Systems and Methods for Shaping Flexible Circuits to Improve Routing and Attachment
A system and method for shaping a flexible circuit (FC) having a set of conductive traces disposed within a set of insulation layers and a shaped FC, each involve using a non-conductive tool defining complimentary first and second tool portions and a shape therebetween, the tool being configured to receive a portion of the FC therebetween the first and second tool portions, a set of conductive heating elements arranged substantially in parallel with each other and disposed within the first and second tool portions, and a power source configured to provide power to the conductive heating elements causing the conductive heating elements to generate heat energy to shape the FC portion without removing any of the FC portion.
1 . A flexible circuit (FC) comprising:
a set of insulation layers; and
a set of conductive circuit traces connected to the set of insulation layers, the set of insulation layers and the set of conductive circuit traces collectively defining a waveform cross-sectional shape of the FC, the waveform cross-sectional shape providing a desired alteration in the flexibility/rigidity of the FC along an axis of the FC.
2 . The FC of claim 1 , wherein the waveform cross-sectional shape is a triangular waveform shape, and wherein the triangular waveform shape increases flexibility or bendability of the FC perpendicular to a length of the FC.
3 . The FC of claim 1 , wherein the waveform cross-sectional shape is a sinusoidal waveform shape, and wherein the sinusoidal waveform shape increases rigidity or stiffness of the FC along a length of the FC.
4 . The FC of claim 1 , wherein the waveform cross-sectional shape defines a plurality of peaks and valleys.
5 . The FC of claim 1 , wherein a portion of a first insulation layer of the set of insulation layers is removed defining a slit therethrough.
6 . The FC of claim 5 , wherein a portion of a second insulation layer of the set of insulation layers is removed, the removed portion of the first insulation layer and the removed portion of the second insulation layer defining the slit.
7 . The FC of claim 6 , wherein the slit does not extend through an entire thickness of the second insulation layer.
8 . The FC of claim 1 , wherein the set of insulation layers includes a first insulation layer, a second insulation layer, and a third insulation layer, and wherein the second insulation layer is disposed between the first insulation layer and the second insulation layer.
9 . The FC of claim 8 , wherein the set of conductive circuit traces is disposed within the second insulation layer.
10 . The FC of claim 1 , wherein:
the set of insulation layers includes a first layer and a second layer;
the first layer comprises a first material; and
the second layer comprises a second material that is different than the first material.
11 . The FC of claim 1 , wherein:
the set of insulation layers includes a first layer and a second layer;
the first layer includes a first material property; and
the second layer includes a second material property that is different than the first material property.
12 . The FC of claim 1 , wherein the set of conductive circuit traces is disposed within the set of insulation layers.
13 . The FC of claim 1 , wherein the set of conductive circuit traces is disposed between the set of insulation layers.
14 . The FC of claim 1 , wherein:
the set of insulation layers and the set of conductive circuit traces collectively define an additional cross-sectional shape of the FC; and
the additional cross-sectional shape is different than the waveform cross-sectional shape.
15 . The PC of claim 14 , wherein:
the set of insulation layers and the set of conductive circuit traces collectively define a third cross-sectional shape of the PC disposed between the additional cross-sectional shape and the waveform cross-sectional shape.
16 . The PC of claim 1 , wherein a portion of the set of insulation layers is removed defining a slit extending partially through the set of insulation layers.