LIGHT-EMITTING DEVICE
A semiconductor device includes: a first light-emitting unit and a second light-emitting unit, wherein: the first light-emitting unit includes: a first lower semiconductor stack, including a first sub-sidewall; a first upper semiconductor stack, formed on the first lower semiconductor stack, including a second sub-sidewall; and a first sidewall, including the first sub-sidewall and the second sub-sidewall; wherein the first lower semiconductor stack includes a first upper surface not covered by the first upper semiconductor stack; the second light-emitting unit includes: a second lower semiconductor stack; a second upper semiconductor stack formed on the second lower semiconductor stack; wherein the second lower semiconductor stack includes a second upper surface not covered by the second upper semiconductor stack; a connecting electrode, formed on the first light-emitting unit and the second light-emitting unit and contacting the second upper surface to electrically connect the first light-emitting unit and the second light-emitting unit; and a first contact electrode, formed on the first upper surface and electrically connected to the first lower semiconductor stack, including a fist contact pad; wherein: the first sub-sidewall and the second sub-sidewall are directly connected to form a first slope; and in a top view, the second upper surface surrounds the second upper semiconductor stack.
1 . A semiconductor device, comprising:
a first light-emitting unit and a second light-emitting unit, wherein:
the first light-emitting unit comprises:
a first lower semiconductor stack, comprising a first sub-sidewall;
a first upper semiconductor stack, formed on the first lower semiconductor stack, comprising a second sub-sidewall; and
a first sidewall, comprising the first sub-sidewall and the second sub-sidewall;
wherein the first lower semiconductor stack comprises a first upper surface not covered by the first upper semiconductor stack;
the second light-emitting unit comprises:
a second lower semiconductor stack;
a second upper semiconductor stack formed on the second lower semiconductor stack;
wherein the second lower semiconductor stack comprises a second upper surface not covered by the second upper semiconductor stack;
a connecting electrode, formed on the first light-emitting unit and the second light-emitting unit and contacting the second upper surface to electrically connect the first light-emitting unit and the second light-emitting unit; and
a first contact electrode, formed on the first upper surface and electrically connected to the first lower semiconductor stack, comprising a fist contact pad;
wherein:
the first sub-sidewall and the second sub-sidewall are directly connected to form a first slope; and
in a top view, the second upper surface surrounds the second upper semiconductor stack.
2 . The semiconductor device of claim 1 , further comprising a substrate with an edge, wherein the first light-emitting unit and the second light-emitting unit are separately disposed on the substrate; and the first sidewall is adjacent to the edge of the substrate.
3 . The semiconductor device of claim 2 , wherein the first upper semiconductor stack comprises a first edge, the second upper semiconductor stack comprises a second edge, and the first edge and the second edge are parallel with each other and adjacent to the edge of the substrate; and
wherein in the top view, a distance between the first edge and the edge of the substrate is smaller than a distance between the second edge and the edge of the substrate.
4 . The semiconductor device of claim 1 , further comprising a transparent conductive layer formed on the first upper semiconductor stack;
wherein in the top view, the first upper semiconductor stack comprises a third edge adjacent to the first upper surface and a fourth edge connected to the first sidewall; and
wherein a distance between the transparent conductive layer and the third edge is smaller than a distance between the transparent conductive layer and the fourth edge.
5 . The semiconductor device of claim 1 , further comprising a third light-emitting unit electrically connected to the second light-emitting unit, wherein the third light-emitting unit comprises:
a third lower semiconductor stack, comprising a third sub-sidewall;
a third upper semiconductor stack formed on the third lower semiconductor stack, comprising a fourth sub-sidewall; and
a third sidewall, comprising the third sub-sidewall and the fourth sub-sidewall;
wherein:
the third lower semiconductor stack comprises a third upper surface not covered by the third upper semiconductor stack;
the third sub-sidewall and the fourth sub-sidewall are directly connected to form a second slope; and
the second light-emitting unit is formed between the first light-emitting unit and the third light-emitting unit.
6 . The semiconductor device of claim 5 , further comprising a second contact electrode formed on the third light-emitting unit and electrically connected to the third upper semiconductor stack, wherein the second contact electrode comprises a second contact pad.
7 . The semiconductor device of claim 5 , further comprising a transparent conductive layer formed on the third upper semiconductor stack;
wherein the third upper semiconductor stack comprises a fifth edge adjacent to the third upper surface and a sixth edge connected to the third sidewall; and
wherein a distance between the transparent conductive layer and the fifth edge is smaller than a distance between the transparent conductive layer and the sixth edge.
8 . The semiconductor device of claim 6 , further comprising:
an insulating structure, formed on the first light-emitting unit, the second light-emitting unit and the third light-emitting unit, comprising an opening on the second contact pad; and
a second bonding pad, formed on the insulating structure, filled in the opening and connecting the second contact pad.
9 . The semiconductor device of claim 1 , wherein a difference in areas between the first upper semiconductor stack and the second upper semiconductor stack is less than or equal to 15%.
10 . The semiconductor device of claim 1 , further comprising:
an insulating structure, formed on the first light-emitting unit and the second light-emitting unit, comprising an opening on the first contact pad; and
a first bonding pad, formed on the insulating structure, filled in the opening and connecting the first contact pad.
11 . The semiconductor device of claim 10 , wherein the first contact electrode further comprises a first finger, wherein the first bonding pad does not overlap the first finger.
12 . The semiconductor device of claim 10 , further comprising a second contact electrode formed on the first upper semiconductor stack, wherein the second contact electrode comprises a second finger and the first bonding pad does not overlap the second finger.
13 . The semiconductor device of claim 1 , wherein in the top view, the first light-emitting unit comprises a quadrilateral shape, wherein the quadrilateral shape comprises a first side, a second side, a third side and a fourth side; and
the first sidewall is located on the first side, the second side, the third side and the fourth side.
14 . The semiconductor device of claim 1 , wherein the first slope extends downward from a top surface of the upper semiconductor stack to a bottom surface of the lower semiconductor stack.
15 . The semiconductor device of claim 1 , wherein the first slope is continuous without a turning.
16 . The semiconductor device of claim 1 , wherein the first sub-sidewall and the second sub-sidewall have different slopes, and a difference in slopes between the first sub-sidewall and the second sub-sidewall is not greater than 10%.
17 . The semiconductor device of claim 16 , wherein the first slope comprises a convex curved surface or a concave curved surface
18 . The semiconductor device of claim 1 , wherein the first sidewall faces the second light-emitting unit.
19 . The semiconductor device of claim 1 , wherein in the top view, the second light-emitting unit comprises a quadrilateral shape, wherein the quadrilateral shape comprises a first side, a second side, a third side and a fourth side; and
the second light-emitting unit comprises a second sidewall, and the second sidewall comprises a step shape located on the first side, the second side, the third side and the fourth side.
20 . A semiconductor module, comprising:
the semiconductor device according to claim 1 ;
a carrier; and
a circuit bonding pad, formed on the carrier;
wherein the semiconductor device is bonded to the carrier and electrically connected to the circuit bonding pad.