NOVEL HEAT PIPE CONFIGURATIONS

1 . A heat pipe of the type which has a condenser section in which gaseous refrigerant is condensed to produce liquid refrigerant comprising:

(a) at least one closed pipe comprising:

(i) a condenser section,

(ii) a first evaporator section in fluid communication with said condenser section; and

(iii) at least a second evaporator section in fluid communication with said condenser section;

(b) refrigerant contained in said heat pipe;

(c) at least a first liquid flow path leading a first portion of liquid refrigerant condensed in said condenser section to said first evaporator section; and

(d) at least a second liquid flow path leading a second portion of liquid refrigerant condensed in said condenser section to said second evaporator section, wherein said second evaporator section comprises a reservoir holding liquid refrigerant at a location different than said first evaporator section.

2 . The heat pipe of claim 1 wherein the heat pipe is configured to use gravity at least in part to return refrigerant liquid to from said condenser section to said first and said second evaporator section.

3 . The heat pipe of claim 1 wherein said second liquid flow path comprises one or more obstructions in said heat pipe and being oriented at an angle with respect to the vertical direction and to divert at least a portion of said liquid refrigerant from said condenser section toward said second evaporator.

4 . The heat pipe of claim 1 wherein said second evaporator section comprises a reservoir holding liquid refrigerant at a location different than said first evaporator section.

5 . The heat pipe of claim 1 further comprising at least a third liquid flow path leading a third portion of liquid refrigerant condensed in said condenser section to said third evaporator section, wherein: (i) said third liquid flow path comprises one or more obstructions oriented at an angle with respect to the vertical direction and which divert at least a portion of said liquid refrigerant from said condenser section toward said third evaporator; and (ii) said third evaporator section comprises a reservoir holding liquid refrigerant at a location different than said first evaporator section and different than said second evaporator section.

6 . The heat pipe of claim 5 wherein at least one of said second evaporator section and/or said third evaporator section has a total volume that is about 0.7 times (about 70%) or less than the volume of the first evaporator section.

7 . The heat pipe of claim 1 wherein said second evaporator section has a total volume that is about 0.7 times (about 70%) or less than the volume of the first evaporator section.

8 . The heat pipe of claim 1 wherein said liquid refrigerant comprises R-1233zd (E).

9 . The heat pipe of claim 1 wherein said liquid refrigerant consists essentially of R-1233zd (E).

10 . A printed circuit board (PCB) comprising:

(a) at least a first heat generating component mounted to the PCB at a first location;

(b) at least a second heat generating component mounted to the PCB at a second location different than said first location; and

(c) at least one heat pipe comprising a closed pipe comprising:

(i) a condenser section in thermal communication with cooling fluid located outside of said heat pipe,

(ii) a first evaporator section comprising a first reservoir containing liquid refrigerant in heat transfer contact with said first heat generating component;

(iii) a first liquid flow path leading a first portion of liquid refrigerant condensed in said condenser section to said reservoir in said first evaporator section;

(iii) at least a second evaporator section comprising a second reservoir at a location along said heat pipe different than said first reservoir and containing a second portion of liquid refrigerant in heat transfer contact with said at least said second heat generating component; and

(iv) at least a second liquid flow path leading said second portion of liquid refrigerant condensed in said condenser section to said reservoir in said second evaporator section.

11 . A telecommunication device that includes the PCB of claim 10 .

12 . The PCB of claim 10 wherein at least one of aid first or second heat generating components is a 5G chip.

13 . The PCB of claim 12 wherein said refrigerant comprises R-1233zd (E).

14 . The PCB of claim 1 wherein said liquid refrigerant consists essentially of R-1233zd (E).

15 . A method of transferring heat comprising use of a heat pipe of the type which has a condenser section in which gaseous refrigerant is condensed to produce liquid refrigerant, said method comprising:

(a) providing a closed heat pipe comprising:

(i) a condenser section in heat transfer communication with a heat sink located outside the heat pipe,

(ii) a first evaporator section in fluid communication with said condenser section and comprising a first reservoir containing liquid refrigerant; and

(iii) at least a second evaporator section in fluid communication with said condenser section and comprising a second reservoir containing liquid refrigerant;

(iv) at least a first liquid flow path leading from said condenser section to said first reservoir; and

(v) at least a second liquid flow path leading from said condenser section to said second reservoir;

(b) cooling a first component or device by thermal contact with said liquid refrigerant in said first reservoir to produce refrigerant vapor that travels to said condenser section;

(c) cooling a second component or device by thermal contact with said liquid refrigerant in said second reservoir to produce refrigerant vapor that travels to said condenser section; and

(d) condensing refrigerant vapor in the condenser section to produce condensed liquid refrigerant and returning via said first liquid flow path a first portion of said condensed liquid refrigerant to said first reservoir and returning via said second liquid flow path a second portion of said condensed liquid refrigerant to said second reservoir.

16 . A method of transferring heat according to claim 15 wherein said first and second components are components located on a PCB.

17 . The method of claim 15 wherein either said first and/or said second component is a 5G chip.

18 . The method of claim 17 wherein said refrigerant comprises R-1233zd (E).

19 . The method of claim 17 wherein said liquid refrigerant consists essentially of R-1233zd (E).

20 . The method of claim 19 wherein said 5G chip is located in a telecommunications device.