PRESSURE SENSING IMPLANT
Disclosed is an implant and method of making an implant. The implant having a housing that defines a cavity. The housing includes a sensor comprising a base attached to a diaphragm wherein said base may be positioned within said cavity. The sensor may be a capacitive pressure sensor. The diaphragm may be connected to the housing to hermetically seal said housing. The sensor may include electrical contacts positioned on the diaphragm. The base may define a capacitive gap and a vent wherein the electrodes may be positioned within said capacitive gap such that at least a portion of the electrical contacts extend through the vent. The implant may include a coil in electric communication with the sensor, said coil may be positioned within said housing. A printed circuit board having at least one component may be attached to the floating base.
1 . A method of assembling an implant comprising:
forming a housing that defines a cavity;
positioning a base in proximity to a diaphragm to form a sensor;
attaching said diaphragm to said housing such that said base is positioned within said cavity;
attaching a coil to said sensor;
forming a hermetic seal about the cavity; and
transmitting energy through the housing to inside the cavity to adjust implant parameters after forming said hermetic seal.
2 . The method of claim 1 , wherein the step of forming said housing is selected from: welding a plurality of side walls together, or machining said housing from a single material.
3 . The method of claim 1 , wherein said base is made of a different material than said diaphragm.
4 . The method of claim 1 , wherein said diaphragm is hermetically attached to said housing by at least one laser weld about the perimeter of said cavity.
5 . The method of claim 1 , wherein said implant parameters are adjusted by at least one of: ablating portions of electrodes on said sensor; ablating portions of a capacitor; ablating portions of tracks on a substrate; curing an adhesive; curing a coating; modifying an optically sensitive chemical; modifying a thermally sensitive chemical; attaching items by welding; separating items by cutting; ablating a coating, film, or structure; sterilizing the interior of said housing; opening a fuse; and causing solder to reflow.
6 . A method of assembling an implant comprising:
providing a housing from a continuous material that defines a cavity having a base with a top side and a bottom side;
attaching a diaphragm to said housing such that a capacitive gap is formed between said diaphragm and said top side of said base to form a sensor;
inserting a coil into said cavity adjacent to said bottom side of said integral base; and
attaching a bottom wall to the housing to form a hermetic seal about said cavity.
7 . The method of claim 6 , further comprising at least one of the following steps: providing a through hole through said base; electrically connecting said coil to said sensor through said through hole; and connecting said coil to said base with at least one through substrate via (TSV).
8 . The method of claim 6 , further comprising transmitting energy through the housing to inside the cavity to adjust implant parameters after forming said hermetic seal.
9 . A method of assembling a wireless implant comprising:
providing a housing that defines a cavity;
attaching a diaphragm to the housing;
positioning a base entirely within the cavity;
forming a capacitive gap between the diaphragm and a top side of the base to form a sensor;
hermetically sealing the cavity of the housing; and
transmitting energy through the housing to inside the cavity to modify at least a part of an adjustable implant component's adjustable parameter after hermetically sealing the cavity of the housing.
10 . The method of claim 9 further comprising inserting a coil into the cavity adjacent to a bottom side of the base.
11 . The method of claim 9 , wherein the step of hermetically sealing the cavity of the housing comprises attaching a bottom wall to the housing.
12 . The method of claim 9 , wherein the housing is formed from a single material.
13 . The method of claim 9 , wherein the base is made of a different material than the diaphragm.
14 . The method of claim 9 , wherein the diaphragm is attached to the housing by at least one laser weld about a perimeter of the cavity.
15 . The method of claim 9 , wherein the adjustable parameters are adjusted by ablating portions of electrodes on the sensor.
16 . The method of claim 9 , wherein the adjustable parameters are adjusted by ablating portions of a capacitor.
17 . The method of claim 9 , wherein the adjustable parameters are adjusted by ablating portions of tracks on a substrate.
18 . The method of claim 9 , wherein the adjustable parameters are adjusted by curing an adhesive.
19 . The method of claim 9 , wherein the adjustable parameters are adjusted by curing a coating.
20 . The method of claim 9 , wherein the adjustable parameters are adjusted by modifying an optically sensitive chemical.
21 . The method of claim 9 , wherein the adjustable parameters are adjusted by modifying a thermally sensitive chemical.
22 . The method of claim 9 , wherein the adjustable parameters are adjusted by ablating a coating, film, or structure.
23 . The method of claim 9 , wherein the adjustable parameters are adjusted by sterilizing the cavity of the housing.
24 . The method of claim 9 , wherein the adjustable parameters are adjusted by opening a fuse.
25 . The method of claim 9 , wherein the adjustable parameters are adjusted by causing solder to reflow.