DISPLAY DEVICE
A substrate assembly includes: a substrate; a first transistor disposed on the substrate, wherein the first transistor includes a first semiconductor layer; and a second transistor disposed on the substrate, wherein the second transistor includes a second semiconductor layer and a drain electrode electrically connected to the second semiconductor layer, and a material of the first semiconductor layer is different from a material of the second semiconductor layer, wherein the first semiconductor layer of the first transistor is electrically insulated from the drain electrode of the second transistor.
1 . A substrate assembly, comprising:
a substrate;
a first transistor disposed on the substrate, wherein the first transistor comprises a first semiconductor layer; and
a second transistor disposed on the substrate, wherein the second transistor comprises a second semiconductor layer and a drain electrode electrically connected to the second semiconductor layer, and a material of the first semiconductor layer is different from a material of the second semiconductor layer,
wherein the first semiconductor layer of the first transistor is electrically insulated from the drain electrode of the second transistor.
2 . The substrate assembly of claim 1 , wherein the substrate comprises a peripheral region and an active region, and the peripheral region is adjacent to the active region.
3 . The substrate assembly of claim 2 , wherein the first transistor is disposed on the peripheral region, and the second transistor is disposed on the active region.
4 . The substrate assembly of claim 1 , wherein the second transistor further comprises a gate electrode disposed on the second semiconductor layer.
5 . The substrate assembly of claim 4 , wherein the first semiconductor layer of the first transistor is electrically connected to the gate electrode of the second transistor.
6 . The substrate assembly of claim 1 , wherein the drain electrode of the second transistor comprises a first layer, a second layer and a third layer, and the second layer is disposed between the first layer and the third layer.
7 . The substrate assembly of claim 6 , wherein the first layer contacts the second semiconductor layer.
8 . The substrate assembly of claim 6 , wherein a material of the first layer comprises Ti.
9 . The substrate assembly of claim 6 , wherein a material of the second layer comprises Al.
10 . The substrate assembly of claim 6 , wherein a material of the third layer comprises Ti.
11 . The substrate assembly of claim 1 , wherein the second transistor further comprises a gate electrode disposed on the second semiconductor layer, the first transistor further comprises another drain electrode electrically connected to the first semiconductor layer, and the another drain electrode of the first transistor is electrically connected to the gate electrode of the second transistor.
12 . The substrate assembly of claim 1 , further comprising a first insulating layer disposed under the first semiconductor layer, wherein the first insulating layer comprises silicon oxide.
13 . The substrate assembly of claim 12 , further comprising a first buffer layer disposed between the substrate and the first insulating layer, wherein the first buffer layer comprises silicon oxide.