Packaging film and preparation method thereof, and filter chip packaging method
A packaging film and a preparation method thereof, and a filter chip packaging method are provided. The raw materials of the packaging film include: 20-24 parts by mass of silicon dioxide, 24-26 parts by mass of aliphatic polyurethane acrylate, 12-15 parts by mass of phenoxy resin, 5-13 parts by mass of flexible liquid epoxy resin, 10 parts by mass of bisphenol F epoxy resin, 17-19 parts by mass of curing agent, 2-5 parts by mass of photoinitiator, and 0.4-0.8 parts by mass of accelerant, where the curing agent is compounded by bisphenol F-based benzoxazine curing agent and dicyandiamide curing agent according to the mass ratio of 10:(7-9). The packaging film has excellent flexibility and adhesion, a low moisture absorption rate, and high heat resistance and is especially suitable for the packaging of filter chips.
1. A packaging film, wherein raw materials of the packaging film comprise:
20-24 parts by mass of silicon dioxide, 24-26 parts by mass of aliphatic polyurethane acrylate, 12-15 parts by mass of phenoxy resin, 5-13 parts by mass of flexible liquid epoxy resin, 10 parts by mass of bisphenol F epoxy resin, 17-19 parts by mass of a curing agent, 2-5 parts by mass of a photoinitiator, and 0.4-0.8 parts by mass of an accelerant; wherein the curing agent is compounded by a bisphenol F-based benzoxazine curing agent and a dicyandiamide curing agent according to a mass ratio of 10: (7-9).
2. The packaging film according to claim 1 , wherein the raw materials of the packaging film comprise:
22-24 parts by mass of the silicon dioxide, 26 parts by mass of the aliphatic polyurethane acrylate, 12-15 parts by mass of the phenoxy resin, 5-8 parts by mass of the flexible liquid epoxy resin, 10 parts by mass of the bisphenol F epoxy resin, 18-19 parts by mass of the curing agent, 2-5 parts by mass of the photoinitiator, and 0.4-0.8 parts by mass of the accelerant; wherein the curing agent is compounded by the bisphenol F-based benzoxazine curing agent and the dicyandiamide curing agent according to a mass ratio of 10: (8-9).
3. The packaging film according to claim 1 , wherein the raw materials of the packaging film comprise:
22-24 parts by mass of the silicon dioxide, 26 parts by mass of the aliphatic polyurethane acrylate, 15 parts by mass of the phenoxy resin, 5-8 parts by mass of the flexible liquid epoxy resin, 10 parts by mass of the bisphenol F epoxy resin, 19 parts by mass of the curing agent, 2-5 parts by mass of the photoinitiator, and 0.4-0.8 parts by mass of the accelerant; wherein the curing agent is compounded by the bisphenol F-based benzoxazine curing agent and the dicyandiamide curing agent according to a mass ratio of 10:9.
4. The packaging film according to claim 1 , wherein the raw materials of the packaging film comprise:
24 parts by mass of the silicon dioxide, 26 parts by mass of the aliphatic polyurethane acrylate, 15 parts by mass of the phenoxy resin, 5-8 parts by mass of the flexible liquid epoxy resin, 10 parts by mass of the bisphenol F epoxy resin, 19 parts by mass of the curing agent, 2-5 parts by mass of the photoinitiator, and 0.4-0.8 parts by mass of the accelerant; wherein the curing agent is compounded by the bisphenol F-based benzoxazine curing agent and the dicyandiamide curing agent according to a mass ratio of 10:9.
5. The packaging film according to claim 1 , wherein the silicon dioxide is a spherical silicon dioxide micropowder.
6. A preparation method of the packaging film according to claim 1 , comprising:
taking and mixing the raw materials according to parts by mass, grinding mixed raw materials into a gelatinous mass, obtaining a glue solution through a vacuum defoaming, and coating the glue solution to obtain the packaging film.
7. A filter packaging method, comprising using the packaging film according to claim 1 in packaging of a filter chip.
8. The filter packaging method according to claim 7 , wherein the packaging film covers a front and surrounding sides of the filter chip.
9. The packaging film according to claim 2 , wherein the silicon dioxide is a spherical silicon dioxide micropowder.
10. The packaging film according to claim 3 , wherein the silicon dioxide is a spherical silicon dioxide micropowder.
11. The packaging film according to claim 4 , wherein the silicon dioxide is a spherical silicon dioxide micropowder.
12. The preparation method according to claim 6 , wherein in the raw materials of the packaging film, the silicon dioxide is a spherical silicon dioxide micropowder.