micro lens structure is semi-spherical, conical, pyramidal, cylindrical, or circular truncated conical.

27 . The micro LED display panel according to claim 25 , wherein a height of the micro lens structure is in a range of 0.05 μm to 10 μm, and a diameter of a bottom cross section of the micro lens structure is in a range of 0.5 μm to 10 μm.

28 . The micro LED display panel according to claim 2 , wherein the second type epitaxial layer further comprises: an extrusion portion interconnected between adjacent micro LED structures.

29 . The micro LED display panel according to claim 28 , wherein the extrusion portion extends along a horizontal direction.

30 . The micro LED display panel according to claim 28 , wherein the micro LED structure further comprises: a passivation layer formed on a bottom surface of the extrusion portion and on a sidewall surface of the mesa structure.

31 . The micro LED display panel according to claim 30 , wherein the micro LED structure further comprises: a reflective layer formed on a sidewall surface of a portion of the passivation layer and on at least part under a bottom surface of the extrusion portion.

32 . The micro LED display panel according to claim 30 , wherein the micro LED structure further comprises: a top transparent conductive layer formed on a surface of the micro lens structure and on a top surface of the extrusion portion.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 9, 2026
From: JADE BIRD DISPLAY (SHANGHAI) LIMITED
To: HUE INC.
Reel/Frame 075373/0207 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 10, 2024
From: CAO, JIN; GUO, JIAN
To: JADE BIRD DISPLAY (SHANGHAI) LIMITED
Reel/Frame 068856/0771 →