HEAT DISSIPATION STRUCTURE, VEHICLE-MOUNTED DEVICE, AND TERMINAL DEVICE
Embodiments of this application provide a heat dissipation structure, a vehicle-mounted device, and a terminal device, which are used in the field of heat dissipation technologies. The heat dissipation structure includes a heat sink; a circuit board including at least one chip mounting region and at least one first position located outside the chip mounting region; at least one fixed connection structure located in the at least one first position and fastens the circuit board to the heat sink; and at least one elastic connection structure configured to provide an elastic force toward the heat sink for the chip mounting region.
1 . A heat dissipation structure, comprising:
a heat sink;
a circuit board comprising at least one chip mounting region and at least one first position located outside the chip mounting region;
at least one fixed connection structure located in the at least one first position and fastens the circuit board to the heat sink; and
at least one elastic connection structure configured to provide an elastic force toward the heat sink for the chip mounting region.
2 . The heat dissipation structure according to claim 1 , wherein
the at least one elastic connection structure comprises a fastener and an elastic member;
the circuit board comprises a through hole;
the fastener passes through the through hole and fastens to the heat sink; and
the elastic member is sleeved on the fastener and is elastically connected to the fastener and a surface of the circuit board away from the heat sink.
3 . The heat dissipation structure according to claim 2 , wherein the at least one fixed connection structure is configured to position the circuit board in a horizontal direction.
4 . The heat dissipation structure according to claim 1 , wherein
the at least one elastic connection structure is an elastic body; and
the elastic body is elastically connected between the circuit board and a support body.
5 . The heat dissipation structure according to claim 4 , wherein the support body is located on a side of the circuit board and away from the heat sink.
6 . The heat dissipation structure according to claim 4 , wherein the support body is a housing of the heat dissipation structure.
7 . The heat dissipation structure according to claim 1 , wherein
the circuit board of the heat dissipation structure is connected to a stress-sensitive component;
a distance between the stress-sensitive component and a first fixed connection structure is less than a distance between the stress-sensitive component and an elastic connection structure; and
the first fixed connection structure belongs to the at least one fixed connection structure.
8 . The heat dissipation structure according to claim 1 , wherein
the heat dissipation structure further comprises a board-to-board (BTB) connector and a mainboard;
one end of the BTB connector is connected to the circuit board; and
the other end of the BTB connector is connected to the mainboard.
9 . The heat dissipation structure according to claim 8 , wherein
a distance between the BTB connector and a second fixed connection structure is less than a distance between the BTB connector and an elastic connection structure; and
the second fixed connection structure comprises the at least one fixed connection structure.
10 . The heat dissipation structure according to claim 1 , wherein
a chip mounting region is located in a central region of the circuit board and the first position is located at an edge of the circuit board;
the first position is located between at least two chip mounting regions on the circuit board; or
the chip mounting region is located on one side of the circuit board and the first position is located on another side of the circuit board.
11 . The heat dissipation structure according to claim 1 , wherein
the heat dissipation structure further comprises a support that is fastened to the circuit board;
an elastic force of the at least one elastic connection structure acts on the support; and
the elastic force of the at least one elastic connection structure is provided for the circuit board using the support.
12 . The heat dissipation structure according to claim 1 , wherein the heat dissipation structure is used in at least one of:
an autonomous driving controller;
a cockpit domain controller; or
a vehicle domain controller.
13 . A vehicle-mounted device, comprising a heat dissipation structure, wherein the heat dissipation structure comprises:
a heat sink;
a circuit board comprising at least one chip mounting region and at least one first position located outside the chip mounting region;
at least one chip disposed in at least one chip mounting region on the circuit board;
at least one fixed connection structure located in the at least one first position and fastens the circuit board to the heat sink; and
at least one elastic connection structure configured to provide an elastic force toward the heat sink for the chip mounting region.
14 . The vehicle-mounted device according to claim 13 , wherein the at least one elastic connection structure in the heat sink is configured to maintain a heat conduction connection between the at least one chip and the heat sink in the heat dissipation structure.
15 . The vehicle-mounted device according to claim 13 , wherein the vehicle-mounted device further comprises:
a mainboard;
a plurality of chips, and
at least two heat dissipation structures, wherein
the plurality of chips are mounted in chip mounting regions on the circuit boards in the at least two heat dissipation structures; and
the mainboard is electrically connected to the circuit boards in the plurality of heat dissipation structures.
16 . The vehicle-mounted device according to claim 13 , wherein the vehicle-mounted device is an integrated plate-shaped structure.
17 . The vehicle-mounted device according to claim 13 , wherein the vehicle-mounted device is used in at least one of:
an autonomous driving controller;
a cockpit domain controller; or
a vehicle domain controller.
18 . A terminal device, comprising a heat dissipation structure, wherein the heat dissipation structure comprises:
a heat sink;
a circuit board comprising at least one chip mounting region and at least one first position located outside the chip mounting region;
at least one fixed connection structure located in the at least one first position and fastens the circuit board to the heat sink; and
at least one elastic connection structure configured to provide an elastic force toward the heat sink for the chip mounting region.
19 . The terminal device according to claim 18 , wherein the terminal device is at least one of:
a vehicle;
a robot; or
an uncrewed aerial vehicle.
20 . The terminal device according to claim 18 , wherein
the at least one elastic connection structure comprises a fastener and an elastic member;
the circuit board comprises a through hole;
the fastener passes through the through hole and fastens to the heat sink; and
the elastic member is sleeved on the fastener and is elastically connected to the fastener and a surface of the circuit board away from the heat sink