MICRO LED AND MICRO LED DISPLAY PANEL
A micro LED includes a bonding layer provided at a bottom of the micro LED; and two or more light emitting mesas provided on the bonding layer and disposed in a vertical direction from top to bottom, wherein the two or more light emitting mesas are electrically connected in parallel.
1 . A micro LED (light emitting diode), comprising:
a bonding layer provided at a bottom of the micro LED; and
two or more light emitting mesas provided on the bonding layer and disposed in a vertical direction from top to bottom, wherein the two or more light emitting mesas are electrically connected in parallel.
2 . The micro LED according to claim 1 , wherein the two or more light emitting mesas comprises:
a first light emitting mesa provided on the bonding layer and electrically connected to the bonding layer; and
a second light emitting provided above the first light emitting mesa, a bottom of the first light emitting mesa and a bottom of the second light emitting mesa being electrically connected, and a top of the first light emitting mesa and a top of the second light emitting mesa being electrically connected.
3 . The micro LED according to claim 2 , further comprising a bottom connection structure provided at a side of the two or more light emitting mesas and configured to connect the bottom of the first light emitting mesa and the bottom of the second light emitting mesa.
4 . The micro LED according to claim 3 , wherein the second light emitting mesa comprises a bottom connection layer formed at bottom of the second light emitting mesa and extending outwards from the second light emitting mesa to electrically connect to the bottom connection structure; and the bottom connection structure is electrically connected to the bonding layer.
5 . The micro LED according to claim 3 , wherein the first light emitting mesa comprises a first bottom connection layer formed between a bottom of the first light emitting mesa and the bonding layer to electrically connect the bottom of the first light emitting mesa and the bonding layer, the first bottom connection layer extending outwards from the first light emitting mesa to electrically connect to the bottom connection structure, the second light emitting mesa comprises a second bottom connection layer formed at bottom of the second light emitting mesa and extending outwards from the second light emitting mesa to electrically connect to the bottom connection structure.
6 . The micro LED according to claim 3 , wherein a bottom of the bottom connection structure is aligned with a bottom of the bonding layer.
7 . The micro LED according to claim 6 , wherein a top of the bottom connection structure is aligned with a bottom of the second light emitting mesa.
8 . The micro LED according to claim 7 , wherein the bottom connection structure is further configured for light isolation.
9 . The micro LED according to claim 8 , wherein the bottom connection structure surrounds half of a circumference of the micro LED.
10 . The micro LED according to claim 2 , further comprising a top conductive layer formed on a top of the micro LED and electrically connected to the top of the second light emitting mesa and the top of the first light emitting mesa.
11 . The micro LED according to claim 10 , wherein the first light emitting mesa comprises a top connection layer formed on the top of the first light emitting mesa and extending outwards from the first light emitting mesa; and the top conductive layer comprises a sunk portion electrically connected to the top connection layer of the first light emitting mesa.
12 . The micro LED according to claim 10 , wherein the first light emitting mesa comprises a top connection layer formed on the top of the first light emitting mesa and extending outwards from the first light emitting mesa; and the micro LED further comprises a top connection structure electrically connected the top connection layer of the first light emitting mesa and the top conductive layer.
13 . A micro LED (light emitting diode) display panel comprises:
an integrated circuit (IC) backplane comprising a bottom pad array, the bottom pad array comprising a plurality of bottom pads; and
a micro LED array formed on the IC backplane, the micro LED array comprising a plurality of micro LEDs;
wherein one micro LED of the plurality of micro LEDs is electrically connected to one bottom pad of the plurality of bottom pad, and each of the plurality of micro LEDs comprises:
a bonding layer bonded with the IC backplane; and
two or more light emitting mesas provided on the bonding layer and disposed in a vertical direction from top to bottom, wherein the two or more light emitting mesas are electrically connected in parallel.
14 . The micro LED display panel according to claim 13 , wherein the two or more light emitting mesas comprises:
a first light emitting mesa provided on the bonding layer and electrically connected to the bonding layer; and
a second light emitting mesa provided above the first light emitting mesa, a bottom of the first light emitting mesa and a bottom of the second light emitting mesa being electrically connected, and a top of the first light emitting mesa and a top of the second light emitting mesa being electrically connected.
15 . The micro LED display panel according to claim 14 , wherein the micro LED further comprises a top conductive layer formed on a top of each of the plurality of the micro LED and electrically connected to the top of the second light emitting mesa and the top of the first light emitting mesa.
16 . The micro LED display panel according to claim 15 , wherein the top conductive layers of the plurality of micro LEDs are interconnected.
17 . The micro LED display panel according to claim 16 , further comprising an enhance pad provided on the top conductive layer and between adjacent micro LEDs, the enhance pad configured to increase conductivity of the top conductive layer.
18 . The micro LED display panel according to claim 16 , wherein the IC backplane further comprises a top connected pad, and the top conductive layer is connected to the top connected pad of the IC backplane.
19 . The micro LED display panel according to claim 14 , wherein the micro LED further comprises a bottom connection structure provided at a side of the two or more light emitting mesas and configured to connect the bottom of the first light emitting mesa and the bottom of the second light emitting mesa.