LIGHT-EMITTING DIODES WITH LIGHT COUPLING AND CONVERSION LAYERS
Light-emitting sub-pixels and pixels for micro-light-emitting diode-based displays are provided. Also provided are methods of fabricating individual sub-pixels, pixels, and arrays of the pixels. The sub-pixels include a double-layered film that includes a coupling layer disposed over a light-emitting diode and a light-emission layer disposed over the coupling layer.
1 - 8 . (canceled)
9 . A method, comprising:
forming a first surface energy boundary as a confinement feature over a first light-emitting diode of a substrate;
inkjet printing a first coupling layer comprising scattering particles over the first light-emitting diode;
inkjet printing a red light-emission layer comprising red-emitting particles and scattering particles over the first coupling layer;
forming a second surface energy boundary as a confinement feature over a second light-emitting diode of the substrate;
inkjet printing a second coupling layer comprising scattering particles over the second light-emitting diode; and
inkjet printing a green light-emission layer comprising green-emitting particles and scattering particles over the second coupling layer.
10 . The method of claim 9 , wherein the first coupling layer and the second coupling layer are inkjet printed concurrently.
11 . The method of claim 9 , wherein each of the first light-emitting diode and the second light-emitting diode is a gallium nitride-based light-emitting diode.
12 . The method of claim 9 , wherein each of the first light-emitting diode and the second light-emitting diode is a blue light-emitting diode or an ultraviolet light-emitting diode.
13 . The method of claim 9 , wherein each of the first and the second coupling layers creates a curved interface.
14 . The method of claim 13 , further comprising:
forming a third confinement feature over a third light-emitting diode of the substrate;
inkjet printing a third coupling layer over the third-light emitting diode; and
forming a blue light-emission layer comprising blue-emitting particles and scattering particles over the third coupling layer.
15 . The method of claim 14 , wherein the first coupling layer forms a curved interface with the red light-emission layer, the second coupling layer forms a curved interface with the green light-emission layer, the third coupling layer forms a curved interface with the blue light-emission layer, or a combination thereof.
16 . The method of claim 9 , further comprising inkjet printing a protective layer over the red light-emission layer and the green light-emission layer.
17 . A method of forming a color conversion display device, the method comprising forming a plurality of pixels on a display device substrate using the method of claim 9 .
18 . A method of forming a display, the method comprising:
forming a plurality of pixels on a semiconductor substrate each pixel comprising a red sub-pixel, a green sub-pixel, and a blue sub-pixel, and each pixel formed by:
forming a first light-emitting diode, a second light-emitting diode, and a third light-emitting diode on the semiconductor substrate;
forming a first surface energy boundary as a confinement feature over the first light-emitting diode and a second surface energy boundary as a confinement feature over the second light-emitting diode;
inkjet printing a red light emission layer comprising red-emitting particles and scattering particles over the first light-emitting diode to provide the red sub-pixel;
inkjet printing a green light emission layer comprising green-emitting particles and scattering particles over the second light-emitting diode to provide the green sub-pixel; and
inkjet printing a blue light emission layer comprising blue light-emitting particles and scattering particles over the third light-emitting diode to provide the blue sub-pixel.
19 . The method of claim 18 , wherein each of the first, second, and third light-emitting diodes is a gallium nitride-based light-emitting diode.
20 . The method of claim 18 , wherein the green sub-pixels have emission surface areas that are larger than emission surface areas of the red sub-pixels and the emission surface areas of the blue sub-pixels.
21 . The method of claim 18 , wherein further comprising inkjet printing a coupling layer between each light-emitting diode and corresponding light emission layer, wherein each coupling layer has a refractive index less than or equal to a refractive index of the corresponding light-emitting diode.
22 . A method, comprising:
forming a first surface energy boundary as a confinement feature over a first light-emitting diode of a substrate;
inkjet printing a first coupling layer over the first light-emitting diode;
forming a red light emission layer comprising red-emitting quantum dots and scattering particles over the first coupling layer, the red-emitting quantum dots having a graded concentration in at least a portion of the red light-emission layer;
forming a second surface energy boundary as a confinement feature over a second light-emitting diode of the substrate;
inkjet printing a second coupling layer over the second light-emitting diode; and
forming a green light emission layer comprising green-emitting quantum dots and scattering particles over the second coupling layer, the green-emitting quantum dots having a graded concentration in at least a portion of the green light-emission layer.
23 . The method of claim 22 , wherein at least one of the red light emission layer and the green light emission layer is formed using inkjet printing.
24 . The method of claim 22 , wherein each of the first light-emitting diode and the second light-emitting diode is a gallium nitride-based light-emitting diode.
25 . The method of claim 22 , wherein each of the first light-emitting diode and the second light-emitting diode is a blue light-emitting diode or an ultraviolet light-emitting diode.
26 . The method of claim 25 , further comprising:
forming a third confinement feature over the third light-emitting diode; and
forming a blue light-emission layer comprising scattering particles over the third light-emitting diode.
27 . The method of claim 22 , further comprising forming a protective layer over the red light-emission layer and the green light-emission layer.
28 . The method of claim 26 , wherein each of the first and second coupling layers forms a curved interface with the corresponding light-emitting diode.