THREE-DIMENSIONAL (3D) PACKAGES AND METHODS FOR 3D PACKAGING
A three-dimensional (3D) package includes one or more frames, circuit assemblies, and an encapsulating material to encapsulate at least a part of the one or more frames and the circuit assemblies. The one or more frames each include one or more supporting portions and conductive connecting portions extending from the one or more supporting portions and defining assembly mounting spaces therebetween. Circuit assemblies are each mounted in one assembly mounting space and electrically attached to corresponding one or more of the first and second conductive connecting portions.
1 . A three-dimensional (3D) package, comprising:
one or more frames each comprising one or more supporting portions and a plurality of conductive connecting portions extending from the one or more supporting portions and defining assembly mounting spaces therebetween;
a plurality of circuit assemblies each mounted in one of the assembly mounting spaces and electrically attached to corresponding one or more of the conductive connecting portions; and
an encapsulating material to encapsulate at least a part of the one or more frames and the plurality of circuit assemblies.