TUNING COUPLING STRENGTH BETWEEN CONTROL LINES AND QUANTUM CIRCUIT DEVICES IN SUPERCONDUCTING QUANTUM PROCESSORS
In a general aspect, tuning the coupling strength between a qubit device and nearby control lines is described. In some implementations, a method includes identifying a design of first and second quantum processor wafers of a quantum processing system. The first quantum processor wafer includes a qubit device which includes two qubit electrodes and a SQUID loop. The second quantum processor wafer includes a control line which is configured to apply control signals to the qubit device and includes first and second control ports, a circuit loop inductively coupled to the SQUID loop, and conductive traces connected between the circuit loop and the respective first and second control ports. The control lines are capacitively coupled to the two qubit electrodes. The method includes obtaining simulation data and experimental data from measurements of the quantum processing system, and modifying the design based on the simulation data and the experimental data.
1 . A method comprising:
identifying a design of first and second quantum processor wafers of a quantum processing system, the first quantum processor wafer comprising a qubit device, the qubit device comprising two qubit electrodes and a SQUID loop connected between the two qubit electrodes, the second quantum processor wafer comprising a control line configured to apply control signals to the qubit device, the control line comprising:
first and second control ports;
a circuit loop inductively coupled to the SQUID loop; and
conductive traces connected between the circuit loop and the respective first and second control ports, the conductive traces being capacitively coupled to the two qubit electrodes;
obtaining simulation data from simulations of the quantum processing system based on the design;
obtaining experimental data from measurements of the quantum processing system manufactured according to the design; and
modifying the design of the second quantum processor wafer based on the simulation data and the experimental data, wherein modifying the design comprises modifying a differential capacitance between the control line and the two qubit electrodes based on one or more predefined constraints.
2 . The method of claim 1 , wherein the one or more predefined constraints comprise at least one of:
a coherence time,
a gate time, or
an energy loss.
3 . The method of claim 1 , wherein each of the first and second control ports comprises a superconducting through-hole via extending from a first surface to a second, opposite surface of the second quantum processor wafer.
4 . The method of claim 1 , wherein modifying the differential capacitance comprises modifying a geometry of one or more of the conductive traces.
5 . The method of claim 1 , wherein modifying the differential capacitance comprises at least one of:
modifying a length of one or more of the conductive traces; or modifying an angle of one or more turns in one or more of the conductive traces.
6 . The method of claim 1 , wherein:
each of the conductive traces comprises:
a first section that extends in a first direction from a control port toward the circuit loop;
a second section that extends in a second direction from the control loop toward one of the two qubit electrodes, wherein the second direction is perpendicular to the first direction; and
an intermediate section that connects the first and second sections; and
wherein modifying the differential capacitance comprises:
modifying lengths of one or more sections of the conductive traces; and
modifying an orientation of the intermediate sections relative to the first and second sections.
7 . The method of claim 1 , wherein modifying the differential capacitance comprises at least one of:
adding one or more transmission line branches to the control line of the second quantum processor wafer; or
modifying one or more transmission line branches extending from the control line of the second quantum processor wafer.
8 . The method of claim 1 , wherein modifying the differential capacitance comprises at least one of:
adding one or more transmission line branches to the qubit device on the first quantum processor wafer; or
modifying one or more transmission line branches extending from the qubit device of the first quantum processor wafer.
9 . The method of claim 1 , wherein the differential capacitance is a first differential capacitance, the qubit device is a first qubit device, the first quantum processor wafer comprises a second qubit device communicably coupled to the first qubit device, the second qubit device comprises two respective qubit electrodes, and modifying the design comprises modifying a second differential capacitance between the control line and one of the two respective qubit electrodes of the second qubit device.
10 . The method of claim 1 , wherein obtaining experimental data comprises:
determining a Purcell limited relaxation rate of the qubit device based on the simulation data and the measurements.
11 . The method of claim 10 , wherein determining the Purcell limited relaxation rate of the qubit device comprises:
determining drivability and decoherence time for a specific qubit frequency and control line design;
determining a minimum relaxation time; and
determining an update value of the drivability based on a predefined criterion.
12 . The method of claim 11 , wherein the predefined criterion comprises a tradeoff between relaxation rate and gate performance.
13 . A computing system comprising:
one or more processors; and
memory storing instructions configured to perform operations when executed by the one or more processors, the operations comprising:
identifying a design of first and second quantum processor wafers of a quantum processing system, the first quantum processor wafer comprising a qubit device, the qubit device comprising two qubit electrodes and a superconducting quantum interference device (SQUID) loop connected between the two qubit electrodes, the second quantum processor wafer comprising a control line configured to apply control signals to the qubit device, the control line comprising:
first and second control ports;
a circuit loop inductively coupled to the SQUID loop; and
conductive traces connected between the circuit loop and the respective first and second control ports, the conductive traces control lines being capacitively coupled to the two qubit electrodes;
obtaining simulation data from numerical simulations of the quantum processing system based on the design;
obtaining experimental data based on measurements of the quantum processing system manufactured according to the design; and
modifying the design of the second quantum processor wafer based on the simulation data and the experimental data, wherein modifying the design comprises modifying a differential capacitance between the control line and the two qubit electrodes based on one or more predefined constraints.
14 . The system of claim 13 , wherein the one or more predefined constraints comprise at least one of:
a coherence time,
a gate time, or
an energy loss.
15 . The system of claim 13 , wherein each of the first and second control ports comprises a superconducting through-hole via extending from a first surface to a second opposite surface of the second quantum processor wafer.
16 . The system of claim 13 , wherein modifying the differential capacitance comprises modifying a geometry of one or more of the conductive traces.
17 . The system of claim 13 , wherein modifying the differential capacitance comprises at least one of:
modifying a length of one or more of the conductive traces; or
modifying an angle of one or more turns in one or more of the conductive traces.
18 . The system of claim 13 , wherein:
each of the conductive traces comprises:
a first section that extends in a first direction from a control port toward the circuit loop;
a second section that extends in a second direction from the control loop toward one of the two qubit electrodes, wherein the second direction is perpendicular to the first direction; and
an intermediate section that connects the first and second sections; and
wherein modifying the differential capacitance comprises:
modifying lengths of one or more sections of the conductive traces; and
modifying an orientation of the intermediate sections relative to the first and second sections.
19 . The system of claim 13 , wherein modifying the differential capacitance comprises at least one of:
adding one or more transmission line branches to one or more of the conductive traces; or
modifying one or more transmission line branches extending from one or more of the conductive traces.
20 . The system of claim 13 , wherein modifying the differential capacitance comprises at least one of:
adding one or more transmission line branches to the qubit device of the first quantum processor wafer; or
modifying one or more transmission line branches extending from the qubit device of the first quantum processor wafer.
21 . The system of claim 13 , wherein the differential capacitance is a first differential capacitance, the qubit device is a first qubit device, the first quantum processor wafer comprises a second qubit device communicably coupled to the first qubit device, the second qubit device comprises two respective qubit electrodes, and modifying the design comprises modifying a second differential capacitance between the control line and one of the two respective qubit electrodes of the second qubit device.
22 . The system of claim 13 , wherein obtaining experimental data comprises:
determining a Purcell limited relaxation rate of the qubit device based on the simulation data and the experimental data.
23 . The system of claim 22 , wherein determining the Purcell limited relaxation rate of the qubit device comprises:
determining drivability and decoherence time for a specific qubit frequency and control line design;
determining a minimum relaxation time; and
determining an update value of the drivability based on a predefined criterion.
24 . The system of claim 23 , wherein the predefined criterion comprises a tradeoff between relaxation rate and gate performance.
25 - 38 . (canceled)