THERMAL HEAD
A thermal head includes: a heat dissipation plate having a first surface, and a second surface that is on an opposite side to the first surface; a board attached to the heat dissipation plate, the board having a first part located on the first surface, a second part located on the second surface, and an end part connecting the first part and the second part; a heat generating part including a plurality of heating elements, the heat generating part being disposed over the first surface; and at least one surface-mount device mounted on the board over the second surface.
1 . A thermal head comprising:
a heat dissipation plate having a first surface, a second surface that is on a side opposite the first surface, and an end surface connecting the first surface and the second surface;
a board attached to the heat dissipation plate, the board having a first part located on the first surface, a second part located on the second surface, and an end part located on the end surface and connecting the first part and the second part;
a heat generating part comprising a plurality of heating elements, the heat generating part being disposed over the first surface; and
at least one surface-mount device mounted on the board over the second surface.
2 . The thermal head according to claim 1 , wherein the board comprises an opening part at which a portion of the first surface of the heat dissipation plate is exposed.
3 . The thermal head according to claim 2 , wherein the portion of the first surface exposed at the opening part and a surface of the heating part are in substantially a same reference plane.
4 . The thermal head according to claim 1 , further comprising a pair of shafts extending outward from both ends of the heat dissipation plate in a plan view.
5 . The thermal head according to claim 1 , further comprising a plate member attached to the heat dissipation plate, the plate member having a pair of projecting pieces that project in a direction perpendicular to the first surface.
6 . The thermal head according to claim 5 , wherein the plate member comprises a projecting plate extending in a longitudinal direction of the heat dissipation plate, the projecting part projecting in a direction perpendicular to the second surface.
7 . The thermal head according to claim 1 , wherein the surface-mount devices comprise a memory chip, and a connector configured to receive a signal from a circuit board of a printer.
8 . The thermal head according to claim 2 , further comprising a pair of shafts extending outward from both ends of the heat dissipation plate in a plan view.
9 . The thermal head according to claim 3 , further comprising a pair of shafts extending outward from both ends of the heat dissipation plate in a plan view.
10 . The thermal head according to claim 2 , further comprising a plate member attached to the heat dissipation plate, the plate member having a pair of projecting pieces that project in a direction perpendicular to the first surface.
11 . The thermal head according to claim 3 , further comprising a plate member attached to the heat dissipation plate, the plate member having a pair of projecting pieces that project in a direction perpendicular to the first surface.
12 . The thermal head according to claim 4 , further comprising a plate member attached to the heat dissipation plate, the plate member having a pair of projecting pieces that project in a direction perpendicular to the first surface.
13 . The thermal head according to claim 8 , further comprising a plate member attached to the heat dissipation plate, the plate member having a pair of projecting pieces that project in a direction perpendicular to the first surface.
14 . The thermal head according to claim 10 , wherein the plate member comprises a projecting plate extending in a longitudinal direction of the heat dissipation plate, the projecting part projecting in a direction perpendicular to the second surface.
15 . The thermal head according to claim 11 , wherein the plate member comprises a projecting plate extending in a longitudinal direction of the heat dissipation plate, the projecting part projecting in a direction perpendicular to the second surface.
16 . The thermal head according to claim 12 , wherein the plate member comprises a projecting plate extending in a longitudinal direction of the heat dissipation plate, the projecting part projecting in a direction perpendicular to the second surface.
17 . The thermal head according to claim 13 , wherein the plate member comprises a projecting plate extending in a longitudinal direction of the heat dissipation plate, the projecting part projecting in a direction perpendicular to the second surface.